SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    1.
    发明申请
    SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效
    半导体器件及制造半导体器件的方法

    公开(公告)号:US20120025294A1

    公开(公告)日:2012-02-02

    申请号:US13208454

    申请日:2011-08-12

    IPC分类号: H01L29/788 H01L21/336

    摘要: There is provided a semiconductor device in which degradation of reliability originating in the interface between an upper insulating layer and an element isolation insulating layer is suppressed. The semiconductor device includes: a semiconductor region; a plurality of stacked structures each of which is disposed on the semiconductor region and has a tunnel insulating film, a charge storage layer, an upper insulating layer, and a control electrode stacked sequentially; an element isolation insulating layer disposed on side faces of the plurality of stacked structures; and a source-drain region disposed on the semiconductor region and among the plurality of stacked structures. The element isolation insulating layer includes at least one of SiO2, SiN, and SiON, the upper insulating layer is an oxide containing at least one metal M selected from the group consisting of a rare earth metal, Y, Zr, and Hf, and Si, and respective lengths Lcharge, Ltop, and Lgate of the charge storage layer, the upper insulating layer, and the control electrode in a channel length direction satisfy the relation “Lcharge

    摘要翻译: 提供一种半导体器件,其中抑制源于上绝缘层和元件隔离绝缘层之间的界面的可靠性的劣化。 半导体器件包括:半导体区域; 多个堆叠结构,其各自设置在所述半导体区域上,并且具有依次堆叠的隧道绝缘膜,电荷存储层,上绝缘层和控制电极; 设置在所述多个堆叠结构的侧面上的元件隔离绝缘层; 以及设置在半导体区域和多个堆叠结构中的源极 - 漏极区域。 元件隔离绝缘层包括SiO 2,SiN和SiON中的至少一种,上绝缘层是含有选自稀土金属,Y,Zr和Hf中的至少一种金属M的氧化物,Si ,并且沟道长度方向上的电荷存储层,上绝缘层和控制电极的各自的长度Lcharge,Ltop和Lgate满足关系“Lcharge

    Nonvolatile memory device
    2.
    发明授权
    Nonvolatile memory device 有权
    非易失性存储器件

    公开(公告)号:US09379320B2

    公开(公告)日:2016-06-28

    申请号:US13362832

    申请日:2012-01-31

    摘要: According to one embodiment, a nonvolatile memory device includes a memory section. The memory section includes a first insulating layer, a second insulating layer and a pair of electrodes. The second insulating layer is formed on and in contact with the first insulating layer. The second insulating layer has at least one of a composition different from a composition of the first insulating layer and a phase state different from a phase state of the first insulating layer. The pair of electrodes is capable of passing a current through a current path along a boundary portion between the first insulating layer and the second insulating layer. An electrical resistance of the current path is changed by a voltage applied between the pair of electrodes.

    摘要翻译: 根据一个实施例,非易失性存储器件包括存储器部分。 存储部分包括第一绝缘层,第二绝缘层和一对电极。 第二绝缘层形成在第一绝缘层上并与第一绝缘层接触。 第二绝缘层具有与第一绝缘层的组成不同的组成和与第一绝缘层的相位状态不同的相位状态中的至少一个。 一对电极能够使电流通过沿着第一绝缘层和第二绝缘层之间的边界部分的电流路径。 通过施加在该对电极之间的电压来改变电流路径的电阻。

    NONVOLATILE MEMORY DEVICE
    4.
    发明申请
    NONVOLATILE MEMORY DEVICE 有权
    非易失性存储器件

    公开(公告)号:US20120193597A1

    公开(公告)日:2012-08-02

    申请号:US13362832

    申请日:2012-01-31

    IPC分类号: H01L45/00 H01L27/06 H01L27/24

    摘要: According to one embodiment, a nonvolatile memory device includes a memory section. The memory section includes a first insulating layer, a second insulating layer and a pair of electrodes. The second insulating layer is formed on and in contact with the first insulating layer. The second insulating layer has at least one of a composition different from a composition of the first insulating layer and a phase state different from a phase state of the first insulating layer. The pair of electrodes is capable of passing a current through a current path along a boundary portion between the first insulating layer and the second insulating layer. An electrical resistance of the current path is changed by a voltage applied between the pair of electrodes.

