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14 条记录 (耗时 0.043 秒)

    CATHETER UNIT FOR RADIATION THERAPY
    5.
    发明申请
    CATHETER UNIT FOR RADIATION THERAPY 审中-公开
    辐射治疗导管器

    公开(公告)号：US20080293993A1

    公开(公告)日：2008-11-27

    申请号：US12180608

    申请日：2008-07-28

    申请人： Makoto Inaba

    发明人： Makoto Inaba

    IPC分类号： A61N5/00 ,  A61M25/01

    CPC分类号： A61B1/00048 ,  A61B1/2676 ,  A61N5/1002

    摘要： A catheter unit comprising an elbowed catheter having an insert section capable of being inserted into the body cavity and an elbow section and a winged catheter capable of being attached to the elbowed catheter so as to cover the insert section of the elbowed catheter. The two catheters are introduced into the body cavity by utilizing the bending function and fixed in the body cavity by means of a wing portion attached to the winged catheter.

    摘要翻译： 一种导管单元，其包括弯管导管，该导管具有能够插入体腔的插入部分和肘部，以及能够附接到肘导管以覆盖肘导管的插入部分的翼形导管。 通过利用弯曲功能将两个导管引入体腔，并通过附接到翼状导管的翼部固定在体腔中。

    CIRCUIT BOARD AND CONNECTION SUBSTRATE
    6.
    发明申请
    CIRCUIT BOARD AND CONNECTION SUBSTRATE 审中-公开
    电路板和连接基板

    公开(公告)号：US20090084597A1

    公开(公告)日：2009-04-02

    申请号：US12293264

    申请日：2007-03-14

    申请人： Toshiaki Chuma ,  Makoto Inaba

    发明人： Toshiaki Chuma ,  Makoto Inaba

    IPC分类号： H05K1/11

    CPC分类号： H05K1/148 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481

    摘要： There is provided a circuit board including a first and a second circuit substrate located with a spacing, on which a first and a second conductor pad are provided respectively; and a connection substrate including a first and a second conductor post projecting from one or the other side; the connection substrate being disposed so as to cover a portion of the first and the second circuit substrate, and bridged therebetween; the first conductor post and the first conductor pad, as well as the second conductor post and the second conductor pad, being disposed so as to oppose each other; the circuit board also including a connector portion to be formed upon melting a metal coating layer, formed in advance on a surface of at least one of the first conductor post and the first conductor pad, and on a surface of at least one of the second conductor post and the second conductor pad; the first and the second circuit substrate and the connection substrate being electrically connected through the connector portion.

    摘要翻译： 提供了一种电路板，包括分别设置有第一和第二导体焊盘的间隔的第一和第二电路基板; 以及连接基板，包括从一侧或另一侧突出的第一和第二导体柱; 连接基板被设置成覆盖第一和第二电路基板的一部分，并在其间桥接; 第一导体柱和第一导体焊盘以及第二导体柱和第二导体焊盘彼此相对设置; 电路板还包括在熔化金属涂层时形成的连接器部分，其预先形成在第一导体柱和第一导体焊盘中的至少一个的表面上，并且在第二第二导体柱中的至少一个的表面上形成 导体柱和第二导体垫; 第一和第二电路基板和连接基板通过连接器部分电连接。