摘要:
There is disclosed a stable, one-part moisture-curable composition containing: (A) 100 parts by weight of a saturated hydrocarbon polymer having on average more than 2 hydrolyzable silyl groups in its molecule; (B) 10 to 300 parts by weight of a silicon-free conduit compound having at least one C6 to C30 hydrocarbon group in its molecule, said compound being selected from the group consisting of (i) esters, (ii) ethers, (iii) epoxy-containing compounds, (iv) anhydrides and (v) ketones; and (C) a sufficient amount of a silanol condensation catalyst to cure said composition upon exposure to moisture.
摘要:
This invention relates to radiation curable compositions comprising an alkenyl ether functional polyisobutylene, a cationic photoinitiator, and a miscible reactive diluent selected from specified organic vinyl ether compounds or compounds having the formula R8Xb, wherein R8 is a non-silicon containing organic group, X is an organic group containing at-least one acrylate functional group, and b has a value of 1-3. The radiation curable compositions exhibit a low cure energy, have a high moisture vapor barrier, high damping characteristics, and a high refractive index, and provide a barrier to corrosive vapors and have maintained or enhanced modulus, tensile strength, and toughness.
摘要:
Disclosed herein are radiation-curable polymers, a method of preparing radiation-curable polymers and compositions containing radiation-curable polymers. Radiation-curable polymers and compositions containing radiation-curable polymers are useful as coatings and adhesives.
摘要:
A copolymer of isobutylene with 0.5 to 15 mole percent of a conjugated diene (i.e., a butyl rubber) is reacted with a silane having both an alkenyl group as well as at least two silicon-bonded hydrolyzable group, the reaction taking place in the presence of a free-radical generator, to provide a modified copolymer having reactive silyl groups grafted thereto. The modified copolymer exhibits a reduced molecular weight relative to the starting copolymer and may be used to formulate moisture-curable sealants, caulks, adhesive and coatings.
摘要:
This invention relates to radiation curable compositions comprising an alkenyl ether functional polyisobutylene, a cationic photoinitiator, a free radical photoinitiator, and an alkenyl ether compound which is free of isobutylene units. The radiation curable compositions can further comprise an alkylphenol. This invention also relates to hydrocarbon silicone alkenyl ether compounds. The radiation curable compositions exhibit a low cure energy, have a high moisture vapor barrier, high damping characteristics, and a high refractive index, and provide a barrier to corrosive vapors and have maintained or enhanced modulus, tensile strength, and toughness.
摘要:
This invention relates to alkenyl ether functional polyisobutylenes. This invention also relates to a method of making alkenyl ether functional polyisobutylene polymers comprising reacting a mixture comprising an alkoxysilyl-functional polyisobutylene polymer, an alkenyl ether compound, and a transesterification catalyst. This invention also relates to a method of making an alkenyl ether functional polyisobutylene polymer comprising reacting a mixture comprising a polyisobutylene containing at least one hydrolyzable group, an alkenyl ether compound, and a solvent. The alkenyl ether functional polyisobutylenes of this invention have high moisture vapor barrier, high damping characteristics, and a high refractive index.
摘要:
A method for forming coatings from radiation curable compositions comprising an alkenyl ether functional polyisobutylene, a cationic photoinitiator, and optionally a free radical photoinitiator and/or an alkenyl ether compound which is free of isobutylene units on to components such as fiber optics where the component is at a temperature greater than about 50° C. and preferably at a temperature within a range of greater than about 80° C. to 120° C. The coating may be overcoated with an acrylate functional polymer.
摘要:
This invention relates to radiation curable compositions comprising an alkenyl ether functional polyisobutylene, a cationic photoinitiator, and a miscible reactive diluent selected from specified organic vinyl ether compounds, epoxy functional compounds, or compounds having the formula R8Xb, wherein R8 is a non-silicon containing organic group, X is an organic group containing at-least one acrylate functional group, and b has a value of 1-3. The radiation curable compositions exhibit a low cure energy, have a high moisture vapor barrier, high damping characteristics, and a high refractive index, and provide a barrier to corrosive vapors and have maintained or enhanced modulus, tensile strength, and toughness.
摘要:
Epoxy-functional polysiloxanes containing epoxy groups and hydrocarbyl groups free of aliphatic unsaturation, a silicone composition containing a polysiloxane selected from the aforementioned epoxy-functional polysiloxanes, a cured polysiloxane prepared by exposing the silicone composition to ultraviolet radiation, a coated optical fiber containing a cured polysiloxane, and a method of preparing a coated optical fiber.
摘要:
A process includes the steps of: 1) heating a mold at a temperature ranging from 100° C. to 200° C.; 2) feeding a silicone encapsulant composition including a mold release agent, where the composition has a viscosity ranging from 100 cps to 3,000 cps at operating temperatures of the process, to an assembly for preventing the silicone encapsulant composition from flowing backward out of the assembly; 3) injecting the silicone encapsulant composition from the assembly into a mold having a horizontal orientation and having a mold cavity through a gate, where the mold cavity has a top and a bottom, a vent is located at the top of the mold cavity, the vent comprises a channel 0.1 mm to 1 mm wide by 0.0001 mm to 0.001 mm deep, the gate is located at the bottom of the mold cavity, and injecting is performed at a pressure ranging from 1,000 psi to 10,000 psi for up to 5 seconds; 4) holding the silicone encapsulant composition at 1,000 psi to 10,000 psi for an amount of time sufficient to prevent the silicone encapsulant composition from flowing out of the mold cavity; 5) curing the product of step 4). Lenses for LED packages may be prepared by the process.