METHOD AND APPARATUS FOR FORMING FINE SCALE STRUCTURES IN DIELECTRIC SUBSTRATE
    3.
    发明申请
    METHOD AND APPARATUS FOR FORMING FINE SCALE STRUCTURES IN DIELECTRIC SUBSTRATE 有权
    在电介质基板上形成微细结构的方法和装置

    公开(公告)号:US20150230341A1

    公开(公告)日:2015-08-13

    申请号:US14373798

    申请日:2013-04-19

    Applicant: M-SOLV LIMITED

    Abstract: Apparatus and methods for forming fine scale structures (4, 4′, 4″, 5, 6, 7, 8) in the surface of a dielectric substrate (3) to two or more depths are disclosed. In an example, the apparatus 25 comprises a first solid state laser (12) arranged to provide a first pulsed laser beam (13), a first mask (16) having a pattern for defining a first set of structures (4, 6, 7, 8) at a first depth, a projection lens (17) for forming a reduced size image of said pattern on the surface (3) of the substrate and a beam scanner arranged to scan said first pulsed laser beam (13) in a two-dimensional raster scan relative to the first pattern to form a first set of structures (4, 6, 7, 5) at a first depth in the substrate, wherein the first or a further solid state laser is arranged to form a second set of structures (8) at a second depth in the substrate (3).

    Abstract translation: 公开了在电介质基板(3)的表面中形成两个或更多深度的精细尺度结构(4,4',5“,6,7,8)的装置和方法。 在一个示例中,装置25包括布置成提供第一脉冲激光束(13)的第一固态激光器(12),具有用于限定第一组结构(4,6,7)的图案的第一掩模(16) ,8)在第一深度处,用于在所述基板的表面(3)上形成所述图案的缩小尺寸图像的投影透镜(17)和布置成以二维扫描所述第一脉冲激光束(13)的光束扫描器 相对于第一图案的三维光栅扫描,以在衬底中的第一深度处形成第一组结构(4,6,7,5),其中第一或另一固体激光器被布置成形成第二组 在基板(3)中的第二深度处的结构(8)。

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