公开(公告)号：US20060025049A1

公开(公告)日：2006-02-02

申请号：US11115634

申请日：2005-04-27

申请人： Lizhong Sun ,  Lei Zhu ,  Gary Lam ,  Robert Jackson ,  Wei-Yung Hsu

发明人： Lizhong Sun ,  Lei Zhu ,  Gary Lam ,  Robert Jackson ,  Wei-Yung Hsu

IPC分类号： B24B51/00

CPC分类号： B24B37/04 ,  B24B57/02

摘要： Methods and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one aspect, the apparatus comprises a vertical arm having a delivery portion located proximate to a circumference of a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a first adjustable droplet size, and at least a second nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a second adjustable droplet size. In another aspect of the invention, the apparatus comprises a horizontal arm having a delivery portion disposed at least partially over a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a first adjustable droplet size across a first region of the polishing surface, and at least a second nozzle disposed horizontally spaced from the first nozzle on the delivery portion, and adapted to dispense the polishing fluid with a second adjustable droplet size across a second region of the polishing surface.

摘要翻译： 提供了将抛光液输送到化学机械抛光表面的方法和设备。 一方面，该装置包括垂直臂，其具有位于抛光表面的圆周附近的输送部分，设置在输送部分上并适于以第一可调液滴尺寸分配抛光流体的第一喷嘴，以及至少一 第二喷嘴，其布置在输送部分上并且适于以第二可调液滴尺寸分配抛光流体。 在本发明的另一方面，该装置包括水平臂，其具有至少部分地设置在抛光表面上的输送部分，设置在输送部分上的第一喷嘴，并且适于以第一可调液滴大小分配抛光流体， 抛光表面的区域，以及至少第二喷嘴，其在输送部分上与第一喷嘴水平间隔设置，并且适于在抛光表面的第二区域上分配具有第二可调液滴尺寸的抛光流体。

公开(公告)号：US07244168B2

公开(公告)日：2007-07-17

申请号：US11393278

申请日：2006-03-30

申请人： Yufei Chen ,  Lizhong Sun ,  Doohan Lee ,  Wei-Yung Hsu

发明人： Yufei Chen ,  Lizhong Sun ,  Doohan Lee ,  Wei-Yung Hsu

IPC分类号： B24B49/00 ,  B24B1/00

CPC分类号： B24B37/042 ,  B24B49/006 ,  H01L21/02074 ,  H01L21/3212 ,  Y02P70/605

摘要： Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.

摘要翻译： 提供了用于抛光衬底的方法和装置，其包括具有降低或最小衬底表面损伤和分层的导电和低k电介质材料。 一方面，提供了一种处理衬底的方法，包括在具有旋转载体头和可旋转压板的抛光装置中定位其上具有导电材料的衬底，其中衬底设置在旋转载体头部中，并且压板具有 设置在其上的抛光制品，以第一载体头旋转速率旋转第一载体头并以第一压板旋转速率旋转压板，使基板和抛光制品接触，将第一载体头旋转速率加速到第二载体头旋转 速度并将第一压板转速加速到第二压板旋转速率，并以第二承载头转速和第二压板旋转速率抛光衬底。

公开(公告)号：US20060172664A1

公开(公告)日：2006-08-03

申请号：US11393278

申请日：2006-03-30

申请人： Yufei Chen ,  Lizhong Sun ,  Doohan Lee ,  Wei-Yung Hsu

发明人： Yufei Chen ,  Lizhong Sun ,  Doohan Lee ,  Wei-Yung Hsu

IPC分类号： B24B51/00 ,  B24B7/30 ,  B24B1/00

CPC分类号： B24B37/042 ,  B24B49/006 ,  H01L21/02074 ,  H01L21/3212 ,  Y02P70/605

摘要： Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.

公开(公告)号：US06677239B2

公开(公告)日：2004-01-13

申请号：US09939112

申请日：2001-08-24

申请人： Wei-Yung Hsu ,  Gopalakrishna B. Prabhu ,  Lizhong Sun ,  Daniel A. Carl

发明人： Wei-Yung Hsu ,  Gopalakrishna B. Prabhu ,  Lizhong Sun ,  Daniel A. Carl

IPC分类号： H01L2100

CPC分类号： C09K3/1463 ,  B24B37/044 ,  C09G1/02 ,  C09G1/04 ,  H01L21/31053 ,  H01L21/76229

摘要： Methods and apparatus are provided for planarizing substrate surfaces with selective removal rates and low dishing. One aspect of the method provides for processing a substrate including providing a substrate to a polishing platen having polishing media disposed thereon, providing an abrasive free polishing composition comprising one or more surfactants to the substrate surface to modify the removal rates of the at least the first dielectric material and the second dielectric material, polishing the substrate surface, and removing the second material at a higher removal rate than the first material from a substrate surface. One aspect of the apparatus provides a system for processing substrates including a platen adapted for polishing the substrate with polishing media and a computer based controller configured to perform one aspect of the method.

