公开(公告)号：US06903700B2

公开(公告)日：2005-06-07

申请号：US10133326

申请日：2002-04-29

申请人： Kenichi Maruhashi ,  Masaharu Ito ,  Keiichi Ohata ,  Kazuhiro Ikuina ,  Takeya Hashiguchi

发明人： Kenichi Maruhashi ,  Masaharu Ito ,  Keiichi Ohata ,  Kazuhiro Ikuina ,  Takeya Hashiguchi

IPC分类号： H01P5/18 ,  H01Q13/10 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H01P3/08

CPC分类号： H01P5/185 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01P5/187 ,  H01Q13/10 ,  H05K1/0237 ,  H05K1/0272 ,  H05K1/185 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0379 ,  H05K2201/0969 ,  H05K2201/10242 ,  H05K2201/10416 ,  H01L2224/0401

摘要： A high frequency circuit substrate comprises a first high frequency circuit substrate including at least a first dielectric material layer, a first conductor layer, a second dielectric material layer and a second conductor layer, which are laminated in the named order, the first conductor layer having a first slot formed therein, and the second conductor layer forming a transmission line, the first dielectric material layer having a first opening exposing the first slot at its bottom. The high frequency circuit substrate also comprises a second high frequency circuit substrate including at least a third dielectric material layer, a third conductor layer, a fourth dielectric material layer and a fourth conductor layer, which are laminated in the named order, the third conductor layer having a second slot formed therein, and the fourth conductor layer forming a transmission line, the third dielectric material layer having a second opening exposing the second slot at its bottom. The first high frequency circuit substrate and the first high frequency circuit substrate are bonded to each other in such a manner that the first dielectric material layer and the third dielectric material layer are faced to each other and the first slot and the second slot are electromagnetically coupled, by inserting one side and the other side of a conductor plate having a through hole into the first opening and the second opening, respectively.

摘要翻译： 高频电路基板包括第一高频电路基板，该第一高频电路基板至少包括第一电介质材料层，第一导体层，第二介电材料层和第二导体层，其按顺序层叠，所述第一导体层具有 形成在其中的第一槽，并且所述第二导体层形成传输线，所述第一介电材料层具有在其底部暴露所述第一槽的第一开口。 高频电路基板还包括第二高频电路基板，其包括按照所述顺序层压的至少第三电介质材料层，第三导体层，第四电介质层和第四导体层，第三导体层 具有形成在其中的第二槽，并且所述第四导体层形成传输线，所述第三介电材料层具有在其底部暴露所述第二槽的第二开口。 第一高频电路衬底和第一高频电路衬底彼此接合，使得第一电介质材料层和第三电介质材料层相互面对，并且第一槽和第二槽电磁耦合 通过将具有通孔的导体板的一侧和另一侧分别插入第一开口和第二开口中。

公开(公告)号：US06774748B1

公开(公告)日：2004-08-10

申请号：US09711541

申请日：2000-11-13

申请人： Masaharu Ito ,  Kenichi Maruhashi ,  Kazuhiro Ikuina ,  Keiichi Ohata

发明人： Masaharu Ito ,  Kenichi Maruhashi ,  Kazuhiro Ikuina ,  Keiichi Ohata

IPC分类号： H01L23051

CPC分类号： H01P1/047 ,  H01L23/057 ,  H01L23/49827 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/1423 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/19033 ,  H01L2924/00

摘要： An RF package includes a multilayered dielectric substrate, a feed-through, and metal members. First and second dielectric substrates are formed on the multilayered dielectric substrate. The multilayered dielectric substrate has a cavity where a semiconductor element is to be mounted. The feed-through connects the inside and outside of the cavity and is comprised of a coplanar line formed on the first dielectric substrate and an inner layer line obtained by forming the second dielectric substrate on the coplanar line. The coplanar line and the inner layer line share a strip-like signal conductor. The metal members are formed at a connection interface between the coplanar line and the inner layer line on two sides of the signal conductor.

