Beam grid layout
    3.
    发明授权

    公开(公告)号:US09934943B2

    公开(公告)日:2018-04-03

    申请号:US14787775

    申请日:2014-05-05

    Abstract: A sub-beam aperture array for forming a plurality of sub-beams from one or more charged particle beams. The sub-beam aperture array comprises one or more beam areas, each beam area comprising a plurality of sub-beam apertures arranged in a non-regular hexagonal pattern, the sub-beam apertures arranged so that, when projected in a first direction onto a line parallel to a second direction, the sub-beam apertures are uniformly spaced along the line, and wherein the first direction is different from the second direction. The system further comprises a beamlet aperture array with a plurality of beamlet apertures arranged in one or more groups. The beamlet aperture array is arranged to receive the sub-beams and form a plurality of beamlets at the locations of the beamlet apertures of the beamlet array.

    SECURE CHIPS WITH SERIAL NUMBERS
    5.
    发明申请

    公开(公告)号:US20180069710A1

    公开(公告)日:2018-03-08

    申请号:US15444396

    申请日:2017-02-28

    Abstract: An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a second portion of the non-common structures is adapted to store or generate a first predetermined value which uniquely identifies the first non-common circuit, wherein the first predetermined value is readable from outside the semiconductor chip by automated reading means.

    SECURE CHIPS WITH SERIAL NUMBERS
    7.
    发明申请

    公开(公告)号:US20180068955A1

    公开(公告)日:2018-03-08

    申请号:US15444369

    申请日:2017-02-28

    Abstract: An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a second portion of the non-common structures is adapted to store or generate a first predetermined value which uniquely identifies the first non-common circuit, wherein the first predetermined value is readable from outside the semiconductor chip by automated reading means.

    Apparatus for transferring a substrate in a lithography system
    10.
    发明授权
    Apparatus for transferring a substrate in a lithography system 有权
    用于在光刻系统中传送衬底的装置

    公开(公告)号:US09575418B2

    公开(公告)日:2017-02-21

    申请号:US14850997

    申请日:2015-09-11

    Abstract: An apparatus for transferring a target, such as a substrate or a substrate support structure onto which a substrate has been clamped, from a substrate transfer system to a vacuum chamber of a lithography system. The apparatus comprises a load lock chamber for transferring the target into and out of the vacuum chamber. The load lock chamber comprises a first wall with a first passage providing access between a robot space and the interior of the load lock chamber, a second wall with a second passage providing access between the interior of the load lock chamber and the vacuum chamber, and plurality of handling robots for transferring the targets comprising: a first handling robot movable within the robot space to access the substrate transfer system and the first passage; and a second handling robot movable within the load lock chamber to access the first passage and the second passage.

    Abstract translation: 一种用于将基板或基板支撑结构的目标(例如基板被夹紧到其上的基板)从基板传送系统传送到光刻系统的真空室的装置。 该装置包括用于将目标物输入和离开真空室的装载锁定室。 所述装载锁定室包括具有第一通道的第一壁,所述第一通道提供机器人空间与所述装载锁定室的内部之间的通路;第二壁,其具有提供在所述负载锁定室的内部与所述真空室之间的通路的第二通道,以及 用于传送所述目标的多个处理机器人包括:可在所述机器人空间内移动的第一处理机器人,以接近所述基板传送系统和所述第一通道; 以及第二处理机器人,其能够在所述加载锁定室内移动以接近所述第一通道和所述第二通道。

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