摘要:
The present invention provides a method for producing a film forming, fractionated novolak resin copolymer exhibiting fast photospeed and superior performance in a photoresist composition. A method is also provided for producing photoresist composition from such a fractionated novolak resin copolymer and for producing semiconductor devices using such a photoresist composition.
摘要:
A photosensitive positive working photosensitive composition suitable for use as a photoresist, which comprises an admixture of at least one water insoluble, aqueous alkali soluble, film forming novolak resin; at least one o-diazonaphthoquinone photosensitizer; and a photoresist solvent mixture comprising a propylene glycol alkyl ether acetate and 3-methyl-3-methoxy butanol and process for producing such a composition.
摘要:
The present invention provides a method for producing a film forming, fractionated novolak resin, by:a) condensing formaldehyde with one or more phenolic compounds, and thereby producing a novolak resin;b) adding a photoresist solvent, and optionally a water-soluble organic polar solvent;c) feeding the mixture into a liquid/liquid centrifuge and feeding a C.sub.5 -C.sub.8 alkane, water or aromatic hydrocarbon solvent into the liquid/liquid centrifuge at a ratio of optional water-soluble organic polar solvent and photoresist solvent to C.sub.5 -C.sub.8 alkane, water or aromatic solvent, of from 5:1 to 0.5:1;d) rotating the liquid/liquid centrifuge containing the mixture at a speed of at least 500 rpm and thereby separating the mixture into two phases, collecting the two phases;e) optionally separating the lighter phase (L) into two second phases;f) removing residual C.sub.5 -C.sub.8 alkane, water or aromatic hydrocarbon solvent from the heavier phase (H) from step d) and leaving the novolak resin dissolved in the photoresist solvent;A method is also provided for producing photoresist composition from such a fractionated novolak resin and for producing microelectronic devices using such a photoresist composition.
摘要:
Disclosed is a method for producing low molecular weight oligomers of a film forming resin, which involves: a) providing a solution of the film forming resin in a first solvent system comprising a photoresist solvent, and optionally a water-soluble organic solvent; b) providing a second solvent system comprising at least one substantially pure C5-C8 alkane and/or at least one aromatic compound having at least one hydrocarbyl substituent and/or water/C1-C4 alcohol mixture; and performing steps c)-e) in the following order: c) mixing the solutions from a) and second solvent system from b) in a static mixer for a time period sufficient for efficient mixing; d) feeding the mixture from c) and second solvent system from b) through two separate inlet ports into a liquid/liquid centrifuge, one of the inlet ports feeding the mixture from c), the second inlet port feeding the second solvent system from b) into said liquid/liquid centrifuge at a feed ratio of the mixture from c) to the second solvent system from b) of from about 10/90 to about 90/10, at a temperature of from about 0° C. up to maximum temperature that is less than the boiling point of the lowest boiling solvent in the first or second solvent system; e) rotating the mixture from step d) inside the liquid/liquid centrifuge at a rotational speed sufficient to separate the mixture from step d) into two separate phases, and then collecting the two separate phases, each from two separate outlet ports, into two separate containers, wherein the heavier phase (H) comprises a fractionated film forming resin comprising higher molecular weight fractions of the film forming resin and the lighter phase (L) comprises low molecular weight oligomers of the film forming resin. The present invention also provides a method for producing a photoresist composition, and method for producing a microelectronic device using the aforementioned fractionated resin or low molecular weight oligomers of the film forming resin.
摘要:
The present invention provides a method for reducing the metal ion content of a film-forming resin, said method comprising the steps of: a) providing a solution of the film-forming resin in a water-immiscible solvent system comprising at least one water-immiscible solvent; b) providing a washing solution comprising water or a dilute solution of a water-soluble metal ion chelating agent; c) feeding the solutions from a) and b) through two separate inlet ports into a liquid/liquid centrifuge, one of said inlet ports feeding solution from a), the second inlet port feeding the solution from b) into said liquid/liquid centrifuge at a feed rate ratio of the solution from a) to that from b) from about 10/90 to about 90/10, at a temperature of from about 0° C. up to a maximum temperature that is less than the boiling point of the lowest boiling water-immiscible solvent in the water-immiscible solvent system; and d) rotating the mixture from step c) inside said liquid/liquid centrifuge at a rotational speed sufficient to separate the mixture from step c) into two separate phases, and then collecting the two separate phases, each through a separate outlet port, into two separate containers, wherein the heavier phase (H) comprises the film-forming resin having a reduced metal ion content in the water-immiscible solvent system, with a minor amount of water; and the lighter phase (L) comprises: 1) an aqueous solution of metal ions and a minor amount of a mixture of 2) the water-immiscible solvent system, and 3) the film-forming resin. The present invention also provides for a method for producing a photoresist composition and a method for producing a microelectronic device utilizing a film-forming resin produced by the aforementioned method.