摘要翻译： RF封装包括多层电介质基板，馈通和金属构件。 第一和第二电介质基板形成在多层电介质基板上。 多层电介质基板具有要安装半导体元件的空腔。 馈通连接空腔的内部和外部，并且包括形成在第一电介质基板上的共面线和通过在共面线上形成第二电介质基板而获得的内层线。 共面线和内层线共享带状信号导体。 金属构件形成在信号导体两侧的共面线和内层线之间的连接界面处。

公开(公告)号：US20090238206A1

公开(公告)日：2009-09-24

申请号：US11910572

申请日：2006-03-30

申请人： Yasuhiro Hamada ,  Keiichi Ohata ,  Kenichi Maruhashi ,  Takao Morimoto ,  Masaharu Ito ,  Shuya Kishimoto

发明人： Yasuhiro Hamada ,  Keiichi Ohata ,  Kenichi Maruhashi ,  Takao Morimoto ,  Masaharu Ito ,  Shuya Kishimoto

IPC分类号： H04J3/22

CPC分类号： H04L5/143 ,  H04B1/50 ,  H04J3/1694 ,  H04L5/0037

摘要： The present invention intends to improve communication efficiency between two communication apparatuses each engaged in the communication by full duplex communication method by using a surplus band of the one to transmission band of the other. A first bandwidth required by a first communication apparatus (A) at data transmission and a second bandwidth required by a second communication apparatus (B) at data transmission are presumed. Next, the first bandwidth presumed as mentioned is compared to a first bandwidth used which the first communication apparatus (A) currently uses and at the same time, the second bandwidth presumed as mentioned is compared to a second bandwidth used which the second communication apparatus (B) currently uses. The first bandwidth and the second bandwidth are then adjusted, and a third bandwidth which the first communication apparatus (A) uses at data transmission and a fourth bandwidth which the second communication apparatus (B) uses are determined.

摘要翻译： 本发明旨在通过使用一个对另一个的传输频带的剩余频带来提高通过全双工通信方式进行通信的两个通信装置之间的通信效率。 推测第一通信装置（A）在数据传输时所需的第一带宽和第二通信装置（B）在数据传输时所需的第二带宽。 接下来，将所提到的假定的第一带宽与当前使用的第一通信装置（A）所使用的第一带宽进行比较，并且同时将假定的所述第二带宽与第二通信装置（ B）目前使用。 然后调整第一带宽和第二带宽，并确定第一通信装置（A）在数据传输时使用的第三带宽和第二通信装置（B）使用的第四带宽。

公开(公告)号：US07196598B2

公开(公告)日：2007-03-27

申请号：US10332348

申请日：2001-07-06

申请人： Kenichi Maruhashi ,  Masaharu Ito ,  Keiichi Ohata

发明人： Kenichi Maruhashi ,  Masaharu Ito ,  Keiichi Ohata

IPC分类号： H01P1/028

CPC分类号： H01P1/2088

摘要： The present invention provides a filter exhibiting excellent filter characteristics and having less number of stages. A dielectric substrate (1) has one surface connected to a top conductor (2) and an opposite surface connected to a bottom conductor (3). A pair of rows of via-holes connecting together the top conductor (2) and the bottom conductor (3) are formed along the signal transfer direction. A slit (6) is formed in a portion of the top conductor (2) overlying the central resonator among a plurality of resonators. The slit (6) extends in a direction perpendicular to the signal transfer direction. Slits (7, 8) are formed in each of portions of the top conductor (2) overlying resonators disposed at both ends. A coplanar waveguide (9) mounted on the top conductor (2) is connected to the slit (7).

摘要翻译： 本发明提供了具有优异的过滤特性并且具有较少级数的过滤器。 电介质基板（1）具有连接到顶部导体（2）的一个表面和连接到底部导体（3）的相反表面。 沿着信号传送方向形成一对连接在一起的顶部导体（2）和底部导体（3）的通孔。 在多个谐振器中的覆盖中心谐振器的顶部导体（2）的一部分中形成狭缝（6）。 狭缝（6）沿垂直于信号传送方向的方向延伸。 在位于两端的谐振器的顶部导体（2）的每个部分中形成狭缝（7,8）。 安装在顶部导体（2）上的共面波导（9）连接到狭缝（7）。

