公开(公告)号：US08872198B2

公开(公告)日：2014-10-28

申请号：US13090645

申请日：2011-04-20

申请人： Soichi Shibusawa ,  Kiyoshi Nishimura ,  Kozo Ogawa ,  Nobuhiko Betsuda ,  Shuhei Matsuda ,  Masatoshi Kumagai

发明人： Soichi Shibusawa ,  Kiyoshi Nishimura ,  Kozo Ogawa ,  Nobuhiko Betsuda ,  Shuhei Matsuda ,  Masatoshi Kumagai

IPC分类号： H01L33/00 ,  H01L25/075 ,  F21V19/00 ,  F21K99/00 ,  H05K3/28 ,  F21Y101/02 ,  F21S8/04 ,  H01L33/50 ,  F21V23/06 ,  F21Y103/00 ,  H05K1/02

CPC分类号： F21V19/0055 ,  F21K9/20 ,  F21S8/04 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2933/0041 ,  H05K1/0209 ,  H05K1/0289 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2924/00014

摘要： According to one embodiment, the light-emitting apparatus is provided with a substrate, a plurality of light-emitting devices, and a phosphor layer. The plurality of light-emitting devices are mounted on the substrate. The phosphor layer is formed of a translucent resin containing a phosphor and includes a phosphor portion that is formed in a convex shape and covers a predetermined number of the light-emitting device. Bases of the adjacent phosphor portions are formed by being linked with one another.

摘要翻译： 根据一个实施例，发光装置设置有基板，多个发光装置和荧光体层。 多个发光装置安装在基板上。 荧光体层由含有荧光体的半透明树脂形成，并且包括形成为凸形并覆盖预定数量的发光器件的荧光体部分。 相邻的荧光体部分的基底通过彼此连接而形成。

公开(公告)号：US20110254023A1

公开(公告)日：2011-10-20

申请号：US13090645

申请日：2011-04-20

申请人： Soichi SHIBUSAWA ,  Kiyoshi Nishimura ,  Kozo Ogawa ,  Nobuhiko Betsuda ,  Shuhei Matsuda ,  Masatoshi Kumagai

发明人： Soichi SHIBUSAWA ,  Kiyoshi Nishimura ,  Kozo Ogawa ,  Nobuhiko Betsuda ,  Shuhei Matsuda ,  Masatoshi Kumagai

IPC分类号： H01L27/15

CPC分类号： F21V19/0055 ,  F21K9/20 ,  F21S8/04 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2933/0041 ,  H05K1/0209 ,  H05K1/0289 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2924/00014

摘要： According to one embodiment, the light-emitting apparatus is provided with a substrate, a plurality of light-emitting devices, and a phosphor layer. The plurality of light-emitting devices are mounted on the substrate. The phosphor layer is formed of a translucent resin containing a phosphor and includes a phosphor portion that is formed in a convex shape and covers a predetermined number of the light-emitting device. Bases of the adjacent phosphor portions are formed by being linked with one another.

摘要翻译： 根据一个实施例，发光装置设置有基板，多个发光装置和荧光体层。 多个发光装置安装在基板上。 荧光体层由含有荧光体的半透明树脂形成，并且包括形成为凸形并覆盖预定数量的发光器件的荧光体部分。 相邻的荧光体部分的基底通过彼此连接而形成。

公开(公告)号：US20110309379A1

公开(公告)日：2011-12-22

申请号：US13159524

申请日：2011-06-14

申请人： Soichi SHIBUSAWA ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Shuhei Matsuda ,  Masatoshi Kumagai

发明人： Soichi SHIBUSAWA ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Shuhei Matsuda ,  Masatoshi Kumagai

IPC分类号： H01L33/52

CPC分类号： H05K1/181 ,  F21K9/00 ,  F21K9/64 ,  F21S8/04 ,  F21V19/0055 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48137 ,  H05K2201/0979 ,  H05K2201/10106 ,  Y02P70/611 ,  H01L2924/00014

摘要： According to one embodiment, a light-emitting device includes a substrate, a plurality of light-emitting elements and a sealing resin. The substrate is formed in a substantially rectangular shape. The plurality of light-emitting elements forms a plurality of rows by being arranged in a direction perpendicular to a longer dimension of the substrate. The rows are arranged in a longer direction of the substrate with a gap provided therebetween. The gap is set between the rows such that illumination intensity is evenly produced. The sealing resin coves each of the rows of the light-emitting elements.

