摘要:
A piezoelectric resonator includes a piezoelectric resonator element vibrating in a longitudinal vibration mode and having a mounting surface, wherein a resin material is provided on the mounting surface of the piezoelectric resonator element, and the resin material has a hardness of about 0 to about 50 in units defined in the JIS-A standards and/or an elastic modulus of about 0.1 to 10 MPa.
摘要:
A piezoelectric resonator having a small spurious resonance and a large difference .DELTA.F between the resonant frequency and the antiresonant frequency has a compact size and an external electrode has a structure which prevents damage or breaking of the external electrode. The piezoelectric resonator has a substantially rectangular-parallelepiped base member which includes a plurality of laminated piezoelectric layers. A middle portion of the piezoelectric layers is polarized in opposite directions relative to each other. On main surfaces of the middle part of the piezoelectric layers, first and second groups of inner electrodes and are exposed alternately at both side surfaces of the base member. On both side surfaces of the base member, first and second external electrodes are arranged so as to alternately connect to the first and second groups of inner electrodes.
摘要:
A method of forming an electronic component includes laminating ceramic green sheets on a support film to obtain a ceramic green sheet laminate, forming through holes through the ceramic green sheet laminate at positions where via hole electrodes are to be located, applying conductive material into the through holes so as to fill the through holes and so as to be located on the upper surface of the ceramic green sheet laminate to form via hole electrodes, and sintering the ceramic green sheet laminate to form a substrate and so as to form protruding portions of the via hole electrodes which protrude upward from the upper surface of the substrate.
摘要:
An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.
摘要:
The invention relates to a fluid line coupling which has a receiving part (1) and a locking part (15) which can be connected to the receiving part (1) and on which is formed a number of elastically resilient spring tongues (18) which are designed for engaging behind an annular collar (29) which is formed on a plug-in part (28) which is to be inserted into the receiving part (1). Also provided is a securing part (20) on which is formed a number, corresponding to the number of spring tongues (18), of elongate securing arms (22). Guide means (7; 24, 25) are formed on the securing part (20) and on the receiving part (1), which guide means (7; 24, 25) are in engagement with one another for the movement of the securing part (20) in relation to the receiving part (1). In a securing position of the securing part (20), each securing arm (22) bears at the outside against a respectively associated spring tongue (18) and prevents the latter from deflecting outward. The plug-in part (28) is thereby secured, with a very high pull-out force, so as to be prevented from being pulled out of the receiving part (1).
摘要:
A method of producing a piezoeIectric resonator includes the steps of forming first to third internal electrodes by printing an electrically conductive paste onto a green sheet, punching out portions of the green sheet having the first to third internal electrodes formed thereon, so that at least three types of green sheets are punched out with a location of the internal electrode serving as a reference location, in which the first sheet is punched out by shifting a punching location by a first shift amount in a first direction with respect to the reference location, the second sheet is punched out by shifting a punching location by the first shift amount in a direction opposite to the first direction, and the third sheet is punched out at the reference location, forming a layered body by stacking the punched out green sheets, and forming a unit by cutting the layered body.
摘要:
A method for fabricating ceramic electronic parts allows external electrodes to be baked onto the electronic parts without overlaying powder on the sagger. An adhesive material layer is provided on a surface of a sagger on which electronic parts are placed. The sagger is inserted into a firing oven with the electronic parts adhesively fixed onto the adhesive material layer, whereby the external electrodes of the electronic parts are baked. The adhesive layer burns away during the firing process. The method including such steps eliminates the need of overlaying powder onto the sagger, so that no powder sticks to the external electrodes after baking, so that the process of removing powder is no longer necessitated.
摘要:
In a plating apparatus 10, a known control signal for detection is supplied from a computer 50 to a motor 13 in advance; the motor 13 is rotated at a variable speed within a predetermined range; and the displacement of a basket 18 is detected by a displacement sensor 30 to obtain displacement characteristics data. Next, the computer 50 controls the rotating operation of the motor 13 through a motor controller 60 to put the basket 18 in a desired optimum state of vibration using the obtained displacement characteristics data and data of an optimum amplitude for the plating process obtained in advance.
摘要:
A fluid line coupling includes a receiving part and a locking part connectable to the receiving part. The locking part includes a plurality of elastically resilient spring tongues engageable behind an annular collar formed on a plug-in part that is insertable into the receiving part. A securing part includes a plurality of elongate securing arms. Guide elements are formed on the securing part and the receiving part that are engagable with one another to displace the securing part in relation to the receiving part. In a securing position of the securing part, each securing arm bears against a respective associated spring tongue and prevents the spring tongue from deflecting outwardly. In this manner, the plug-in part is secured by a very high pull-out force against being pulled out of the receiving part.
摘要:
A highly reliable multi-layer ceramic electronic part in which is compact, in which cracks tend not to occur in the ceramic element even in cases where it is handled in bulk by a chip mounting device. A plurality of electrodes (internal electrodes) are disposed within a ceramic element whose length L.ltoreq.1.0 mm, height H.ltoreq.0.5 mm and width W.ltoreq.0.5 mm. The thickness t.sub.1 of a ceramic outer layer portion of the multi-layer ceramic electronic part, is 0.15 mm or less. The thickness of the ceramic outer layer portion t.sub.1 and the thickness t.sub.2 of the portion where the internal electrodes are disposed have the relationship 1/4 t.sub.2 .ltoreq.t.sub.1.ltoreq.1/3 t.sub.2.