公开(公告)号：US20140034369A1

公开(公告)日：2014-02-06

申请号：US14110680

申请日：2012-02-01

申请人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

发明人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC分类号： H05K1/02 ,  H05K3/10

CPC分类号： H05K1/02 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/10 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2203/1476 ,  Y10T29/49162

摘要： Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface.

摘要翻译： 提供一种陶瓷布线基板，其具有能够可靠地夹持或钩挂的侧面; 用于提供多个布线基板的多片式布线基板阵列; 以及可靠地制造多片式布线基板阵列的方法。 布线基板由陶瓷材料形成，在平面图中具有正方形（矩形）形状，并且具有前表面，后表面和位于前表面和后表面之间的侧表面，其中每个侧面 表面具有带状的不平坦表面，该表面包括多个交替平行的凸起部分和形成为沿前表面延伸的凹部，并且还具有位于背面侧的断裂面。

公开(公告)号：US09232643B2

公开(公告)日：2016-01-05

申请号：US14006047

申请日：2012-02-01

申请人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

发明人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/40

CPC分类号： H05K1/0298 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/46 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2203/0346 ,  Y10T29/49155

摘要： Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate includes a substrate main body, which has a front surface, a back surface, side surfaces, a groove surface located on a side toward the front surface, and a fracture surface located on a side toward the back surface; and a notch which has a concave shape in plan view, and which is provided on at least one of the side surfaces so as to extend between the front surface and the back surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has curved portions on opposite sides of the notch, the curved portions being convex toward the front surface of the substrate main body in side view.

摘要翻译： 提供一种陶瓷布线基板; 用于提供多个布线基板的多片陶瓷布线基板阵列; 以及可靠地制造布线基板阵列的方法。 陶瓷布线基板包括：基板主体，具有前表面，后表面，侧面，位于前表面侧的槽表面和位于背面侧的断裂面; 以及在平面图中具有凹形形状的凹口，并且设置在至少一个侧面上，以便在前表面和后表面之间延伸，其中在具有凹口的侧表面中， 凹槽表面和断裂表面在凹口的相对侧上具有弯曲部分，弯曲部分在侧视图中朝向基板主体的前表面凸出。

公开(公告)号：US20140034372A1

公开(公告)日：2014-02-06

申请号：US14006047

申请日：2012-02-01

申请人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

发明人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC分类号： H05K1/02 ,  H05K3/46

CPC分类号： H05K1/0298 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/46 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2203/0346 ,  Y10T29/49155

摘要： Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate includes a substrate main body, which has a front surface, a back surface, side surfaces, a groove surface located on a side toward the front surface, and a fracture surface located on a side toward the back surface; and a notch which has a concave shape in plan view, and which is provided on at least one of the side surfaces so as to extend between the front surface and the back surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has curved portions on opposite sides of the notch, the curved portions being convex toward the front surface of the substrate main body in side view.

摘要翻译： 提供一种陶瓷布线基板; 用于提供多个布线基板的多片陶瓷布线基板阵列; 以及可靠地制造布线基板阵列的方法。 陶瓷布线基板包括：基板主体，具有前表面，后表面，侧面，位于前表面侧的槽表面和位于背面侧的断裂面; 以及在平面图中具有凹形形状的凹口，并且设置在至少一个侧面上，以便在前表面和后表面之间延伸，其中在具有凹口的侧表面中， 凹槽表面和断裂表面在凹口的相对侧上具有弯曲部分，弯曲部分在侧视图中朝向基板主体的前表面凸出。

公开(公告)号：US09295151B2

公开(公告)日：2016-03-22

申请号：US14000568

申请日：2012-02-01

申请人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

发明人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC分类号： H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H01L23/13 ,  H01L23/10 ,  H01L23/498 ,  C04B41/00 ,  H05K1/14 ,  H01L23/15

CPC分类号： H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

摘要： A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.

