公开(公告)号：US20100193949A1

公开(公告)日：2010-08-05

申请号：US12364684

申请日：2009-02-03

申请人： Luc L. Belanger ,  Marc A. Bergendahl ,  Ajay P. Giri ,  Paul A. Lauro ,  Valerie A. Oberson ,  Da-Yuan Shih

发明人： Luc L. Belanger ,  Marc A. Bergendahl ,  Ajay P. Giri ,  Paul A. Lauro ,  Valerie A. Oberson ,  Da-Yuan Shih

IPC分类号： H01L23/48 ,  H01L21/302

CPC分类号： H01L24/11 ,  H01L24/12 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/01028 ,  H01L2924/04941

摘要： Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.

摘要翻译： 具有双层或三层UBM层的方法和UBM结构，其在包括薄TiW粘附层和厚Ni基阻挡层的两个或三层UBM层上沉积在溅射操作条件下，以最小的复合应力提供所得到的双层或三层UBM层。 Ni基阻挡层可以是纯Ni或Ni合金。 这些UBM层可以被图案化以制造双层或三层UBM捕获垫，随后将无铅焊料接合到其上以提供在多次回流之后保持可靠性的无铅焊点。 任选地，三层UBM结构的顶层可以包括用于掺杂无铅焊料连接的可溶性或不溶性金属。

公开(公告)号：US08003512B2

公开(公告)日：2011-08-23

申请号：US12364684

申请日：2009-02-03

申请人： Luc L. Belanger ,  Marc A. Bergendahl ,  Ajay P. Giri ,  Paul A. Lauro ,  Valerie A. Oberson ,  Da-Yuan Shih

发明人： Luc L. Belanger ,  Marc A. Bergendahl ,  Ajay P. Giri ,  Paul A. Lauro ,  Valerie A. Oberson ,  Da-Yuan Shih

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L24/12 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/01028 ,  H01L2924/04941

摘要： Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.

摘要翻译： 具有双层或三层UBM层的方法和UBM结构，其在包括薄TiW粘附层和厚Ni基阻挡层的两个或三层UBM层上沉积在溅射操作条件下，以最小的复合应力提供所得到的双层或三层UBM层。 Ni基阻挡层可以是纯Ni或Ni合金。 这些UBM层可以被图案化以制造双层或三层UBM捕获垫，随后将无铅焊料接合到其上以提供在多次回流之后保持可靠性的无铅焊点。 任选地，三层UBM结构的顶层可以包括用于掺杂无铅焊料连接的可溶性或不溶性金属。