摘要翻译： 提供了用于平坦化基板表面的方法和装置，具有选择性的移除速率和低凹陷。 该方法的一个方面提供了一种处理衬底，其包括将衬底提供到其上布置有抛光介质的抛光平台上，提供了一种无研磨抛光组合物，其包含一个或多个表面活性剂至衬底表面，以改变至少第一 电介质材料和第二介电材料，抛光衬底表面，并且以比来自衬底表面的第一材料更高的去除速率去除第二材料。 该装置的一个方面提供了一种用于处理衬底的系统，其包括适于用抛光介质抛光衬底的压板和被配置为执行该方法的一个方面的基于计算机的控制器。

公开(公告)号：US07037174B2

公开(公告)日：2006-05-02

申请号：US10678906

申请日：2003-10-03

申请人： Yufei Chen ,  Lizhong Sun ,  Doohan Lee ,  Wei-Yung Hsu

发明人： Yufei Chen ,  Lizhong Sun ,  Doohan Lee ,  Wei-Yung Hsu

IPC分类号： B49D1/00

CPC分类号： B24B37/042 ,  B24B49/006 ,  H01L21/02074 ,  H01L21/3212 ,  Y02P70/605

摘要： Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.

摘要翻译： 提供了用于抛光衬底的方法和装置，其包括具有降低或最小衬底表面损伤和分层的导电和低k电介质材料。 一方面，提供了一种处理衬底的方法，包括在具有旋转载体头和可旋转压板的抛光装置中定位其上具有导电材料的衬底，其中衬底设置在旋转载体头部中，并且压板具有 设置在其上的抛光制品，以第一载体头旋转速率旋转第一载体头并以第一压板旋转速率旋转压板，使基板和抛光制品接触，将第一载体头旋转速率加速到第二载体头旋转 速度并将第一压板转速加速到第二压板旋转速率，并以第二承载头转速和第二压板旋转速率抛光衬底。

公开(公告)号：US20120234238A1

公开(公告)日：2012-09-20

申请号：US13419121

申请日：2012-03-13

申请人： Wei-Yung Hsu ,  Hua Chung ,  Ting-Ruei Shiu ,  Jie Cui

发明人： Wei-Yung Hsu ,  Hua Chung ,  Ting-Ruei Shiu ,  Jie Cui

IPC分类号： C23C16/52 ,  G01N3/00

CPC分类号： G01N3/20 ,  G01N3/068 ,  G01N3/12 ,  G01N2203/0282 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67207 ,  H01L21/67288 ,  H01L21/67754 ,  H01L21/68764 ,  H01L21/68771

摘要： Integrated wafer or substrate bow measurement modules are described. For example, a multi-chamber system includes a chamber housing a bow measurement module. In another example, a method of pre-screening a wafer includes inserting a wafer or a substrate into a multi-chamber system. A bow parameter of the wafer or the substrate is measured in a bow measurement module housed in a chamber of the multi-chamber system.

摘要翻译： 描述了集成的晶片或衬底弓测量模块。 例如，多室系统包括容纳弓测量模块的腔室。 在另一示例中，预筛选晶片的方法包括将晶片或基板插入多室系统中。 在容纳在多室系统的室中的弓测量模块中测量晶片或基板的弓形参数。

公开(公告)号：US20110253685A1

公开(公告)日：2011-10-20

申请号：US13076422

申请日：2011-03-30

申请人： Wei-Yung Hsu ,  Antoine P. Manens

发明人： Wei-Yung Hsu ,  Antoine P. Manens

IPC分类号： B23K26/00

CPC分类号： B23K26/046 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50

摘要： Systems for scribing a workpiece incorporate a motorized beam expander to change a laser beam spot size incident on a workpiece. A system includes a frame, a laser coupled with the frame and generating an output to remove material from at least a portion of a workpiece, a beam expander positioned along a path of the laser output and having a motorized mechanism operable to vary a beam expansion ratio applied to the laser output, and at least one scanning device coupled with the frame and operable to control a position of the laser output, after expansion, on the workpiece. The motorized beam expander can be used to selectively vary the width of a laser beam supplied to a scanning device so as to selectively vary the size of the laser beam incident on the workpiece. Alternatively, a variable aperture can be used instead of a beam expander.

