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    Isolation of short-circuited sensor cells for high-reliability operation of sensor array
    3.
    发明授权
    Isolation of short-circuited sensor cells for high-reliability operation of sensor array 有权
    隔离传感器阵列的高可靠性操作的短路传感器单元

    公开(公告)号：US07293462B2

    公开(公告)日：2007-11-13

    申请号：US11028789

    申请日：2005-01-04

    申请人： Warren Lee ,  David Martin Mills ,  Glenn Scott Claydon ,  Kenneth Wayne Rigby ,  Wei-Cheng Tian ,  Ye-Ming Li ,  Jie Sun ,  Lowell Scott Smith ,  Stanley Chienwu Chu ,  Sam Yie-Sum Wong ,  Hyon-Jin Kwon

    发明人： Warren Lee ,  David Martin Mills ,  Glenn Scott Claydon ,  Kenneth Wayne Rigby ,  Wei-Cheng Tian ,  Ye-Ming Li ,  Jie Sun ,  Lowell Scott Smith ,  Stanley Chienwu Chu ,  Sam Yie-Sum Wong ,  Hyon-Jin Kwon

    IPC分类号： G01H11/00

    CPC分类号： H04R23/00 ,  B06B1/0292

    摘要： A device comprising an array of sensors and a multiplicity of bus lines, each sensor being electrically connected to a respective bus line and comprising a respective multiplicity of groups of micromachined sensor cells, the sensor cell groups of a particular sensor being electrically coupled to each other via the bus line to which that sensor is connected, each sensor cell group comprising a respective multiplicity of micromachined sensor cells that are electrically interconnected to each other and not switchably disconnectable from each other, the device further comprising means for isolating any one of the sensor cell groups from its associated bus line and in response to any one of the micromachined sensor cells of that sensor cell group being short-circuited to ground. In one implementation, the isolating means comprise a multiplicity of fuses. In another implementation, the isolating means comprise a multiplicity of short circuit protection modules, each module comprising a current sensor circuit and an electrical isolation switch.

    摘要翻译： 一种包括传感器阵列和多条总线线路的设备，每个传感器电连接到相应的总线，并且包括相应多个微机械传感器单元组，特定传感器的传感器单元组彼此电耦合 通过连接该传感器的总线，每个传感器单元组包括彼此电互连并且不可切换地彼此分离的相应多个微机械传感器单元，该装置还包括用于隔离传感器 来自其相关联的总线线路的单元组以及响应于该传感器单元组的微机械传感器单元中的任一个被短路到地。 在一个实施方案中，隔离装置包括多个保险丝。 在另一实施方案中，隔离装置包括多个短路保护模块，每个模块包括电流传感器电路和电隔离开关。

    Methods of making and using integrated and testable sensor array
    4.
    发明授权
    Methods of making and using integrated and testable sensor array 有权
    制作和使用集成和可测量传感器阵列的方法

    公开(公告)号：US07781238B2

    公开(公告)日：2010-08-24

    申请号：US11951360

    申请日：2007-12-06

    申请人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    发明人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    IPC分类号： H01L21/66

    CPC分类号： H01L22/20 ,  H01L22/14

    摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.

    摘要翻译： 提供了制造可测试的传感器组件的方法。 该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片 到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为 在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

    METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY
    5.
    发明申请
    METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY 有权
    制造和使用集成和可测传感器阵列的方法

    公开(公告)号：US20090148967A1

    公开(公告)日：2009-06-11

    申请号：US11951360

    申请日：2007-12-06

    申请人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    发明人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    IPC分类号： H01L21/66

    CPC分类号： H01L22/20 ,  H01L22/14

    摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.

    摘要翻译： 提供了制造可测试的传感器组件的方法。 该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片 到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为 在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

    Switching circuitry for reconfigurable arrays of sensor elements
    7.
    发明授权
    Switching circuitry for reconfigurable arrays of sensor elements 有权
    用于可重构阵列的传感器元件的开关电路

    公开(公告)号：US07280435B2

    公开(公告)日：2007-10-09

    申请号：US10978196

    申请日：2004-10-29

    申请人： Kai Erik Thomenius ,  Rayette Ann Fisher ,  Robert Gideon Wodnicki ,  Christopher Robert Hazard ,  Lowell Scott Smith ,  David Martin Mills

    发明人： Kai Erik Thomenius ,  Rayette Ann Fisher ,  Robert Gideon Wodnicki ,  Christopher Robert Hazard ,  Lowell Scott Smith ,  David Martin Mills

    IPC分类号： H04R17/00 ,  A61B8/00

    CPC分类号： H03M11/00 ,  B06B1/0207 ,  B06B1/0292 ,  G01N29/262 ,  G01N2291/044 ,  G01N2291/106

    摘要： A device comprising an array of sensors that are reconfigurable by means of a switching network. The sensors may be optical, thermal or pressure sensors or ultrasonic transducers. More specifically, the device comprises: a multiplicity of sensor elements; a plurality of bus lines; a set of access switches for selectively connecting a set of the sensor elements in a row to a bus line, one of the access switches being connected to a first sensor element; a multiplicity of sets of matrix switches, each of the sets of matrix switches selectively connecting a respective sensor element of the multiplicity of sensor elements to a respective set of adjacent sensor elements, one of the matrix switches being connected to the first sensor element and to a second sensor element that is not a member of the set of sensor elements; and control circuitry that controls the access switches and the matrix switches in accordance with a selected switching configuration such that the first sensor element is connected to the bus line via said one access switch, while at the same time the second sensor element is connected to said one access switch via said one matrix switch.