摘要翻译： 根据一个实施例，发光装置包括基板，多个发光元件和密封树脂。 基板形成为大致矩形形状。 多个发光元件通过沿垂直于基板的较长尺寸的方向排列而形成多行。 这些行布置在基板的较长方向上，其间设置有间隙。 在行之间设置间隙，使得均匀地产生照明强度。 密封树脂将各排发光元件的每个排列。

公开(公告)号：US20110309381A1

公开(公告)日：2011-12-22

申请号：US13162150

申请日：2011-06-16

申请人： Nobuhiko Betsuda ,  Soichi Shibusawa ,  Shuhei Matsuda ,  Kiyoshi Nishimura ,  Masatoshi Kumagai

发明人： Nobuhiko Betsuda ,  Soichi Shibusawa ,  Shuhei Matsuda ,  Kiyoshi Nishimura ,  Masatoshi Kumagai

IPC分类号： H01L27/15

CPC分类号： H05K1/0209 ,  F21S2/005 ,  F21S8/04 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H05K1/181 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to one embodiment, a light-emitting device includes a series circuit, a substrate, and a sealing member. The series circuit includes a plurality of parallel circuits each including a plurality of light-emitting elements connected in parallel. The plurality of parallel circuits are connected in series. A plurality of groups are provided on the substrate. Each of the groups includes at least one of the light-emitting elements in the parallel circuit. The light-emitting elements are arranged in a divided manner according to each of the groups. The sealing member covers at least one of the light-emitting elements.

摘要翻译： 根据一个实施例，发光装置包括串联电路，基板和密封构件。 串联电路包括多个并联电路，每个并联电路包括并联连接的多个发光元件。 多个并联电路串联连接。 在基板上设置多个组。 每个组包括并联电路中的至少一个发光元件。 发光元件根据每个组分开排列。 密封构件覆盖至少一个发光元件。

公开(公告)号：US08770795B2

公开(公告)日：2014-07-08

申请号：US13236672

申请日：2011-09-20

申请人： Kozo Uemura ,  Soichi Shibusawa ,  Shuhei Matsuda ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Masatoshi Kumagai

发明人： Kozo Uemura ,  Soichi Shibusawa ,  Shuhei Matsuda ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Masatoshi Kumagai

IPC分类号： F21V21/00

CPC分类号： H01L25/0753 ,  F21K9/27 ,  F21S8/031 ,  F21V23/023 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light-emitting device includes a substrate, and a plurality of light-emitting elements mounted on the substrate. The light-emitting elements are placed to meet conditions that the number B of light-emitting elements per unit area (cm2) of a mounting part is not less than 0.4 and a mean mounting density D is not less than 58 to not greater than 334, when a relationship of formula “D=A×B” is established, assuming D as a mean mounting density of light-emitting elements on a substrate, A as a current (mA) flowing through one light-emitting element, and B as the number of light-emitting elements per unit area (cm2) of a substantial mounting part for light-emitting elements.

摘要翻译： 发光装置包括基板和安装在基板上的多个发光元件。 放置发光元件以满足以下条件：安装部件的每单位面积（cm2）的发光元件的数量B不小于0.4，平均安装密度D不小于58至不大于334 当建立公式“D = A×B”的关系时，假设D作为基板上的发光元件的平均安装密度，A作为流过一个发光元件的电流（mA），B作为 用于发光元件的基本安装部件的每单位面积的发光元件的数量（cm2）。

公开(公告)号：US20130271971A1

公开(公告)日：2013-10-17

申请号：US13819296

申请日：2011-09-27

申请人： Kozo Uemura ,  Kiyoshi Nishimura ,  Soichi Shibusawa ,  Nobuhiko Betsuda ,  Shuhei Matsuda ,  Masatoshi Kumagai

发明人： Kozo Uemura ,  Kiyoshi Nishimura ,  Soichi Shibusawa ,  Nobuhiko Betsuda ,  Shuhei Matsuda ,  Masatoshi Kumagai

IPC分类号： F21S2/00

CPC分类号： F21S2/00 ,  F21K9/27 ,  F21K9/61 ,  F21S8/031 ,  F21V3/02 ,  F21V7/005 ,  F21V11/02 ,  F21V19/004 ,  F21Y2103/10 ,  F21Y2107/90 ,  F21Y2115/10

摘要： A light-emitting circuit is formed as a straight tube in a stable shape and capable of appropriately housing and holding an LED module and the like. The light-emitting circuit includes: a plurality of light-emitting elements configured to emit light; a substrate, functioning as an arrangement member, including an arrangement surface on which the plurality of light-emitting elements are arranged; and a substantially cylindrical lamp body including a translucent section at least in a part thereof, including the arrangement member disposed on the inside, and including a louver functioning as a projecting body projecting from an inner wall opposed to the arrangement surface and extending toward the arrangement surface.

