公开(公告)号：US20130134560A1

公开(公告)日：2013-05-30

申请号：US13306708

申请日：2011-11-29

Applicant: James Wholey ,  Ray Myron Parkhurst ,  Marshall Maple

Inventor： James Wholey ,  Ray Myron Parkhurst ,  Marshall Maple

IPC: H01L23/02

CPC classification number: H01L23/585 ,  H01L23/564 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor structure includes semiconductor devices on a substrate, a moisture barrier on the substrate surrounding the semiconductor devices, and a metal conductive redistribution layer formed over the moisture barrier. The metal conductive redistribution layer and the moisture barrier define a closed compartment containing the semiconductor devices.

Abstract translation: 半导体结构包括衬底上的半导体器件，围绕半导体器件的衬底上的防潮层，以及形成在湿气屏障上的金属导电再分配层。 金属导电再分配层和防潮层限定了包含半导体器件的封闭隔间。

公开(公告)号：US4926292A

公开(公告)日：1990-05-15

申请号：US391459

申请日：1989-08-09

Applicant: Marshall Maple

Inventor： Marshall Maple

IPC: H01F17/00 ,  H01L27/01 ,  H05K1/16

CPC classification number: H05K1/165 ,  H01F17/0006 ,  H01L27/016 ,  H05K1/167 ,  H05K2201/0317 ,  Y10T29/49002

Abstract: A thin film printed circuit inductive element exhibiting low Q wherein a conductive spiral is deposited on an insulating substrate and resistive links are connected between adjacent turns of the spiral. Inherent resonance is thereby damped out.

Abstract translation: 表现出低Q的薄膜印刷电路电感元件，其中导电螺旋沉积在绝缘基板上，电阻链路连接在螺旋的相邻匝之间。 因此阻尼了固有共振。

公开(公告)号：US08536707B2

公开(公告)日：2013-09-17

申请号：US13306708

申请日：2011-11-29

Applicant: James Wholey ,  Ray Myron Parkhurst ,  Marshall Maple

Inventor： James Wholey ,  Ray Myron Parkhurst ,  Marshall Maple

IPC: H01L23/52

CPC classification number: H01L23/585 ,  H01L23/564 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor structure includes semiconductor devices on a substrate, a moisture barrier on the substrate surrounding the semiconductor devices, and a metal conductive redistribution layer formed over the moisture barrier. The metal conductive redistribution layer and the moisture barrier define a closed compartment containing the semiconductor devices.

Abstract translation: 半导体结构包括衬底上的半导体器件，围绕半导体器件的衬底上的防潮层，以及形成在湿气屏障上的金属导电再分配层。 金属导电再分配层和防潮层限定了包含半导体器件的封闭隔间。

公开(公告)号：US20070257375A1

公开(公告)日：2007-11-08

申请号：US11415705

申请日：2006-05-02

Applicant: James Roland ,  Ray Parkhurst ,  Ashish Alawani ,  Marshall Maple ,  Thu Nguyen

Inventor： James Roland ,  Ray Parkhurst ,  Ashish Alawani ,  Marshall Maple ,  Thu Nguyen

IPC: H01L21/00

CPC classification number: H05K3/341 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/8191 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043 ,  H05K1/0209 ,  H05K2201/09781 ,  H05K2201/10659 ,  H05K2201/10969 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: An electronic package. The electronic package includes an electronic component having a heat producing device, an attachment piece, and at least two attachment units. Each unit includes an attachment pillar having a mating surface, a solder layer formed on the mating surface, and an attachment pad located on the attachment piece. The pillar of each unit is attached to its unit attachment pad via its unit solder layer and is otherwise attached to the electronic component. One pillar at least partially covers the heat producing device. Prior to attachment of pillars to their associated unit pads, the unit solder layer of the pillar at least partially covering the heat producing device is patterned to cover less than its mating surface, and the pillar at least partially covering the heat producing device is thermally connected to the heat producing device and to its unit attachment pad via its unit solder layer.

Abstract translation: 电子包装。 电子包装包括具有发热装置，附件和至少两个附接单元的电子部件。 每个单元包括具有配合表面的附接柱，形成在配合表面上的焊料层和位于附件上的附接垫。 每个单元的支柱通过其单元焊料层附接到其单元附接垫，并且否则附接到电子部件。 一支柱至少部分地覆盖发热装置。 在将支柱附接到其相关联的单元焊盘之前，至少部分覆盖发热装置的柱的单元焊料层被图案化以覆盖小于其配合表面，并且至少部分覆盖发热装置的柱被热连接 通过其单元焊料层到制热装置和其单元附接垫。

公开(公告)号：US5445922A

公开(公告)日：1995-08-29

申请号：US978813

申请日：1992-11-19

Applicant: Marshall Maple

Inventor： Marshall Maple

IPC: H01F17/00 ,  H01L27/01 ,  H05K1/16 ,  G03F7/26

CPC classification number: H01F17/0006 ,  H01L27/016 ,  H05K1/165 ,  H05K1/167 ,  H05K2201/0317 ,  Y10T29/49099

Abstract: a thin film printed circuit inductive element exhibiting low Q wherein a conductive spiral is deposited on an insulating substrate and resistive links are connected between adjacent turns of the spiral. Inherent resonance is thereby damped out.

Abstract translation: 表现出低Q的薄膜印刷电路感应元件，其中导电螺旋沉积在绝缘基板上，电阻链路连接在螺旋的相邻匝之间。 因此阻尼了固有共振。

公开(公告)号：US5215866A

公开(公告)日：1993-06-01

申请号：US523066

申请日：1990-05-14

Applicant: Marshall Maple

Inventor： Marshall Maple

IPC: H01F17/00 ,  H01L27/01 ,  H05K1/16

CPC classification number: H01F17/0006 ,  H01L27/016 ,  H05K1/165 ,  H05K1/167 ,  H05K2201/0317 ,  Y10T29/49099

Abstract: A thin film printed circuit inductive element exhibiting low Q wherein a conductive spiral is deposited on an insulating substrate and resistive links are connected between adjacent turns of the spiral. Inherent resonance is thereby damped out.

Abstract translation: 表现出低Q的薄膜印刷电路电感元件，其中导电螺旋沉积在绝缘基板上，电阻链路连接在螺旋的相邻匝之间。 因此阻尼了固有共振。