摘要翻译： 布线基板包括由陶瓷层叠体形成的矩阵形状的基板主体，并且具有前表面和后表面，并且具有四个侧表面，每个侧表面位于前表面和背面之间 表面，并且具有位于朝向前表面的一侧的凹槽表面和位于朝向后表面的一侧的断裂表面; 以及金属化层，其形成在所述基板主体的前表面上，以便沿着所述四个侧表面延伸，并且在平面图中具有矩形框架形状，其中所述基板主体的陶瓷层叠体的水平表面 在金属化层与基板主体的各侧面的槽面之间露出。

公开(公告)号：US20150107879A1

公开(公告)日：2015-04-23

申请号：US14000568

申请日：2012-02-01

申请人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

发明人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC分类号： H05K1/03 ,  C04B41/00 ,  H05K1/14

CPC分类号： H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

摘要： A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.

摘要翻译： 布线基板包括由陶瓷层叠体形成的矩阵形状的基板主体，并且具有前表面和后表面，并且具有四个侧表面，每个侧表面位于前表面和背面之间 表面，并且具有位于朝向前表面的一侧的凹槽表面和位于朝向后表面的一侧的断裂表面; 以及金属化层，其形成在所述基板主体的前表面上，以便沿着所述四个侧表面延伸，并且在平面图中具有矩形框架形状，其中所述基板主体的陶瓷层叠体的水平表面 在金属化层与基板主体的各侧面的槽面之间露出。

公开(公告)号：US08987604B2

公开(公告)日：2015-03-24

申请号：US14110680

申请日：2012-02-01

申请人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

发明人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC分类号： H05K1/03 ,  H05K1/02 ,  H05K3/00 ,  H05K3/10

CPC分类号： H05K1/02 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/10 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2203/1476 ,  Y10T29/49162

摘要： Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface.

摘要翻译： 提供一种陶瓷布线基板，其具有能够可靠地夹持或钩挂的侧面; 用于提供多个布线基板的多片式布线基板阵列; 以及可靠地制造多片式布线基板阵列的方法。 布线基板由陶瓷材料形成，在平面图中具有正方形（矩形）形状，并且具有前表面，后表面和位于前表面和后表面之间的侧表面，其中每个侧面 表面具有带状的不平坦表面，该表面包括多个交替平行的凸起部分和形成为沿着前表面延伸的凹部，并且还具有位于背面侧的断裂面。

公开(公告)号：US08952269B2

公开(公告)日：2015-02-10

申请号：US14111486

申请日：2012-02-01

申请人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

发明人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC分类号： H05K1/11 ,  B32B3/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40

CPC分类号： H05K1/0306 ,  H05K1/113 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/381 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T428/24479 ,  Y10T428/24612

摘要： Provided are a wiring substrate; a multi-piece wiring substrate array; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate includes a substrate main body, which has first and second main surfaces, side surfaces, a groove surface, and a fracture surface; and a notch which has a concave shape in plan view, and which is provided on a side surface on a side toward the first main surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has first curved portions on opposite sides of the notch, the first curved portions being convex toward the first main surface in side view; and also has a second curved portion on a second-main-surface side of the notch, the second curved portion being convex toward the second main surface of the substrate main body in side view.

摘要翻译： 提供布线基板; 多件式布线基板阵列; 以及可靠地制造多片式布线基板阵列的方法。 布线基板包括具有第一和第二主表面，侧表面，凹槽表面和断裂表面的基板主体; 以及在平面图中具有凹形的凹口，并且设置在朝向第一主表面的一侧的侧表面上，其中在具有凹口的侧表面中，凹槽表面和断裂面之间的边界具有 第一弯曲部分在凹口的相对侧上是第一弯曲部分，在侧视图中朝着第一主表面凸出; 并且在凹口的第二主表面侧上还具有第二弯曲部分，第二弯曲部分在侧视图中朝向基板主体的第二主表面凸出。

公开(公告)号：US20140037912A1

公开(公告)日：2014-02-06

申请号：US14111486

申请日：2012-02-01

申请人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

发明人： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC分类号： H05K1/03 ,  H05K3/00