公开(公告)号：US07170373B2

公开(公告)日：2007-01-30

申请号：US10502782

申请日：2003-01-31

申请人： Masaharu Ito ,  Kenichi Maruhashi ,  Keiichi Ohata

发明人： Masaharu Ito ,  Kenichi Maruhashi ,  Keiichi Ohata

IPC分类号： H01P1/208 ,  H01P3/16

CPC分类号： H01P1/2088 ,  H01P5/107

摘要： A conductive layer is formed on each of the upper and lower surfaces of a dielectric substrate, and the two conductive layers are connected by rows of via-holes that are formed which a spacing that is less than or equal to ½ of the wavelength in the dielectric substrate in the resonance frequency, whereby n stages of dielectric resonators and input/output waveguide structures are formed. If the number n of stages is assumed to be 3, the first-stage resonator and the second-stage resonator are coupled by an electromagnetic field by means of via-holes of a first spacing; the second-stage resonator and the third-stage resonator are coupled by an electromagnetic by means of via-holes of a second spacing, whereby a filter is formed. The input/output waveguide structure and the filter are coupled by an electromagnetic by means of via-holes of a fourth spacing. The first-stage resonator and the third-stage resonator are coupled by an electromagnetic field by means of via-holes of a third spacing.

摘要翻译： 在电介质基板的上表面和下表面的每一个上形成导电层，并且两个导电层通过形成的行的通孔连接，所述通孔的间隔小于或等于 电介质基板的谐振频率，从而形成n级介质谐振器和输入/输出波导结构。 如果假设n个级数为3，则第一级谐振器和第二级谐振器通过电磁场通过第一间隔的通孔耦合; 第二级谐振器和第三级谐振器借助于具有第二间隔的通孔的电磁耦合，从而形成滤波器。 输入/输出波导结构和滤波器通过第四间隔通孔的电磁耦合。 第一级谐振器和第三级谐振器通过第三间隔的通孔由电磁场耦合。

公开(公告)号：US06674347B1

公开(公告)日：2004-01-06

申请号：US09533683

申请日：2000-03-23

申请人： Kenichi Maruhashi ,  Masaharu Ito ,  Keiichi Ohata

发明人： Kenichi Maruhashi ,  Masaharu Ito ,  Keiichi Ohata

IPC分类号： H01P308

CPC分类号： H01P3/003 ,  H05K1/0219 ,  H05K1/024 ,  H05K3/28 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/09036

摘要： A multi-layer substrate comprises a first dielectric layer, a coplanar waveguide line formed on a first surface of the first dielectric layer, the coplanar waveguide line including a signal conductor and a pair of ground conductor layers positioned at opposite sides of the signal conductor, separately from the signal conductor, and a second dielectric layer formed to cover the coplanar waveguide line and the first dielectric layer and having an opening positioned at least on the signal conductor of the coplanar waveguide line. A thickness of the first dielectric layer is smaller than the value of c/{4f·(∈1−1)½}, where c is velocity of light, f is a frequency of a signal propagating in the signal line, and ∈1 is a dielectric constant of the first dielectric layer.

摘要翻译： 多层基板包括第一介电层，形成在第一介电层的第一表面上的共面波导线，包括信号导体的共面波导线和位于信号导体的相对侧的一对接地导体层， 以及形成为覆盖共面波导线和第一介电层并且具有至少位于共面波导线的信号导体上的开口的第二介电层。 第一介质层的厚度小于c / {4f（∈1-1）½>}的值，其中c是光速，f是在信号线中传播的信号的频率，以及 ∈1是第一介电层的介电常数。

公开(公告)号：US20060244671A1

公开(公告)日：2006-11-02

申请号：US10556726

申请日：2004-04-27

申请人： Keiichi Ohata ,  Masaharu Ito ,  Shuya Kishimoto ,  Kenichi Maruhashi

发明人： Keiichi Ohata ,  Masaharu Ito ,  Shuya Kishimoto ,  Kenichi Maruhashi

IPC分类号： H01Q13/00

CPC分类号： H01P1/15

摘要： In the sector antenna of the present invention, a feeder waveguide is formed that branches midway from a feeder port to each of a plurality of antennas. This feeder waveguide is formed from a waveguide tube and includes a main feeder line that extends from a waveguide that extends from the feeder port and branches in two directions, and branch feeder lines that each branch in two directions from the two ends of the main feeder line. Sector selection structures are provided for selectively shutting off each branch waveguide by effectively forming conductive walls for blocking the cross section of each of the branch waveguides at positions of each of the branch feeder lines that branch and extend from the main feeder line and from which each branch waveguide begins.