    摘要翻译: 根据一个实施例,非易失性存储器件包括存储器部分。 存储部分包括第一绝缘层,第二绝缘层和一对电极。 第二绝缘层形成在第一绝缘层上并与第一绝缘层接触。 第二绝缘层具有与第一绝缘层的组成不同的组成和与第一绝缘层的相位状态不同的相位状态中的至少一个。 一对电极能够使电流通过沿着第一绝缘层和第二绝缘层之间的边界部分的电流路径。 通过施加在该对电极之间的电压来改变电流路径的电阻。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
    5.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE 有权
    半导体器件及制造半导体器件的方法

    公开(公告)号:US20090242963A1

    公开(公告)日:2009-10-01

    申请号:US12234197

    申请日:2008-09-19

    摘要: In a semiconductor device, the side walls are made of SiO2, SiN or SiON, and the top insulating film or gate insulating film is made of an oxide including Al, Si, and metal element M so that the number ratio Si/M is set to no less than a number ratio Si/M at a solid solubility limit of SiO2 composition in a composite oxide including metal element M and Al and set to no more than a number ratio Si/M at the condition that the dielectric constant is equal to the dielectric constant of Al2O3 and so that the number ratio Al/M is set to no less than a number ratio Al/M where the crystallization of an oxide of said metal element M is suppressed due to the Al element and set to no more than a number ratio Al/M where the crystallization of the Al2O3 is suppressed due to the metal element M.

    摘要翻译: 在半导体器件中,侧壁由SiO 2,SiN或SiON制成,并且顶部绝缘膜或栅极绝缘膜由包括Al,Si和金属元素M的氧化物制成,使得Si / M的数量比设定 在包含金属元素M和Al的复合氧化物中SiO 2组成的固溶度极限的Si / M的数量比不小于Si / M,并且在介电常数等于 Al 2 O 3的介电常数和Al / M的数量比被设定为不小于Al / M的数量比,其中所述金属元素M的氧化物的结晶由于Al元素而被抑制,并且设定为不大于 由于金属元素M而抑制了Al 2 O 3的结晶化的数值比Al / M

    Semiconductor device, and method for manufacturing semiconductor device
    6.
    发明授权
    Semiconductor device, and method for manufacturing semiconductor device 失效
    半导体装置及半导体装置的制造方法

    公开(公告)号:US08558301B2

    公开(公告)日:2013-10-15

    申请号:US13208454

    申请日:2011-08-12

    IPC分类号: H01L29/76

    摘要: There is provided a semiconductor device in which degradation of reliability originating in the interface between an upper insulating layer and an element isolation insulating layer is suppressed. The semiconductor device includes: a semiconductor region; a plurality of stacked structures each of which is disposed on the semiconductor region and has a tunnel insulating film, a charge storage layer, an upper insulating layer, and a control electrode stacked sequentially; an element isolation insulating layer disposed on side faces of the plurality of stacked structures; and a source-drain region disposed on the semiconductor region and among the plurality of stacked structures. The element isolation insulating layer includes at least one of SiO2, SiN, and SiON, the upper insulating layer is an oxide containing at least one metal M selected from the group consisting of a rare earth metal, Y, Zr, and Hf, and Si, and respective lengths Lcharge, Ltop, and Lgate of the charge storage layer, the upper insulating layer, and the control electrode in a channel length direction satisfy the relation “Lcharge

    摘要翻译: 提供一种半导体器件,其中抑制源于上绝缘层和元件隔离绝缘层之间的界面的可靠性的劣化。 半导体器件包括:半导体区域; 多个堆叠结构,其各自设置在所述半导体区域上,并且具有依次堆叠的隧道绝缘膜,电荷存储层,上绝缘层和控制电极; 设置在所述多个堆叠结构的侧面上的元件隔离绝缘层; 以及设置在半导体区域和多个堆叠结构中的源极 - 漏极区域。 元件隔离绝缘层包括SiO 2,SiN和SiON中的至少一种,上绝缘层是含有选自稀土金属,Y,Zr和Hf中的至少一种金属M的氧化物,Si ,并且沟道长度方向上的电荷存储层,上绝缘层和控制电极的各自的长度Lcharge,Ltop和Lgate满足关系“Lcharge

