公开(公告)号：US20210194322A1

公开(公告)日：2021-06-24

申请号：US16876156

申请日：2020-05-18

申请人： Long-Wen CHEN ,  Hsin-Yu CHEN ,  Ping-Han CHEN

发明人： Long-Wen CHEN ,  Hsin-Yu CHEN ,  Ping-Han CHEN

IPC分类号： H02K7/18 ,  F16H25/20 ,  F16H37/12 ,  F16H1/20 ,  H02K7/06 ,  H02K7/116 ,  H02K11/00 ,  H02K11/21 ,  H02K49/10

摘要： An mechanical energy harvesting system includes a base seat unit, a rotating shaft device, and a driving device. The base seat unit includes first and second seat bodies. The rotating shaft device is rotatably mounted to the first seat body. The driving device is disposed on the base seat unit and includes at least one driving unit sleeved on the rotating shaft device for driving the rotating shaft device to rotate and thus generate rotational kinetic energy, and at least one transmission unit connected between the second seat body and the driving unit and configured to drive the rotating shaft device to rotate when the second seat body swings relative to the first seat body, so as to generate the rotational kinetic energy.

公开(公告)号：US20130256843A1

公开(公告)日：2013-10-03

申请号：US13438007

申请日：2012-04-03

申请人： Hsin-Yu CHEN ,  Home-Been Cheng ,  Ching-Li Yang

发明人： Hsin-Yu CHEN ,  Home-Been Cheng ,  Ching-Li Yang

IPC分类号： H01L29/02 ,  H01L21/78

CPC分类号： H01L21/78

摘要： A wafer sawing method comprises steps as follows: A wafer having a first surface and a second surface is firstly provided. An integrated circuit fabricating process is performed on the first surface of the wafer to define a first integrated circuit region and a periphery region surrounding around the first integrated circuit region, wherein the integrated circuit fabricating process includes an etching process used to form a first deep trench having an aspect ratio larger than 10 as well as a depth substantially ranging from one-third to two-third thickness of the wafer on the periphery region. Subsequently, an adhesive tape is disposed on the first surface at least covering the first integrated circuit region and the periphery region. A tensile stress is then imposed on the adhesive tape in order to make the wafer broken off along the first deep trench.

摘要翻译： 晶片锯切方法包括以下步骤：首先提供具有第一表面和第二表面的晶片。 在晶片的第一表面上执行集成电路制造工艺以限定围绕第一集成电路区域的第一集成电路区域和周边区域，其中集成电路制造工艺包括用于形成第一深沟槽的蚀刻工艺 具有大于10的长宽比以及在周边区域上的晶片的三分之一至三分之二厚度的深度。 随后，粘合带设置在第一表面上，至少覆盖第一集成电路区域和周边区域。 然后对粘合带施加拉伸应力，以使晶片沿第一深沟槽断裂。

公开(公告)号：US20120217611A1

公开(公告)日：2012-08-30

申请号：US13033733

申请日：2011-02-24

申请人： Yuan-Hung LIU ,  Ku-Feng YANG ,  Pei-Ching KUO ,  Ming-Tsu CHUNG ,  Hsin-Yu CHEN ,  Tsang-Jiuh WU ,  Wen-Chih CHIOU

发明人： Yuan-Hung LIU ,  Ku-Feng YANG ,  Pei-Ching KUO ,  Ming-Tsu CHUNG ,  Hsin-Yu CHEN ,  Tsang-Jiuh WU ,  Wen-Chih CHIOU

IPC分类号： H01L23/48 ,  H01L21/28

CPC分类号： H01L21/76898 ,  H01L21/2855 ,  H01L21/28556 ,  H01L21/7682 ,  H01L21/76831 ,  H01L21/7684 ,  H01L21/76879 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2225/06541 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00

摘要： An integrated circuit includes a substrate having a first surface and a second surface. At least one conductive structure continuously extends through the substrate. At least one sidewall of the at least one conductive structure is spaced from a sidewall of the substrate by an air gap.

摘要翻译： 集成电路包括具有第一表面和第二表面的基板。 至少一个导电结构连续地延伸穿过衬底。 所述至少一个导电结构的至少一个侧壁通过气隙与衬底的侧壁间隔开。

公开(公告)号：US20120319291A1

公开(公告)日：2012-12-20

申请号：US13161153

申请日：2011-06-15

申请人： Wen-Chih CHIOU ,  Tsang-Jiuh WU ,  Ku-Feng YANG ,  Hsin-Yu CHEN

发明人： Wen-Chih CHIOU ,  Tsang-Jiuh WU ,  Ku-Feng YANG ,  Hsin-Yu CHEN

IPC分类号： H01L23/48 ,  H01L21/28

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L23/53223 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor structure includes a dielectric layer disposed over a substrate. A metallic line is disposed in the dielectric layer. A through-silicon-via (TSV) structure continuously extends through the dielectric layer and the substrate. A surface of the metallic line is substantially leveled with a surface of the TSV structure.