摘要翻译： 在本发明的扇形天线中，形成了从馈线中途分支到多个天线中的馈电波导。 该馈线波导由波导管形成，并且包括从馈线端口延伸并在两个方向上分支的波导延伸的主馈线，以及分支馈线，其从主馈线的两端分支到两个方向 线。 提供了扇区选择结构，用于通过有效地形成导电壁来选择性地关闭每个分支波导，用于阻挡每个分支波导的横截面在从主馈线分支和延伸的每个分支馈线的位置， 分支波导开始。

公开(公告)号：US08045580B2

公开(公告)日：2011-10-25

申请号：US11910572

申请日：2006-03-30

申请人： Yasuhiro Hamada ,  Keiichi Ohata ,  Kenichi Maruhashi ,  Takao Morimoto ,  Masaharu Ito ,  Shuya Kishimoto

发明人： Yasuhiro Hamada ,  Keiichi Ohata ,  Kenichi Maruhashi ,  Takao Morimoto ,  Masaharu Ito ,  Shuya Kishimoto

IPC分类号： H04J3/16

CPC分类号： H04L5/143 ,  H04B1/50 ,  H04J3/1694 ,  H04L5/0037

摘要： The present invention intends to improve communication efficiency between two communication apparatuses each engaged in the communication by full duplex communication method by using a surplus band of the one to transmission band of the other. A first bandwidth required by a first communication apparatus (A) at data transmission and a second bandwidth required by a second communication apparatus (B) at data transmission are presumed. Next, the first bandwidth presumed as mentioned is compared to a first bandwidth used which the first communication apparatus (A) currently uses and at the same time, the second bandwidth presumed as mentioned is compared to a second bandwidth used which the second communication apparatus (B) currently uses. The first bandwidth and the second bandwidth are then adjusted, and a third bandwidth which the first communication apparatus (A) uses at data transmission and a fourth bandwidth which the second communication apparatus (B) uses are determined.

摘要翻译： 本发明旨在通过使用一个对另一个的传输频带的剩余频带来提高通过全双工通信方式进行通信的两个通信装置之间的通信效率。 推测第一通信装置（A）在数据传输时所需的第一带宽和第二通信装置（B）在数据传输时所需的第二带宽。 接下来，将所提到的假定的第一带宽与当前使用的第一通信装置（A）所使用的第一带宽进行比较，并且同时将假定的所述第二带宽与第二通信装置（ B）目前使用。 然后调整第一带宽和第二带宽，并确定第一通信装置（A）在数据传输时使用的第三带宽和第二通信装置（B）使用的第四带宽。

