摘要:
A method is provided for making a rigid spacer, containing a silicone bound desiccant which is useful for a multi-pane sealed window. An infrared radiation curable silicone is used as a binder for a desiccant such as a zeolite which is injected in a continuous manner into a U-shaped or V-shaped semi-rigid spacer such as a steel channel.
摘要:
There is provided an infrared radiation curable organopolysiloxane composition having a poly(alkenylorganosiloxane), a siloxane hydride, an infrared radiation absorbent material, such as carbon black, and an effective amount of a platinum group metal catalyst. The infrared radiation curable organopolysiloxane composition can be used as a binder for a desiccant, such as a zeolite, useful in making multi-panel thermal pane windows.
摘要:
Silicone foams are prepared by microwave curing of a mixture of at least one polyorganosiloxane having vinyl groups attached to silicon; at least one hydride polysiloxane; a blowing agent comprising water and, preferably, at least one monohydroxyaliphatic compound, a cyclodextrin inclusion compound of a platinum group metal coordination complex (preferably with a cyclic diene) and a filler. The use of the inclusion compound as a catalyst increases the shelf life of the composition, whereupon curing and foaming occur together upon exposure to microwave radiation.
摘要:
A current limiting device utilizing an electrically conductive composite material and an inhomogeneous distribution of resistance structure is disclosed. The inhomogeneous distribution is typically chosen so that at least one selected thin layer of the current limiting device has much higher resistance than the rest of the current limiting device. In the actual device, pressure is typically exerted on the composite material in a direction normal to the selected thin layer. During a short-circuit, it is believed that adiabatic resistive heating of this selected thin layer is followed by rapid thermal expansion which leads to either a partial or complete physical separation of the current limiting device at the selected thin layer which produces a higher over-all device resistance to electric current flow. Thus the current limiting device limits the flow of current through the short-circuited current path. When the short-circuit is cleared, the current limiting device regains its low resistance state allowing electrical current to flow normally. The current limiting of the present invention is reusable for many such short circuit conditions.
摘要:
A solid state process for the bulk conversion of a dense polycrystalline ceramic body to a single crystal body has been accomplished by heating the polycrystalline material to a temperature above one-half of the melting temperature of the material but below the melting point of the material. As the process is a solid state process, no melting of the ceramic body is necessary to convert it to a single crystal. The process has been used to convert a dense polycrystalline alumina body (PCA) containing less than 100 wppm of magnesia to sapphire (single crystal alumina) by heating the PCA to temperatures above 1100.degree. C. but below 2050.degree. C., the melting point of alumina.
摘要:
Solderable, largely base metal electrodes for metal oxide varistors are fabricated by screen printing an electrically conductive, air-fireable base metal composition on a varistor material substrate. A distributed fine noble metal array is screen printed over the screened base metal and the varistor heated in air at a temperature of between approximately 500.degree. C. and 800.degree. C. The varistor leads are easily solderable to the noble metal array.
摘要:
A molded case circuit breaker and current suppressing unit protects an electric motor without tripping during motor current reversal. The circuit breaker trip unit provides long time, short time and instantaneous over current protection against abnormal overload and low-current short circuit currents within the protected circuit. The current suppressing unit rapidly suppresses high-current short circuit currents until the circuit breaker responds to isolate the protected equipment.
摘要:
A circuit breaker is equipped with a current limiting arc runner for effective overcurrent interruption without additional heating under quiescent operating conditions. Upon contact separation, an arc is drawn with the endpoints of the arc being initially rooted on the set of open contacts. Further opening of the contacts commutates the arc onto the current limiting arc runner to suppress the circuit current.
摘要:
A solid state method of converting a polycrystalline ceramic body to a single crystal body includes the steps of doping the polycrystalline ceramic material with a conversion-enhancing dopant and then heating the polycrystalline body at a selected temperature for a selected time sufficient to convert the polycrystalline body to a single crystal. The selected temperature is less than the melting temperature of the polycrystalline material and greater than about one-half the melting temperature of the material. In the conversion of polycrystalline alumina to single crystal alumina (sapphire), examples of conversion-enhancing dopants include cations having a +3 valence, such as chromium, gallium, and titanium. The polycrystalline body further can be inhomogeneously doped to form a first portion of the polycrystalline body that is doped to the selected level of the conversion-enhancing dopant and a second portion that is not doped such that heating the doped polycrystalline body causes conversion of first portion to a single crystal structure and the second portion retains a polycrystalline structure.
摘要:
A package for interconnecting a plurality of integrated circuit chips into a functional unit comprising a multilayer substrate having ground and power conducting layers and a frame for holding the chips with their terminal pads on the side of the frame opposite the substrate. Power and ground terminal pads on the chips are coupled to the appropriate potentials via registering conductive feedthroughs passing through the frame and into the substrate into contact with appropriate power or conductive layers in the substrate. Signal pads on the chips are interconnected by means of a conductive layer which is located over the chips on the side of the frame opposite the substrate.