摘要:
An erasable programmable read-only memory with NAND cell structure includes NAND cell blocks, each of which has a selection transistor connected to the corresponding bit line and a series array of memory cell transistors, and a switching transistor connected between the series array of memory cell transistors and ground. Each cell transistor has a floating gate and a control gate. Word lines are connected to the control gates of the cell transistors. In a data writing mode, a selection transistor of a certain cell block containing a selected cell is rendered conductive, so that this cell block is connected to the corresponding bit line. Under such a condition, a decoder circuit stores a desired data (a logic "one" e.g.) in the selected cell, by applying an "H" level voltage to the bit line, applying an "L" level voltage to a word line connected to the selected cell, applying the "H" level voltage to a memory cell or cells positioned between the selected cell and the bit line, and applying the "L" level voltage to a memory cell or cells positioned between the selected cell and the ground. The selection transistor and switching transistor for a corresponding series array of memory cell transistors have different channel lengths to reduce punch through.
摘要:
A process for forming an array of FATMOS transistors serving as memory cells of a NAND cell type EEPROM. A multi-layered structure is provided on a substrate with two stacked conductive layers insulated by an intermediate insulative layer, the first or inner conductive layer being insulated by a first insulative layer from the substrate, the second or outer conductive layer being covered with a second insulative layer. The second insulative layer is etched to define a first array of etched layer portions. A photoresist layer is deposited and etched to define a second array of layer portions, each of which is positioned between two neighboring ones of the first array of layer portions. The multi-layered structure is etched with the first and second layer portions being as a mask, to thereby form an array of a plurality of pairs of insulated gate electrodes above the substrate. A chosen impurity is doped into the substrate with the insulated gate electrodes serving as a mask to thereby form impurity-doped regions in the substrate.
摘要:
An electrically erasable programmable read-only memory with a NAND cell structure has parallel bit lines, and memory cells defining NAND cell blocks, each of which has a series-circuit of memory cell transistors. Each transistor has a floating gate and a control gate. Parallel word lines are connected to the control gates of the cell transistors. The first, second and third intermediate voltages are used in the data write mode: the first voltage is lower than the "H" level voltage and higher than the "L" level voltage; the second and third voltages are higher than the first voltage and lower than the "H" level voltage. Data is written into a selected memory cell transistor of a NAND cell block, by applying the "H" level voltage to a word line connected to the selected transistor, applying the second voltage to the remaining unselected word lines, applying a corresponding bit line associated with the selected transistor with one of the first and third voltages which is selected in accordance with a logic level of the data, and applying unselected bit lines with the third voltage, whereby carriers are moved by tunneling from or to the floating gate of the selected memory cell transistor.
摘要:
An electrically erasable programmable read-only memory with a NAND cell structure has parallel bit lines, and memory cells defining NAND cell blocks, each of which has a series-circuit of memory cell transistors. Each transistor has a floating gate and a control gate. Parallel word lines are connected to the control gates of the cell transistors. The first, second and third intermediate voltages are used in the data write mode: the first voltage is lower than the "H" level voltage and higher than the "L" level voltage; the second and third voltages are higher than the first voltage and lower than the "H" level voltage. Data is written into a selected memory cell transistor of a NAND cell block, by applying the "H" level voltage to a word line connected to the selected transistor, applying the second voltage to the remaining unselected word lines, applying a corresponding bit line associated with the selected transistor with one of the first and third voltages which is selected in accordance with a logic level of the data, and applying unselected bit lines with the third voltage, whereby carriers are moved by tunneling from or to the floating gate of the selected memory cell transistor.
摘要:
A dynamic random access memory system comprises first and second memory banks. A plurality of memory cells connected to a word line are grouped into first and second groups. The first group is arranged in the first memory bank and the second group is arranged in the second memory bank. Read/write means is provided in which each n bits from and to the first group and each n bits from and to the second group are read and written alternatively. Each bit is read and written in synchronism with the toggles of a column address strobe signal.
摘要:
A sense amplifier is connected between memory cell arrays, a re-writing register is arranged in position adjacent to the sense amplifier, transfer gates are disposed between the sense amplifier and the memory cell arrays, transfer gates are provided between bit lines of the memory cell arrays and global bit lines, and a gate control circuit for controlling the transfer gates is provided. When readout data is written into the register, the node of the sense amplifier is electrically separated from the bit lines and global bit lines.
摘要:
A semiconductor memory device comprises an array of memory cell units, each of which has a plurality of MOS transistors connected in series and a plurality of information storage capacitors corresponding in number to the MOS transistors and each having its one end connected to the source of a corresponding one of the MOS transistors, and a plurality of register groups each of which is adapted to temporarily store information stored in one of the memory cell units for each column of the array in order to read from and write into each memory cell unit.
摘要:
A semiconductor memory device includes a plurality of memory cells each having a bipolar transistor whose collector-emitter voltage V.sub.CE is controlled according to the base potential to satisfy the condition of I.sub.BE
摘要:
Here is disclosed a dynamic semiconductor memory of high integration density, which has parallel word lines and parallel bit lines formed on a substrate. The bit lines include a pair of bit lines. A memory cell is coupled to a word line and to one bit line of the bit-line pair. The memory cell is composed of MOSFETs of a submicron size. A sense amplifier section is connected to the pair of bit lines, and senses and amplifies the potential difference between the pair of bit lines in a data readout mode. The amplifier section has a BIMOS structure, having MOSFETs and bipolar transistors. It has a driver section comprised of bipolar transistors.