摘要翻译： 用于对工件进行划线的系统包括电动束扩张器以改变入射在工件上的激光束斑点尺寸。 一种系统包括框架，激光器与框架耦合并且产生输出以从工件的至少一部分移除材料;沿着激光输出路径定位的光束扩展器，并具有可操作以改变光束膨胀的电动机构 以及至少一个与框架耦合的扫描装置，并可操作以控制激光输出在膨胀之后在工件上的位置。 电动光束扩展器可以用于选择性地改变提供给扫描装置的激光束的宽度，以便选择性地改变入射在工件上的激光束的尺寸。 或者，可以使用可变光圈来代替光束扩展器。

公开(公告)号：US20110198322A1

公开(公告)日：2011-08-18

申请号：US12851471

申请日：2010-08-05

申请人： Antoine P. Manens ,  Ting-Ruei Shiu ,  Bassam Shamoun ,  Wei-Yung Hsu ,  Manivannan Thothadri

发明人： Antoine P. Manens ,  Ting-Ruei Shiu ,  Bassam Shamoun ,  Wei-Yung Hsu ,  Manivannan Thothadri

IPC分类号： B23K26/00 ,  G01J1/42 ,  H04N7/18

CPC分类号： B23K26/048 ,  B23K26/032 ,  B23K26/0673 ,  B23K26/082 ,  B23K26/083 ,  B23K26/364 ,  B23K26/40 ,  B23K26/705 ,  B23K2103/172 ,  H01L31/046 ,  H01L31/0463 ,  Y02E10/50

摘要： In-line metrology methods and systems for use with laser-scribing systems used in solar-cell fabrication are disclosed. Such methods and systems can involve a variety of components, for example, a device for measuring the amount of power input to a laser, a power meter for measuring laser output power, a beam viewer for measuring aspects of a laser beam, a height sensor for measuring a workpiece height, a microscope for measuring workpiece features formed by the laser-scribing system, and a system for monitoring a laser-scribing system and annunciating a warning(s) and/or an error message(s) when operational limits are exceeded. In-line metrology methods can also include the processing of output beam reflections so as to track beam drift over time and/or provide for focusing of an imaging device.

摘要翻译： 公开了用于太阳能电池制造中使用的激光划线系统的在线测量方法和系统。 这样的方法和系统可以涉及各种部件，例如，用于测量激光输入功率的装置，用于测量激光输出功率的功率计，用于测量激光束的方面的光束观察器，高度传感器 用于测量工件高度的显微镜，用于测量由激光划线系统形成的工件特征的显微镜，以及用于监视激光划线系统的系统，并且当操作限度为...时，发出警告和/或错误消息 超过了 在线测量方法还可以包括输出光束反射的处理，以便随时间跟踪光束漂移和/或提供成像装置的聚焦。

公开(公告)号：US20100252543A1

公开(公告)日：2010-10-07

申请号：US12621316

申请日：2009-11-18

申请人： Antoine P. Manens ,  Wei-Yung Hsu

发明人： Antoine P. Manens ,  Wei-Yung Hsu

IPC分类号： B23K26/00

CPC分类号： B23K26/082 ,  B23K26/702

摘要： The present disclosure relates to apparatuses and systems for laser scribing a vertically-oriented workpiece. In many embodiments, a laser-scribing apparatus includes a frame, a first fixture coupled with the frame, a second fixture coupled with the frame, a laser operable to generate output able to remove material from at least a portion of the workpiece, and a scanning device coupled with the laser and the frame. The first fixture is configured for engagement with a first portion of the workpiece. The second fixture is configured for engagement with a second portion of the workpiece. When the workpiece is engaged by the first and second fixtures the workpiece is substantially vertically oriented. The scanning device is operable to control a position of the output from the laser relative to the workpiece.

摘要翻译： 本公开涉及用于激光划线垂直取向的工件的装置和系统。 在许多实施例中，激光划线设备包括框架，与框架连接的第一固定件，与框架连接的第二固定件，可操作以产生能够从工件的至少一部分移除材料的激光器，以及 与激光和框架耦合的扫描装置。 第一夹具构造成与工件的第一部分接合。 第二夹具被构造成与工件的第二部分接合。 当工件被第一和第二固定件接合时，工件基本上垂直定向。 扫描装置可操作以控制来自激光器的输出相对于工件的位置。

公开(公告)号：US20090038642A1

公开(公告)日：2009-02-12

申请号：US12249922

申请日：2008-10-11

申请人： Wei-Yung Hsu ,  Donald J.K. Olgado ,  Ho Seon Shin ,  Liang-Yuh Chen

发明人： Wei-Yung Hsu ,  Donald J.K. Olgado ,  Ho Seon Shin ,  Liang-Yuh Chen

IPC分类号： B08B1/04

CPC分类号： H01L21/67046 ,  B08B1/04 ,  H01L21/67028

摘要： In one aspect, a method for cleaning an edge of a substrate is provided. The method comprises employing one or more rollers of a first diameter to rotate a substrate; contacting an edge of the substrate with one or more rollers of a second diameter that is larger than the first diameter; and cleaning the edge of the substrate using the one or more rollers of the second diameter. Numerous other aspects are provided.

摘要翻译： 一方面，提供一种清洗基板的边缘的方法。 该方法包括采用一个或多个第一直径的辊来旋转衬底; 使所述基板的边缘与大于所述第一直径的第二直径的一个或多个辊接触; 以及使用所述第二直径的所述一个或多个辊清洁所述基板的边缘。 提供了许多其他方面。