摘要:
A packaged integrated circuit (“IC”) includes a substrate, an IC die, and a molded plastic lid. A test point standoff is electrically connected to the IC die and extends away from the surface of the package substrate through the molded plastic lid toward the top surface of the molded plastic lid. The top of the test point standoff is below the top surface of the molded plastic lid.
摘要:
The relative timing of triggering switching events in a circuit block of an IC device is dynamically adjusted in response to fluctuations in device's supply voltage to minimize clock jitter caused by supply voltage noise. A control circuit monitors supply voltage fluctuations, and in response thereto dynamically phase-shifts a clock signal that triggers the switching events so that the switching events occur during relatively quiet time intervals in which fluctuations in the supply voltage are minimal.
摘要:
A method for the prediction of simultaneous switching output (SSO) noise that may be generated by one or more signal conduction paths within an electrical system. Electrical disturbance waveforms are first recorded for each signal conduction path that may be affected by the electrical disturbances. Next, principles of superposition are utilized to coherently combine each of the electrical disturbance waveforms in the time domain to generate the predicted SSO noise waveform that is imposed upon the affected signal conduction path. The electrical disturbance waveforms may be produced either by using bench measurements performed on an actual integrated circuit, by simulation, or by a combination of simulation and bench measurements.
摘要:
Structures that provide decoupling capacitance to packaged IC devices with reduced capacitor and via parasitic inductance. A capacitive interposer structure is physically interposed between the packaged IC and the PCB, thus eliminating the leads and vias that traverse the PCB in known structures. A capacitive interposer is mounted to a PCB and the packaged IC is mounted on the interposer. The interposer has an array of lands on an upper surface, to which the packaged IC is coupled, and an array of terminals on a lower surface, which are coupled to the PCB. Electrically conductive vias interconnect each land with an associated terminal on the opposite surface of the interposer. Within the interposer, layers of a conductive material alternate with layers of a dielectric material, thus forming parallel plate capacitors between adjacent dielectric layers. Each conductive layer is either electrically coupled to, or is electrically isolated from, each via.
摘要:
An amplifier may include two or more pulse-width modulators controlling respective sets of switches to produce an amplified version of a source signal. A positive DC-offset based on the source signal may be applied to the pulse-width modulator controlling one respective set of switches, and an equal value negative DC-offset may be applied to the pulse-width modulator controlling the other respective set of switches, to provide an effective offset between the respective points in time of the rising/falling edges of the different pulse-width modulated control signals. The addition of alternating positive and negative DC-offset values doesn't affect the output load, and doesn't degrade the signal. The DC-offsets may be added at a frequency selected to be beyond the signal baseband, and the value of the small input signal level may be determined using an RMS level comparator or similar measurement technique.
摘要:
Transient processing mechanisms for power converters. Error generation circuitry in a power converter may generate an error signal based on the difference between a power converter output voltage and a reference voltage. Transient detection circuitry may detect whether the error signal exceeds at least a first threshold. If the first threshold is exceeded, timing control logic may generate a low band correction pulse to adjust the power converter output voltage, and thereby adjust the error signal to a level within the first threshold. If the error signal exceeds a second threshold, the timing control logic may generate a high band correction pulse to adjust the power converter output voltage, and thereby adjust the error signal to a level within the second threshold. The timing control logic may initiate a low band blanking period following the low band correction pulse and high band blanking period following the high band correction pulse.
摘要:
A power converter including a hardware efficient control loop architecture. Error detection circuitry may generate an error signal based on the difference between a power converter output voltage and a reference voltage. An oversampling ADC may digitize the error signal. The transfer function associated with the ADC may include quantization levels spaced at non-uniform intervals away from a center code. A digital filter may calculate the average of the digitized error signal. A nonlinear requantizer may reduce the number of codes corresponding to the output of the digital filter. A proportional integral derivative (PID) unit may multiply the output of the nonlinear requantizer by PID coefficients to generate a PID duty cycle command, and a gain compensation unit may dynamically adjust the PID coefficients to maintain a constant control loop gain. A noise-shaped truncation unit including a multi-level error-feedback delta sigma modulator may reduce the resolution of the PID duty cycle command.
摘要:
An amplifier may include two or more pulse-width modulators (PWMs) controlling respective sets of switches to produce an amplified version of a source signal. The clocking for the amplifier may be controlled to delay signal processing within the PWMs relative to one another in time, thereby providing an effective time offset between the absolute moment in time of the edge transition of the controlling signals to the respective sets of switches. The PWMs may include a decrementor that counts down to zero from the next PWM duty-cycle value when a new data sample is detected, beginning a new count when the next sample is present. The PWM output may correspond to the counter value, outputting a pulse when the counter value is nonzero. A “data-sample-ready” signal may be decoded from a master counter, which may be clocked based on the high speed PWM clock, and the delay mechanism may be based on adjusting the decode value to determine when the PWM should initialize to the next data sample.
摘要:
An IC uses a tunable interconnect driver between a data source and a data destination to selectively slow down (“de-tune”) data signals. Data sent along relatively short paths are de-tuned to reduce power supply noise during synchronous switching events. In some embodiments, the tunable interconnect driver delays data transmission relative to an un-delayed signal path, in other embodiments, the slew rate of the tunable interconnect driver is selectively reduced.
摘要:
A packaged semiconductor device uses built-in self test to characterize voltage between points within the semiconductor die during a current discontinuity generated in the semiconductor die. The semiconductor die is operated to generate a current discontinuity, or several sequential current discontinuities, and the voltage is measured with an on-chip ADC. Measuring the voltage within the semiconductor die, rather than measuring at external test points, provides a more accurate prediction of device operation. Multiple test points are measured using a multiplexer, multiple ADCs, or by reconfiguring an FPGA. Impedance versus frequency information of the greater power distribution system connected to the semiconductor die is obtained by transforming the voltage and current through the semiconductor die measured during a current discontinuity.