    摘要翻译： 一种包括可通过交换网络重新配置的传感器阵列的设备。 传感器可以是光学，热或压力传感器或超声换能器。 更具体地，该装置包括：多个传感器元件; 多条总线; 一组接入开关，用于选择性地将一行中的传感器元件连接到总线，其中一个接入开关连接到第一传感器元件; 多个矩阵开关组，每组矩阵开关选择性地将多个传感器元件的相应传感器元件连接到相应的一组相邻传感器元件，矩阵开关中的一个连接到第一传感器元件，并且 第二传感器元件，其不是该组传感器元件的构件; 以及控制电路，其根据选择的开关配置来控制接入开关和矩阵开关，使得第一传感器元件经由所述一个接入开关连接到总线，同时第二传感器元件连接到所述 一个接入开关经由所述一个矩阵开关。

    MULTI-FOCUS ULTRASOUND SYSTEM AND METHOD
    9.
    发明申请
    MULTI-FOCUS ULTRASOUND SYSTEM AND METHOD 有权
    多重超声波系统和方法

    公开(公告)号：US20120053468A1

    公开(公告)日：2012-03-01

    申请号：US12873026

    申请日：2010-08-31

    申请人： Weston Blaine Griffin ,  Douglas Glenn Wildes ,  David Martin Mills ,  Murtuza Lokhandwalla ,  Christopher Robert Hazard ,  Warren Lee ,  Reinhold Bruestle

    发明人： Weston Blaine Griffin ,  Douglas Glenn Wildes ,  David Martin Mills ,  Murtuza Lokhandwalla ,  Christopher Robert Hazard ,  Warren Lee ,  Reinhold Bruestle

    IPC分类号： A61B8/00

    CPC分类号： A61B8/12 ,  A61B8/4461 ,  A61N7/02 ,  A61N2007/0091

    摘要： A multi-focus probe that includes a motor communicatively coupled with a lead screw and configured to turn the lead screw about a lengthwise axis of the lead screw, wherein the lead screw includes a length having threads. The probe also includes a lead-screw nut positioned about the lead screw such that the lead-screw nut engages the threads and such that the lead-screw nut and the lead screw can move relative to one another via the threads, a transducer configured to move vertically with the lead screw, and an enclosure surrounding the transducer, wherein the enclosure includes a probe face configured to hold fluid and engage a wave emission target such that waves from the transducer can enter the target. Further, the probe includes a capture feature capable of engaging the lead-screw nut such that the lead-screw nut is vertically fixed relative to the probe face and such that the lead screw moves away from the probe face when rotating within the lead-screw nut in a first direction and moves toward the probe face when rotating within the lead-screw nut in a second direction opposite to the first direction while the lead-screw nut is engaged by the capture feature.

    摘要翻译： 一种多焦点探针，其包括与导螺杆通信地联接并且构造成围绕导螺杆的纵向轴线转动导螺杆的电动机，其中所述导螺杆包括具有螺纹的长度。 该探头还包括一个围绕导螺杆定位的导螺杆螺母，使得导螺杆螺母与螺纹接合，使得导螺杆螺母和导螺杆可以经由螺纹相对于彼此移动，传感器配置成 使用导螺杆和围绕换能器的外壳垂直移动，其中外壳包括被配置为保持流体并接合波发射目标的探针面，使得来自换能器的波可以进入目标。 此外，探针包括捕获特征，其能够接合丝杠螺母，使得丝杠螺母相对于探针面垂直固定，并且当螺杆内的旋转时，导螺杆远离探针面移动 螺母沿第一方向旋转，并且当螺纹螺母与捕获特征接合时，在与第一方向相反的第二方向上在丝杠螺母内旋转时朝向探针面移动。

    Method for optimized dematching layer assembly in an ultrasound transducer
    10.
    发明授权
    Method for optimized dematching layer assembly in an ultrasound transducer 有权
    用于在超声换能器中优化分层组件的方法

    公开(公告)号：US07621028B2

    公开(公告)日：2009-11-24

    申请号：US11900699

    申请日：2007-09-13

    申请人： Jean-Francois Gelly ,  David Martin Mills ,  Frederic Lanteri ,  Charles Edward Baumgartner ,  Serge Gerard Calisti

    发明人： Jean-Francois Gelly ,  David Martin Mills ,  Frederic Lanteri ,  Charles Edward Baumgartner ,  Serge Gerard Calisti

    IPC分类号： H04R17/10

    CPC分类号： G10K11/02 ,  Y10T29/42 ,  Y10T29/49004 ,  Y10T29/49005

    摘要： A method for manufacturing an acoustical stack for use within an ultrasound transducer comprises using a user defined center operating frequency of an ultrasound transducer that is at least about 2.9 MHz. A piezoelectric material and a dematching material are joined with an assembly material to form an acoustical connection therebetween. The piezoelectric material has a first acoustical impedance and *at least one of* an associated piezoelectric rugosity (Ra) and piezoelectric waviness (Wa). The dematching material has a second acoustical impedance that is different than the first acoustical impedance and at least one of an associated dematching Ra and dematching Wa. The piezoelectric and dematching materials have an impedance ratio of at least 2. The assembly material has a thickness that is based on the center operating frequency and at least one of the piezoelectric Ra, piezoelectric Wa, dematching Ra and dematching Wa.

    摘要翻译： 用于在超声换能器内使用的用于制造声学叠层的方法包括使用至少约2.9MHz的超声换能器的用户定义的中心工作频率。 压电材料和分配材料与组装材料接合以在它们之间形成声学连接。 压电材料具有第一声阻抗和*相关的压电粗糙度（Ra）和压电波纹（Wa）中的至少一个。 解配材料具有不同于第一声阻抗的第二声阻抗和相关联的分配Ra和分配Wa中的至少一个。 压电和解配材料的阻抗比至少为2.组装材料具有基于中心工作频率的厚度和压电Ra，压电Wa，分配Ra和分配Wa中的至少一个。