摘要:
A method of enhancing ocular penetration of a drug in an eyedrop by administering to an eye, an eyedrop containing, particulate agar having a weight-average molecular weight of from 5,000 to 1,200,000, the particulate agar being obtained by dissolving agar into an aqueous solution by heating and then cooling the resultant mixture to avoid gelling, while applying a stress by vibration, shearing, stirring, compression or pulverizing, wherein the particulate agar is in an amount of 0.1 to 10 wt %.
摘要:
It is intended to prepare a composition which contains polysaccharide at a high concentration and yet remains in the state of a liquid having low viscosity to thereby provide drugs, eyedrops, foods, cosmetics, toiletry products having a novel texture or function. The composition in the state of a liquid having low viscosity is obtained by heating polysaccharide at a high concentration in a water-containing liquid and then cooling under applying a shear force, which enables the provision of the above-described drugs. The composition is usable as an aqueous drug vehicle which is free from gelling due to temperature changes during storage and easily applied without pouring and/or streaming down. Eyedrops containing agar have an effect of enhancing ocular drug penetration. Eyedrops containing particulate agar maintain a low viscosity and, achieve easy instillation and impart a favorable feel in instillation.
摘要:
A higher aspect ratio for upper level metal interconnects is described for use in higher frequency circuits. Because the skin effect reduces the effective cross-sectional area of conductors at higher frequencies, various approaches are described to reduce the effective RC delay in interconnects.
摘要:
It is important to assess and reduce errors that arise in mask correction techniques such as optical proximity correction. A preliminary mask is obtained using an OPC model. An etched wafer is created from the preliminary mask using lithography, and first and second critical dimensions (CD) are measured on the wafer and. An edge placement error (EPE) is determined that corresponds to a difference between a measured value and a desired value of the second CD. These steps are repeated for a plurality of different values of the first CD, and of for each of the values of, the measured value of the second CD is correlated with its corresponding value on the mask as predicted by the OPC model. Δ difference ΔCD is obtained between the difference of the mask CDs calculated by interpolation of wafer CD measurements and by OPC model predictions and is transformed into an OPC model error.
摘要:
A semiconductor device according to one embodiment includes: a substrate having an element region where a semiconductor element is formed; a via hole formed in a portion of the substrate adjacent to the element region; a conducting portion provided in the via hole via an insulating layer; and a buffer layer provided between the substrate and the insulating layer, wherein the buffer layer is made of a material in which a difference in thermal expansion coefficient between the substrate and the buffer layer is smaller than that between the substrate and the insulating layer.
摘要:
At present, Cu (copper) is being used as a wiring material. In an RF-CMOS device as a combination of an RF analog device and CMOS logic device, two electrodes of a MIM capacitor are formed from Cu having a large diffusion coefficient. To prevent Cu from diffusing to the capacitor insulating film of the MIM capacitor, diffusion prevention films having a function of preventing diffusion of Cu are interposed between the capacitor insulating film and the two electrodes. As a result, Cu forming the electrodes does not diffuse to the capacitor insulating film.
摘要:
A method for fabricating a semiconductor device at low cost is provided in which a mask layer having a very large polishing selection ratio is used as a polishing stop film by forming the polishing stop film in self-alignment. An object layer to be flattened is formed on a substrate. The object layer contains an irregularity. A polishing stop film which is polished at a slower rate and a mask layer which is polished at about the same rate as the object layer are deposited on the object layer. Then, the mask layer on a high level portion of the object layer is removed by chemical-mechanical polishing. The polishing stop film is etched other than under the mask layer, so that the polishing stop film at the high level portion and side wall of the step is removed. Because the polishing stop film at the convex portions (high level portion) is removed by etching utilizing a chemical reaction without using chemical-mechanical polishing, it is possible to select a material for the polishing stop film which is polished at a very slow rate. After that, the mask layer and the object layer at the convex portion are removed by CMP to level off the object layer with the concave portion.
摘要:
A process for producing a polyphenylene sulfide resin with properties of (1) 0.3 wt % or less in the amount of the volatile gas generated when heated and melted at 320° C. in vacuum for 2 hours, (2) 0.3 wt % or less in the ash content achieved when incinerated at 550° C., (3) 4.0 wt % or less in the residue amount achieved when a solution with 1 part by weight of the polyphenylene sulfide resin dissolved in 20 parts by weight of 1-chloronaphthalene is pressure-filtered by a PTFE membrane filter with a pore size of 1 μm at 250° C. for 5 minutes, and (4) higher than 500 g/10 min in melt flow rate (according to ASTM D-1238-70: measured at a temperature of 315.5° C. and at a load of 5000 g), by acid-treating a polyphenylene sulfide resin in an acid treatment step and subsequently treating it for thermal oxidation in a thermal oxidation step.
摘要:
A method is provided of accessing model error in an optical proximity correction (OPC) model. The method begins by obtaining a preliminary mask using an OPC model, creating an etched wafer from the preliminary mask using lithography, and measuring a specified critical dimension (CD) on the wafer and a second CD on the wafer. An edge placement error (EPE) is determined that corresponds to a difference between a measured value of the second CD on the wafer and a desired value of the second CD on the wafer. The aforementioned steps are repeated for a plurality of different values of the specified CD to obtain an EPE for each of the different values of the specified CD. For each of the plurality of values of the specified CD, a measured value of a second CD on the wafer is correlated with a corresponding value of the second CD on the mask. For each of the plurality of values of the specified CD, the measured value of the second CD on the wafer is correlated with its corresponding value of the second CD on the mask as predicted by the OPC model. For each of the immediately preceding correlations that are obtained, and at a selected measured value of the second CD on the wafer, a difference Δ is obtained between the difference of the mask CDs calculated by interpolation of wafer CD measurements and by OPC model predictions. Each value of Δ is transformed into an OPC model error that each correspond to a particular value of the specified CD.
摘要:
Aromatic compounds having an alkyl group with at least 3 carbon atoms are produced in a process comprising at least one of the following steps: (1) a step of contacting a starting material that contains an aromatic compound having a branched alkyl group with at least 3 carbon atoms, with a zeolite-containing catalyst in a liquid phase in the presence of hydrogen therein, thereby changing the position of the carbon atoms of the alkyl group bonding to the aromatic ring of the compound; (2) a step of contacting a starting material that contains an aromatic compound having a branched alkyl group with at least 3 carbon atoms, with a catalyst containing zeolite and containing rhenium and/or silver, in a liquid phase, thereby changing the position of the carbon atoms of, the alkyl group bonding to the aromatic ring of the compound; (3) a step of contacting a halogenated aromatic compound having an alkyl group with at least 3 carbon atoms, with an acid-type catalyst, thereby isomerizing the compound; (4) a step of treating a mixture of isomers of an aromatic compound having an alkyl group with at least 3 carbon atoms, with a zeolite adsorbent that contains at least one exchangable cation selected from alkali metals, alkaline earth metals, lead, thallium and silver, thereby separating a specific isomer from the isomer mixture through adsorption.