公开(公告)号：US6123874A

公开(公告)日：2000-09-26

申请号：US17949

申请日：1998-02-03

申请人： Masashi Fukaya ,  Tomoko Matsuo ,  Yoshinobu Watanabe ,  Chiaki Higuchi

发明人： Masashi Fukaya ,  Tomoko Matsuo ,  Yoshinobu Watanabe ,  Chiaki Higuchi

IPC分类号： H05K1/16 ,  H01C7/00 ,  H01C17/065 ,  H05K3/12 ,  H01B1/02 ,  H01B1/06

CPC分类号： H01C7/003 ,  C03C3/064 ,  C03C3/091 ,  C03C3/093 ,  C03C8/14 ,  C03C8/22 ,  H01C17/06553

摘要： A thick-film resistor paste consists of a first glass powder, a second glass powder, a conductive material powder, and an organic vehicle. A quantity of the first glass powder mixed is larger than a quantity of the second glass powder mixed. The first glass powder contains, in total, 95 percentage by weight or above of CaO of 20 to 26 percentage by weight, SiO.sub.2 of 37 to 59 percentage by weight, Al.sub.2 O.sub.3 of 5 to 13 percentage by weight and B.sub.2 O.sub.3 of 8 to 28 percentage by weight. The second glass powder contains, in total, 85 percentage by weight or above of SiO.sub.2 of 53 to 72 percentage by weight, B.sub.2 O.sub.3 of 20 to 30 percentage by weight and Na.sub.2 O of 1 to 7 percentage by weight. The thermal expansion coefficient of the first glass powder is larger by 0.5.times.10.sup.-6 /deg or above than the thermal expansion coefficient of the second glass powder. A glass transition point of the first glass powder is higher by 30 degrees Celsius or above than a glass transition point of the second glass powder.

摘要翻译： 厚膜电阻膏由第一玻璃粉末，第二玻璃粉末，导电材料粉末和有机载体组成。 混合的第一玻璃粉末的量大于混合的第二玻璃粉末的量。 第一玻璃粉末总共含有20〜26重量％的CaO的95重量％以上，SiO 2为37〜59重量％，Al 2 O 3为5〜13重量％，B 2 O 3为8〜28重量％ 重量。 第二玻璃粉末总共含有53重量％以上的SiO 2为53〜72重量％，B 2 O 3为20〜30重量％，Na 2 O为1〜7重量％。 第一玻璃粉末的热膨胀系数比第二玻璃粉末的热膨胀系数大0.5×10 -6 /度以上。 第一玻璃粉末的玻璃化转变点比第二玻璃粉末的玻璃化转变点高30℃以上。

公开(公告)号：US06544654B1

公开(公告)日：2003-04-08

申请号：US09697150

申请日：2000-10-27

申请人： Masashi Fukaya ,  Koji Shibata ,  Chiaki Higuchi ,  Yoshinobu Watanabe

发明人： Masashi Fukaya ,  Koji Shibata ,  Chiaki Higuchi ,  Yoshinobu Watanabe

IPC分类号： B32B1504

CPC分类号： C03C3/089 ,  C03C3/091 ,  H01C7/003 ,  H01C17/06533

摘要： A thick-film resistor contains RuO2 and an SiO2—B2O3—K2O glass having a composition of 60 wt %≦SiO2≦85 wt %, 15 wt %≦B2O3≦40 wt %, 0.1 wt %≦K2O≦10 wt %, and impurity ≦3 wt %. A ceramic circuit board includes a thick-film resistor printed on it, the thick-film resistor containing RuO2 and an SiO2—B2O3—K2O glass having the above composition.