摘要:
The invention provides a method for protecting an image which comprises providing a colored image on a substrate and either:A. Applying an antiblocking layer to a release surface of a temporary support; bonding a thermoplastic adhesive layer to said antiblocking layer; laminating said applied support to said colored image via said adhesive; and peeling away said temporary support from said antiblocking layer; orB. applying a thermoplastic adhesive layer to a release surface of a first temporary support; applying an antiblocking layer onto a release surface of a second temporary support, laminating said adhesive onto said colored image and peeling away said first temporary support; and laminating said antiblocking layer onto said adhesive layer and peeling away said second temporary support;wherein said adhesive layer is substantially nontacky at room temperature, is laminated at temperatures between about 60.degree. C. and 90.degree. C., and comprises one or more thermoplastic polymers or copolymers; andwherein said antiblocking layer comprises one or more organic polymers or copolymers, which layer does not cohesively block at about 50.degree. C. or less.
摘要:
According to the invention there is provided an electrochemical process for applying a firmly bonded insoluble metal oxide-organic complex on a metal surface by employing the metal as anode and a water-soluble poly basic organic acid as electrolyte together with a strong inorganic acid such as phosphoric acid or further admixed with another strong inorganic acid such as sulfuric. The polybasic acid may be a polyphosphonic acid, polyphosphoric and polycarboxyl acid, or polysulfonic acid and is advantageously polymeric. Polyvinyl phosphonic acid (PVPA) is a preferred electrolyte. Direct current is used. Pulsed plating may optionally be employed. The insoluble metal oxide-organic complex formed is composed of anodic oxide combined with polyacid, which forms a protective layer on the metal of improved corrosion resistance. The metal oxide-organic complex is well-suited to bond light sensitive coatings thereto. The metal may be steel or aluminum. The process is economical and the product novel.
摘要:
Light sensitive coating compositions containing a dyestuff, which compositions exhibit improved adhesion to transparent film substrates, are disclosed. For example, the adhesion between a polyester base film and a light sensitive coating composition containing a light sensitive diazo material, a resinous binder and a dyestuff is improved by additionally incorporating into the composition an effective amount of an adhesion promoter based on a copolyester obtained by the esterification and subsequent polymerization of a lower alkylene glycol with a mixture of terephthalic acid, isophthalic acid, and at least one acyclic dicarboxylic acid. These coating compositions may be readily removed from the base film by appropriate lithographic developer solutions without substantial residual staining of the film by the dyestuff present in the coating composition.
摘要:
This invention relates to water developable, negative working photosensitized sheet constructions which, upon exposure to an actinic radiation source through a screened image, can accurately reproduce said image. The construction is useful as a color proofing film which can be employed to predict the image quality from a lithographic printing process. The invention provides both overlay and transfer type proofing sheets which have good fingerprint resistance.
摘要:
According to the invention there is provided an electrochemical process for applying a firmly bonded insoluble metal oxide-organic complex on a metal surface by employing the metal as anode and a water-soluble polybasic organic acid as electrolyte. The polybasic acid may be a polyphosphonic acid, polyphosphoric and polycarboxyl acid, or polysulfonic acid and is advantageously polymeric. Polyvinyl phosphonic acid (PVPA) is a preferred electrolyte. Direct current is used. The insoluble metal oxide-organic complex formed is composed of anodic oxide combined with polyacid, which forms a protective layer on the metal of improved corrosion resistance. The metal oxide-organic complex is well-suited to bond light sensitive coatings thereto. The metal may be steel, aluminum or magnesium. The process is economical and the product novel.