摘要翻译： 发光电路形成为稳定形状的直管，能够适当地容纳和保持LED模块等。 发光电路包括：多个被配置为发光的发光元件; 用作布置构件的基板，包括布置有多个发光元件的布置表面; 以及至少在其一部分上具有半透明部分的大致圆柱形的灯体，包括设置在内部的布置构件，并且包括用作突出体的百叶窗，所述突出体从与所述布置表面相对的内壁突出并延伸到所述布置 表面。

公开(公告)号：US20120075836A1

公开(公告)日：2012-03-29

申请号：US13236672

申请日：2011-09-20

申请人： Kozo UEMURA ,  Soichi Shibusawa ,  Shuhei Matsuda ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Masatoshi Kumagai

发明人： Kozo UEMURA ,  Soichi Shibusawa ,  Shuhei Matsuda ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Masatoshi Kumagai

IPC分类号： F21V9/16 ,  F21V21/00

CPC分类号： H01L25/0753 ,  F21K9/27 ,  F21S8/031 ,  F21V23/023 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light-emitting device includes a substrate, and a plurality of light-emitting elements mounted on the substrate. The light-emitting elements are placed to meet conditions that the number B of light-emitting elements per unit area (cm2) of a mounting part is not less than 0.4 and a mean mounting density D is not less than 58 to not greater than 334, when a relationship of formula “D=A×B” is established, assuming D as a mean mounting density of light-emitting elements on a substrate, A as a current (mA) flowing through one light-emitting element, and B as the number of light-emitting elements per unit area (cm2) of a substantial mounting part for light-emitting elements.

摘要翻译： 发光装置包括基板和安装在基板上的多个发光元件。 放置发光元件以满足以下条件：安装部件的每单位面积（cm2）的发光元件的数量B不小于0.4，平均安装密度D不小于58至不大于334 当建立公式“D = A×B”的关系时，假设D作为基板上的发光元件的平均安装密度，A作为流过一个发光元件的电流（mA），B作为 用于发光元件的基本安装部件的每单位面积的发光元件的数量（cm2）。

公开(公告)号：US20120099309A1

公开(公告)日：2012-04-26

申请号：US13280433

申请日：2011-10-25

申请人： Nobuhiko Betsuda ,  Shuhei Matsuda ,  Soichi Shibusawa ,  Kozo Uemura ,  Kiyoshi Nishimura

发明人： Nobuhiko Betsuda ,  Shuhei Matsuda ,  Soichi Shibusawa ,  Kozo Uemura ,  Kiyoshi Nishimura

IPC分类号： F21V7/00 ,  F21V21/00 ,  H01L33/62

CPC分类号： H01L33/641 ,  F21K9/00 ,  F21V29/505 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/483 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0209 ,  H05K1/113 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to one embodiment, a light emitting device includes a substrate, a lead pattern and a plurality of mounting pads, and a plurality of light emitting elements. The substrate includes an insulating layer. The lead pattern and the plurality of mounting pads are formed on a surface of the substrate. The lead pattern and the plurality of mounting pads are conductive. The plurality of mounting pads are configured not to electrically conduct. The lead pattern is configured to electrically conduct. The plurality of light emitting elements are mounted on the mounting pads and electrically connected to the lead pattern.

摘要翻译： 根据一个实施例，发光器件包括衬底，引线图案和多个安装焊盘以及多个发光元件。 基板包括绝缘层。 引线图案和多个安装焊盘形成在基板的表面上。 引线图案和多个安装焊盘是导电的。 多个安装焊盘被构造成不进行导电。 引线图案被配置为电导电。 多个发光元件安装在安装焊盘上并电连接到引线图案。

公开(公告)号：USD665105S1

公开(公告)日：2012-08-07

申请号：US29387861

申请日：2011-03-18

申请人： Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Kozo Uemura ,  Shuhei Matsuda ,  Soichi Shibusawa

设计人： Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Kozo Uemura ,  Shuhei Matsuda ,  Soichi Shibusawa

公开(公告)号：US08820950B2

公开(公告)日：2014-09-02

申请号：US13045787

申请日：2011-03-11

申请人： Shuhei Matsuda ,  Soichi Shibusawa ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura

发明人： Shuhei Matsuda ,  Soichi Shibusawa ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura

IPC分类号： F21V9/16

CPC分类号： H05B33/0872 ,  F21K9/00 ,  F21K9/232 ,  F21S8/026 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2113/13 ,  F21Y2115/10 ,  G09G3/3413 ,  G09G2320/041 ,  G09G2320/06 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/50 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H05B33/086 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to one embodiment, a light emitting device which is attached to an illumination apparatus and radiates light having a correlated color temperature of 2900 to 3600K is provided. The light emitting device includes a substrate, blue light emitting LED elements and red light emitting LED elements mounted on the substrate, and a wavelength converting unit. The red light emitting LED elements have a luminous intensity of 0.2 to 2.5 times as large as that of the blue light emitting LED elements at normal use temperature in a state where the light emitting device is attached to the illumination apparatus. The wavelength converting unit is excited by light emitted from the blue light emitting LED elements and converts the light to light having a peak wavelength within a range of 500 to 600 nm.

摘要翻译： 根据一个实施例，提供了附接到照明装置并发射相关色温为2900至3600K的光的发光装置。 发光装置包括基板，蓝色发光LED元件和安装在基板上的红色发光LED元件以及波长转换单元。 在发光装置安装在照明装置的状态下，红色发光LED元件的发光强度为正常使用温度下蓝色发光LED元件的发光强度的0.2〜2.5倍。 波长转换单元被从蓝色发光LED元件发射的光激发，并将该光转换成具有500-600nm范围内的峰值波长的光。