摘要翻译： 厚膜电阻器包含RuO 2和SiO 2-B 2 O 3 -K 2 O玻璃，其组成为60重量％<= SiO 2 = 85重量％，15重量％≤B2 O 3≤40重量％，0.1重量％K 2 O = = 10重量％，杂质<= 3重量％。 陶瓷电路板包括印刷在其上的厚膜电阻器，含有RuO 2的厚膜电阻器和具有上述组成的SiO 2 -B 2 O 3 -K 2 O玻璃。

公开(公告)号：US6037045A

公开(公告)日：2000-03-14

申请号：US980179

申请日：1997-11-26

申请人： Masashi Fukaya

发明人： Masashi Fukaya

IPC分类号： H05K1/16 ,  C03C8/14 ,  C03C17/34 ,  H01C7/00 ,  H01C17/065 ,  H01L23/498 ,  B32B9/00

CPC分类号： C03C8/14 ,  C03C17/3411 ,  H01C17/06533 ,  H01C17/0654 ,  H01C7/003 ,  H01L23/49883 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T428/24926

摘要： A ceramic circuit element comprising a ceramic substrate having co-fired resistor and glass overcoat thereon in which the resistor is formed from a resistor paste consisting essentially of RuO.sub.2 powder, glass powder and a vehicle comprising an organic polymer and a solvent, the RuO.sub.2 powder and the glass powder having specific surface areas of 10 to 20 m.sup.2 /g and 4 to 14 m.sup.2 /g, respectively; the glass overcoat is formed from a glass overcoat paste consisting essentially of a glass composition and a vehicle comprising an organic polymer and a solvent, the glass composition having a specific surface area of 2 to 6 m.sup.2 /g; and the ceramic circuit substrate comprises a CaO--Al.sub.2 O.sub.3 --SiO.sub.2 --B.sub.2 O.sub.3 system or MgO--Al.sub.2 O.sub.3 --SiO.sub.2 --B.sub.2 O.sub.3 system glass and alumina. The use of the foregoing resistor and glass overcoat pastes minimizes the bubbles remaining in the resistor and realizes the exertion of resistance performance ensuring excellent weather resistance and stability, even after the resistor is subjected to trimming.

摘要翻译： 一种陶瓷电路元件，包括具有共烧电阻器和玻璃外涂层的陶瓷基板，其中电阻器由基本上由RuO 2粉末，玻璃粉末和包含有机聚合物和溶剂的载体组成的电阻浆料形成，RuO 2粉末和 比表面积分别为10〜20m2 / g和4〜14m2 / g的玻璃粉末; 玻璃外涂层由玻璃组合物和包含有机聚合物和溶剂的载体组成的玻璃外涂糊形成，该玻璃组合物的比表面积为2-6m2 / g; 陶瓷电路基板包括CaO-Al2O3-SiO2-B2O3体系或MgO-Al2O3-SiO2-B2O3系玻璃和氧化铝。 使用上述电阻器和玻璃外涂层糊剂使得电阻中剩余的气泡最小化，并且实现了电阻性能的发挥，确保了优异的耐候性和稳定性，即使在电阻器进行修整之后。

公开(公告)号：US4650923A

公开(公告)日：1987-03-17

申请号：US740184

申请日：1985-05-31

申请人： Susumu Nishigaki ,  Junzo Fukuda ,  Masashi Fukaya ,  Shinsuke Yano

发明人： Susumu Nishigaki ,  Junzo Fukuda ,  Masashi Fukaya ,  Shinsuke Yano

IPC分类号： C04B35/111 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03

CPC分类号： H01L23/5383 ,  C04B35/111 ,  H01L21/4807 ,  H01L23/15 ,  H01L23/49866 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/15192

摘要： In an article comprising a ceramic body fired at a comparatively low temperature and a circuit pattern attached to the body, the ceramic body is produced from a preselected composition comprising first powder of alumina and second powder of a vitreous material which comprises any one of MgO-Al.sub.2 O.sub.3 -SiO.sub.2, CaO-MgO-Al.sub.2 O.sub.3 -SiO.sub.2, CaO-Al.sub.2 O.sub.3 -SiO.sub.2 glass, CaO-Al.sub.2 O.sub.3 -SiO.sub.2 -B.sub.2 O.sub.3 glass, MgO-Al.sub.2 O.sub.3 -SiO.sub.2 -B.sub.2 O.sub.3 glass, and CaO-MgO-Al.sub.2 O.sub.3 SiO.sub.2 -B.sub.2 O.sub.3 glass. The ceramic body comprises coexistence of an alumina part, a noncrystallized part, and a crystallized part and exhibits an excellent moisture proof. The circuit pattern comprises an internal conductive pattern of Ag and an external conductive pattern of an alloy of Ag-Pd. A chromium component may be included in the internal and the external conductive patterns. External and internal resistor patterns are placed on and within the ceramic body with a high and a low precision. The internal resistor pattern can be adjusted by the use of a laser beam through a thin film included in the ceramic body.