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    7.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE 有权
    非易失性半导体存储器件

    公开(公告)号:US20100072535A1

    公开(公告)日:2010-03-25

    申请号:US12506588

    申请日:2009-07-21

    IPC分类号: H01L29/792

    摘要: A nonvolatile semiconductor memory device includes a source region and a drain region provided apart from each other in a semiconductor substrate, a first insulating film provided on a channel region between the source region and the drain region, a charge storage layer provided on the first insulating film, a second insulating film provided on the charge storage layer and including a stacked structure of a lanthanum aluminum silicate film and a dielectric film made of silicon oxide or silicon oxynitride, and a control gate electrode provided on the second insulating film.

    摘要翻译: 非易失性半导体存储器件包括在半导体衬底中彼此分开设置的源极区域和漏极区域,设置在源极区域和漏极区域之间的沟道区域上的第一绝缘膜,设置在第一绝缘体上的电荷存储层 膜,设置在电荷存储层上并包括硅酸铝镧硅酸盐膜和由氧化硅或氮氧化硅制成的电介质膜的叠层结构的第二绝缘膜和设置在第二绝缘膜上的控制栅电极。

    Nonvolatile semiconductor memory device with high-K insulating film
    9.
    发明授权
    Nonvolatile semiconductor memory device with high-K insulating film 失效
    具有高K绝缘膜的非易失性半导体存储器件

    公开(公告)号:US08482053B2

    公开(公告)日:2013-07-09

    申请号:US13204412

    申请日:2011-08-05

    IPC分类号: H01L29/792

    摘要: According to one embodiment, a nonvolatile semiconductor memory device includes a source region and a drain region provided on a surface area of a semiconductor region, a tunnel insulating film provided on a channel between the source region and the drain region, a charge storage layer provided on the tunnel insulating film, a first dielectric film provided on the charge storage layer and containing lanthanum aluminum silicon oxide or oxynitride, a second dielectric film provided on the first dielectric film and containing oxide or oxynitride containing at least one of hafnium (Hf), zirconium (Zr), titanium (Ti), and a rare earth metal, and a control gate electrode provided on the second dielectric film.

    摘要翻译: 根据一个实施例,非易失性半导体存储器件包括设置在半导体区域的表面区域上的源极区域和漏极区域,设置在源极区域和漏极区域之间的沟道上的隧道绝缘膜,设置有电荷存储层 在隧道绝缘膜上,设置在电荷存储层上并含有镧铝氧化物或氧氮化物的第一电介质膜,设置在第一电介质膜上并含有氧化物或氮氧化物的第二电介质膜,其含有铪(Hf), 锆(Zr),钛(Ti)和稀土金属,以及设置在第二电介质膜上的控制栅电极。

    Nonvolatile semiconductor memory device
    10.
    发明授权
    Nonvolatile semiconductor memory device 有权
    非易失性半导体存储器件

    公开(公告)号:US08193577B2

    公开(公告)日:2012-06-05

    申请号:US12506588

    申请日:2009-07-21

    摘要: A nonvolatile semiconductor memory device includes a source region and a drain region provided apart from each other in a semiconductor substrate, a first insulating film provided on a channel region between the source region and the drain region, a charge storage layer provided on the first insulating film, a second insulating film provided on the charge storage layer and including a stacked structure of a lanthanum aluminum silicate film and a dielectric film made of silicon oxide or silicon oxynitride, and a control gate electrode provided on the second insulating film.

    摘要翻译: 非易失性半导体存储器件包括在半导体衬底中彼此分开设置的源极区域和漏极区域,设置在源极区域和漏极区域之间的沟道区域上的第一绝缘膜,设置在第一绝缘体上的电荷存储层 膜,设置在电荷存储层上并包括硅酸铝镧硅酸盐膜和由氧化硅或氮氧化硅制成的电介质膜的叠层结构的第二绝缘膜和设置在第二绝缘膜上的控制栅电极。