公开(公告)号：US20150151386A1

公开(公告)日：2015-06-04

申请号：US14558089

申请日：2014-12-02

Applicant: MK ELECTRON CO., LTD. ,  HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY ,  KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY ,  KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Sung Jae HONG ,  Keun Soo KIM ,  Chang Woo LEE ,  Jung Hwan BANG ,  Yong Ho KO ,  Hyuck Mo LEE ,  Jae Won CHANG ,  Ja Hyun KOO ,  Jeong Tak MOON ,  Young Woo LEE ,  Won Sik HONG ,  Hui Joong KIM ,  Jae Hong LEE

IPC: B23K35/26 ,  H01L23/00 ,  B23K35/02

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/025 ,  B23K2101/40 ,  B23K2101/42 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/00

Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.

Abstract translation: 提供了一种无铅焊料，焊膏和半导体器件，更具体地，包括在约0.1重量％至约0.8重量％范围内的Cu的无铅焊料，Pd在约0.001 重量％至约0.1重量％，Al在约0.001重量％至约0.1重量％的范围内，Si在约0.001重量％至约0.1重量％的范围内，Sn和不可避免的杂质作为余量，焊膏和 包括无铅焊料的半导体器件。 无铅焊料和焊膏环保，具有高温稳定性和高可靠性。

公开(公告)号：US20160256962A1

公开(公告)日：2016-09-08

申请号：US15044585

申请日：2016-02-16

Applicant: MK Electron Co., Ltd.

Inventor： Hui Joong KIM ,  Jae Hun SONG ,  Young Woo LEE ,  Jae Hong LEE ,  Jae Yeol SON ,  Eung Jae KIM ,  Ho Gun CHA

IPC: B23K35/26 ,  C22C13/02 ,  B23K35/362 ,  H01L23/00 ,  B23K35/02

CPC classification number: B23K35/262 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/362 ,  C22C13/02 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13014 ,  H01L2224/13111 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81911 ,  H01L2924/00015 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01022 ,  H01L2924/01003 ,  H01L2924/00012

Abstract: A solder ball includes about 1.0 wt % to about 2.0 wt % silver (Ag), about 4.0 wt % to about 8.0 wt % indium (In), about 10.0 wt % to about 20.0 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % deoxidizer, and the balance of tin (Sn). A melting point of the solder is about 170° C. to about 190° C.

Abstract translation: 焊球包括约1.0重量％至约2.0重量％的银（Ag），约4.0重量％至约8.0重量％的铟（In），约10.0重量％至约20.0重量％的铋（Bi），约0.005重量％ 至约0.1重量％的脱氧剂，余量为锡（Sn）。 焊料的熔点为约170℃至约190℃