摘要翻译： 在包含在较低温度下烧结的陶瓷体和附着在本体上的电路图案的制品中，陶瓷体由包含氧化铝的第一粉末和玻璃质材料的第二粉末的预选组合物制成，所述第二粉末包括MgO- Al2O3-SiO2，CaO-MgO-Al2O3-SiO2，CaO-Al2O3-SiO2玻璃，CaO-Al2O3-SiO2-B2O3玻璃，MgO-Al2O3-SiO2-B2O3玻璃，CaO-MgO-Al2O3SiO2-B2O3玻璃。 陶瓷体包括氧化铝部分，非结晶部分和结晶部分的共存，并且表现出优异的防湿性。 电路图案包括Ag的内部导电图案和Ag-Pd合金的外部导电图案。 内部和外部导电图案中可以包含铬成分。 外部和内部电阻器图案以高精度和低精度放置在陶瓷体内部和内部。 可以通过使用激光束通过陶瓷体中包含的薄膜来调节内部电阻器图案。

公开(公告)号：US08776565B2

公开(公告)日：2014-07-15

申请号：US13036223

申请日：2011-02-28

申请人： Hisamitu Hatou ,  Noboru Saitou ,  Kouichi Kurosawa ,  Fujio Yoshikubo ,  Yuji Matsui ,  Masashi Fukaya

发明人： Hisamitu Hatou ,  Noboru Saitou ,  Kouichi Kurosawa ,  Fujio Yoshikubo ,  Yuji Matsui ,  Masashi Fukaya

IPC分类号： C21D7/06

CPC分类号： B23P9/04 ,  C21D1/54 ,  C21D7/04 ,  C21D7/06

摘要： An evaluation method of residual stress in water jet peening includes a step of creating an analytical model including meshes according to a water jet peening (WJP) object, the shape of a nozzle, and an injection distance, a step of inputting WJP execution conditions, a step of calculating the internal pressure pBi of a cavitation bubble and a bubble number density ngi through jet flow analysis for a jet flow jetting from the nozzle, a step of calculating cavitation energy according to the internal pressure pBi of a cavitation bubble and a bubble number density ngi (S4), a step of calculating the burst energy of cavitation bubbles from the cavitation energy C, and a step of calculating the compressive residual stress of the WJP object from the collapse pressure of cavitation bubbles. Accordingly, the residual stress of the WJP object can be evaluated precisely in a shorter time.

摘要翻译： 水喷射喷丸硬化的残余应力的评价方法包括：创建包括水喷射喷丸（WJP）对象的网孔，喷嘴形状和喷射距离的分析模型的步骤，输入WJP执行条件的步骤， 通过从喷嘴喷射的喷射流的喷射流分析来计算空化气泡的内部压力pBi和气泡数密度ngi的步骤，根据空化气泡和气泡的内部压力pBi计算空化能量的步骤 数值密度ngi（S4），从空化能量C计算空化气泡的爆发能量的步骤，以及从空化气泡的塌陷压力计算WJP物体的压缩残余应力的步骤。 因此，可以在更短的时间内精确地评估WJP物体的残余应力。

公开(公告)号：US20060056107A1

公开(公告)日：2006-03-16

申请号：US11223462

申请日：2005-09-09

申请人： Masashi Fukaya ,  Yoshiyuki Hirono ,  Masato Ikegawa ,  Hiroshi Mukai

发明人： Masashi Fukaya ,  Yoshiyuki Hirono ,  Masato Ikegawa ,  Hiroshi Mukai

IPC分类号： G11B33/14

CPC分类号： G11B17/028

摘要： Embodiments of the invention reduce disk fluttering while ensuring good assemblability in a magnetic disk apparatus. In one embodiment, a magnetic disk apparatus comprises a recording disk that is an information medium configured by one or plural disks; a motor causing the recording disk to rotate; a carriage supporting a head that records information to, or plays back information from, the recording disk; a casing housing the recording disk; and a shroud disposed surrounding an outer periphery of the recording disk. A groove that extends along the recording disk is formed, vertically asymmetrical with respect to an outer peripheral surface of the recording disk, in the shroud surface at a position where a corner portion formed by the outer peripheral surface and a top surface or bottom surface of the recording disk extends in a radial direction.