摘要翻译： 半导体结构包括设置在基板上的电介质层。 金属线设置在电介质层中。 贯穿硅通孔（TSV）结构连续地延伸穿过电介质层和衬底。 金属线的表面基本上与TSV结构的表面平齐。

公开(公告)号：US20120161044A1

公开(公告)日：2012-06-28

申请号：US12980121

申请日：2010-12-28

申请人： Hsin-Yu CHEN

发明人： Hsin-Yu CHEN

IPC分类号： F16K7/17 ,  F16K31/145 ,  F16K31/126

CPC分类号： B65D81/2038

摘要： A vacuum valve installed on an opening of a sealed container includes an air-resistance membrane, a valve and at least one airflow passage. The valve is latched on the opening. The airflow passage runs through the valve and communicates with the sealed container. The air-resistance membrane is mounted onto the valve and has an annular flange to surround and seal the airflow passage. The protrusive annular flange is deformable to form an airtight structure to maintain a vacuum condition in the sealed container for a prolonged duration to meet use requirements.

摘要翻译： 安装在密封容器的开口上的真空阀包括耐气膜，阀和至少一个气流通道。 阀被锁在开口上。 气流通过阀门并与密封容器连通。 空气阻挡膜安装在阀上，并具有围绕和密封气流通道的环形凸缘。 突出的环形凸缘可变形以形成气密结构，以将密封容器中的真空状态保持长时间以满足使用要求。

公开(公告)号：US20130076986A1

公开(公告)日：2013-03-28

申请号：US13241889

申请日：2011-09-23

申请人： Hsin-Yu CHEN

发明人： Hsin-Yu CHEN

IPC分类号： H04N5/63

CPC分类号： H04N5/63 ,  H04N21/436 ,  H04N21/4436

摘要： A batteryless digital TV receiver has a connector mounted on a body and complying with a specific standard, an RF receiving module, a digital TV processor, an authentication chip and a switching power conversion module. When the batteryless digital TV receiver is connected with a handheld device, the switching power conversion module acquires power outputted from the handheld device through the connector, limits an operating power under a specific current, supplies the operating power to the RF receiving module, the digital TV processor and the authentication chip. After the authentication chip and the handheld device finish an authentication step, the digital TV processor receives digital TV signals from the RF receiving module. The digital TV signals are decoded and transmitted to the handheld device and are displayed on the handheld device.

摘要翻译： 无电池数字电视接收机具有安装在身体上并符合特定标准的连接器，RF接收模块，数字电视处理器，认证芯片和开关电源转换模块。 当无电池数字TV接收机与手持设备连接时，开关电源转换模块通过连接器获取从手持设备输出的电力，限制在特定电流下的工作电力，向RF接收模块提供工作电源，数字电视 电视处理器和认证芯片。 在认证芯片和手持设备完成认证步骤之后，数字TV处理器从RF接收模块接收数字TV信号。 数字电视信号被解码并传输到手持设备并显示在手持设备上。

公开(公告)号：US20130050203A1

公开(公告)日：2013-02-28

申请号：US13592753

申请日：2012-08-23

申请人： Chen-Kang SU ,  Hsin-Yu CHEN

发明人： Chen-Kang SU ,  Hsin-Yu CHEN

IPC分类号： G06T15/00

CPC分类号： H04N13/133 ,  G06T19/00 ,  H04N13/161 ,  H04N2213/003

摘要： A 3-D image processing device for processing a 3-D image data, wherein the 3-D image data has a base frame and a dependent frame, including: an image detection unit, detecting the 3-D image data to obtain the base frame and the dependent frame; an image compensation unit, generating a compensation dependent frame by performing image compensation for the dependent frame based on the base frame; and a display device, displaying a 3-D compensation image data according to the base frame and the compensation dependent frame, wherein the base frame and the dependent frame constitute a visual 3-D image, and the base frame has more image details than the dependent frame.

摘要翻译： 一种用于处理3-D图像数据的3-D图像处理装置，其中所述3-D图像数据具有基本帧和从属帧，包括：图像检测单元，检测所述3-D图像数据以获得所述基底 框架和从属框架; 图像补偿单元，通过基于所述基本帧对所述从属帧执行图像补偿来生成补偿相关帧; 以及显示装置，根据基本帧和补偿相关帧显示3-D补偿图像数据，其中基本帧和从属帧构成视觉3-D图像，并且基本帧具有比图像细节更多的图像细节 依赖框架

公开(公告)号：US20110266117A1

公开(公告)日：2011-11-03

申请号：US13096531

申请日：2011-04-28

申请人： Hsin-Yu CHEN

发明人： Hsin-Yu CHEN

IPC分类号： H01H9/28 ,  E05B65/00

CPC分类号： H01H9/287 ,  Y10T70/5611

摘要： A locking device comprising a safety lock switch unit for adjacently located the motor switch. The safety lock switch unit has a lock part and a piece of the action element therewith a control end extended to the motor switch. The locking device can control the handle of the motor switch cannot move.

摘要翻译： 一种锁定装置，包括用于相邻地定位电动机开关的安全锁定开关单元。 安全锁定开关单元具有锁定部分和作用元件的一部分，其中控制端延伸到电动机开关。 锁定装置可以控制电机开关的手柄不能移动。