CPC分类号： H05K1/0306 ,  H05K1/113 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/381 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T428/24479 ,  Y10T428/24612

摘要： Provided are a wiring substrate; a multi-piece wiring substrate array; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate includes a substrate main body, which has first and second main surfaces, side surfaces, a groove surface, and a fracture surface; and a notch which has a concave shape in plan view, and which is provided on a side surface on a side toward the first main surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has first curved portions on opposite sides of the notch, the first curved portions being convex toward the first main surface in side view; and also has a second curved portion on a second-main-surface side of the notch, the second curved portion being convex toward the second main surface of the substrate main body in side view.

摘要翻译： 提供布线基板; 多件式布线基板阵列; 以及可靠地制造多片式布线基板阵列的方法。 布线基板包括具有第一和第二主表面，侧表面，凹槽表面和断裂表面的基板主体; 以及在平面图中具有凹形的凹口，并且设置在朝向第一主表面的一侧的侧表面上，其中在具有凹口的侧表面中，凹槽表面和断裂面之间的边界具有 第一弯曲部分在凹口的相对侧上是第一弯曲部分，在侧视图中朝着第一主表面凸出; 并且在凹口的第二主表面侧上还具有第二弯曲部分，第二弯曲部分在侧视图中朝向基板主体的第二主表面凸出。

公开(公告)号：US07295235B2

公开(公告)日：2007-11-13

申请号：US10663767

申请日：2003-09-17

申请人： Satoshi Hirayama ,  Yasuhiro Sekine

发明人： Satoshi Hirayama ,  Yasuhiro Sekine

IPC分类号： H04N3/14 ,  H04N5/225

CPC分类号： H01L31/02162 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L31/02327

摘要： A solid-state image pickup device includes a photoelectric conversion portion for generating signal electric charges in accordance with an amount of incident light, a plurality of color filters, and a flattening layer formed on the plurality of color filters. A thickness of a projection or a recess on a surface of the flattening layer, provided on a region where color filters are adjacent to each other, is equal to or less than 0.2 μm.

摘要翻译： 固态图像拾取装置包括：用于根据入射光量产生信号电荷的光电转换部分，多个滤色器以及形成在多个滤色器上的平坦化层。 设置在滤色器彼此相邻的区域上的平坦化层的表面上的突起或凹部的厚度等于或小于0.2μm。

公开(公告)号：US06350604B1

公开(公告)日：2002-02-26

申请号：US09177234

申请日：1998-10-22

申请人： Satoshi Hirayama ,  Rikako Taira ,  Kim Borch ,  Thomas Sandal ,  Torben Halkier ,  Karen Margrethe Oxenbøll ,  Bjarne Rønfeldt Nielsen

发明人： Satoshi Hirayama ,  Rikako Taira ,  Kim Borch ,  Thomas Sandal ,  Torben Halkier ,  Karen Margrethe Oxenbøll ,  Bjarne Rønfeldt Nielsen

IPC分类号： C12N920

CPC分类号： C11D3/38627 ,  C12N9/20

摘要： Lipolytic enzymes with high activity at alkaline pH in the absence of Ca++ can be obtained from filamentous fungi of the genera Gliocladium, Verticillium and Trichophaea and that the lipolytic enzymes are effective for improving the effect of detergents. The lipolytic enzymes have a good washing performance, as expressed by the hydrolysis of oil on textile swatches. The amino acid sequences of the lipolytic enzymes are highly homologous.

摘要翻译： 在不含Ca ++的碱性pH下具有高活性的脂解酶可以从Gliocladium，轮枝孢属和Trichophaea属的丝状真菌获得，并且脂肪分解酶对于改善洗涤剂的效果是有效的。 脂肪分解酶具有良好的洗涤性能，如织物样品上的油水解所表达的。 脂肪分解酶的氨基酸序列是高度同源的。