公开(公告)号：US07378925B2

公开(公告)日：2008-05-27

申请号：US10546587

申请日：2004-02-23

申请人： Masaharu Ito ,  Kenichi Maruhashi ,  Shuya Kishimoto ,  Keiichi Ohata

发明人： Masaharu Ito ,  Kenichi Maruhashi ,  Shuya Kishimoto ,  Keiichi Ohata

IPC分类号： H01P7/10

CPC分类号： H01P7/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01P7/10 ,  H03B5/1876 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An oscillator comprising a dielectric resonator (DR) has a high controllability and reproducibility of coupling between the dielectric resonator (DR) and an oscillation circuit, and an integrated circuit is reduced in size. The dielectric resonator (DR) (1) is composed of a dielectric substrate (2), grounding conductive layers (3a, 3b) formed on both sides of the dielectric substrate (2), and via holes (4a) for electrical connection between the conductive layers. A coupling element (7a) composed of a slot (5a) provided in the central portion of the grounding conductive layer (3a) and a patch (6a) surrounded by the slot (5a) is coupled to the dielectric resonator (DR) (1). The patch (6a) is connected to a transmission line (13a) on an oscillation circuit (9) through a bump (8). The transmission line (13a) is connected to the ground through a termination resistor (15a). On the oscillation circuit MMIC (9), the transmission line (13a) is connected to the gate of a transistor FET (14) A capacitive transmission line (13a) for positive feedback is connected to the transistor FET (14). The output of the transistor FET (14) is connected to a transmission line (13c) for output through a matching circuit (16). The transmission line (13c) is bump-connected to a coplanar line (12a) composed of a signal conductive layer (11a) formed on an edge of the dielectric resonator (DR) (1) and the grounding conductive layer (3a).

摘要翻译： 包括介质谐振器（DR）的振荡器具有在介质谐振器（DR）和振荡电路之间的耦合的高可控性和再现性，并且集成电路的尺寸减小。 介质谐振器（DR）（1）由电介质基片（2），形成在电介质基片（2）的两侧的接地导电层（3a，3b）和用于电气的通孔 导电层之间的连接。 由设置在接地导电层（3a）的中心部分的槽（5a）和由槽（5a）围绕的贴片（6a）组成的耦合元件（7a）耦合到介质谐振器 （DR）（1）。 贴片（6a）通过凸块（8）连接到振荡电路（9）上的传输线（13a）。 传输线路（13a）通过终端电阻器（15A）连接到地面。 在振荡电路MMIC（9）上，传输线（13a）连接到晶体管FET（14）的栅极。用于正反馈的电容传输线（13a）连接到晶体管FET（14）。 晶体管FET（14）的输出端通过匹配电路（16）连接到传输线路（13c）以进行输出。 传输线（13c）凸起连接到由形成在介质谐振器（DR）（1）的边缘上的信号导电层（11a）和接地导电层（3）构成的共面线（12a） 一个）。

公开(公告)号：US07113060B2

公开(公告)日：2006-09-26

申请号：US10332267

申请日：2001-07-06

申请人： Masaharu Ito ,  Kenichi Maruhashi ,  Keiichi Ohata

发明人： Masaharu Ito ,  Kenichi Maruhashi ,  Keiichi Ohata

IPC分类号： H01P1/208

CPC分类号： H01P1/2088

摘要： A dielectric waveguide tube band-pass filter assuming lower characteristic change upon mounting, and having smaller dimensions and lower loss. Conductor layers (2a, 2c) are formed on the top and bottom surfaces of a dielectric substrate (1), wherein the top conductor layer 2a and the bottom conductor layer 2c are connected together through via-holes (3a). The via-holes (3a) are formed in at least two rows along the signal transfer direction. In the dielectric waveguide tube configured by the top and bottom conductor layers (2a, 2c) and the via-holes (3a), via-holes (3b) are arranged in the signal transfer direction at spacing equal to or below ½ of the in-tube wavelength to thereby configure resonators. The dielectric band-pass filter is configured by coupling adjacent resonators together through the via-holes (3b) configuring inductive windows. On the surface of the dielectric substrate (1), a co-planar line (4) including the conductor layer (2) as the ground and the conductor layer (2b) as a signal conductor is configured so as to overstride the inductive windows configured by the via-holes (3a).

摘要翻译： 介质波导管带通滤波器，其安装时的特性变化较小，尺寸较小，损耗较小。 导体层（2a，2c）形成在电介质基板（1）的顶表面和底表面上，其中顶导体层2a和底导体层2c通过通孔（3a）连接在一起， 。 通孔（3a）沿着信号传送方向至少形成两行。 在由顶部和底部导体层（2a，2c）和通孔（3a）构成的电介质波导管中，通孔（3b）以信号传输方向布置在等于或低于 一半的管内波长，从而配置谐振器。 介质带通滤波器通过将构成感应窗口的通孔（3b）耦合在一起而构成。 在电介质基板（1）的表面上，包括作为接地的导体层（2）和作为信号导体的导体层（2b）的共平面线（4）构成为跨越构成的电感窗 通过通孔（3a）。