摘要翻译： 本发明的实施例在确保磁盘装置中的良好的组装性的同时减少磁盘抖动。 在一个实施例中，磁盘装置包括作为由一个或多个盘配置的信息介质的记录盘; 使记录盘旋转的马达; 支撑记录盘记录信息或从记录盘重播信息的头部的支架; 容纳记录盘的外壳; 以及围绕记录盘的外周设置的护罩。 沿着记录盘延伸的槽形成为相对于记录盘的外周表面垂直不对称的槽，在由外周表面形成的角部和顶表面或底表面的位置处的护罩表面中 记录盘沿径向延伸。

公开(公告)号：US5955938A

公开(公告)日：1999-09-21

申请号：US980172

申请日：1997-11-26

申请人： Masashi Fukaya

发明人： Masashi Fukaya

IPC分类号： H01L21/02 ,  H01L1/012

CPC分类号： H01L28/24

摘要： A ceramic circuit substrate having a resistor deposited on a surface thereof, said ceramic substrate having a coefficient of thermal expansion ranging from 5.0.times.10.sup.-6 /.degree. C. to 7.0.times.10.sup.-6 /.degree. C., the resistor being coated with a glass overcoat and made of 15 to 50% of RuO.sub.2 and 85 to 50% of a CaO--Al.sub.2 O.sub.3 --SiO.sub.2 --B.sub.2 O.sub.3 -system glass, the glass overcoat being made of 60 to 100% of a CaO--Al.sub.2 O.sub.3 --SiO.sub.2 --B.sub.2 O.sub.3 -system glass and up to 40% of alumina, wherein the resistor has a coefficient of thermal expansion greater than that of the glass overcoat. Due to the above specific relationship between the coefficient of thermal expansion of the resistor and that of the overcoat, the resistor is not subject to cracking at the time of trimming and thereafter, and realizes the exertion of resistance performance ensuring excellent weather resistance and stability.

摘要翻译： 一种具有沉积在其表面上的电阻器的陶瓷电路基板，所述陶瓷基板的热膨胀系数为5.0×10 -6 /℃至7.0×10 -6 /℃，所述电阻器涂覆有玻璃外套 由RuO2的15〜50％和CaO-Al2O3-SiO2-B2O3系玻璃的85〜50％构成，玻璃外涂层由CaO-Al 2 O 3 -SiO 2 -B 2 O 3系玻璃的60〜100％ 高达40％的氧化铝，其中电阻器的热膨胀系数大于玻璃外涂层的热膨胀系数。 由于电阻器的热膨胀系数与外涂层的热膨胀系数之间的上述特定关系，因此在修整时电阻器不会发生开裂，此后实现了电阻性能的优异性，确保了优异的耐候性和稳定性。

公开(公告)号：US5855711A

公开(公告)日：1999-01-05

申请号：US824095

申请日：1997-03-25

申请人： Hideaki Araki ,  Masashi Fukaya

发明人： Hideaki Araki ,  Masashi Fukaya

IPC分类号： C04B41/80 ,  C04B35/111 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/03 ,  H05K3/12 ,  H05K3/38 ,  H05K3/46 ,  B32B31/26

CPC分类号： H01L23/5383 ,  C04B35/111 ,  H01L23/49894 ,  H05K1/0306 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4629 ,  H05K3/4676 ,  Y10T29/49163

摘要： A ceramic circuit substrate providing a circuit pattern with a fine line as well as high accuracy for positioning the circuit pattern and a method of producing the ceramic circuit substrate. An alumina layer that is green containing an alumina that is not sintered at a temperature ranging from 800.degree. to 1000.degree. C. is applied on a surface of a ceramic green sheet containing glass and then fired at a temperature ranging from 800.degree. to 1000.degree. C. The ceramic green sheet is sintered into a sintered ceramic substrate. A porous alumina layer is formed on a surface of the sintered ceramic substrate. The glass contained in the sintered ceramic substrate is caused to flow to the inside of the porous alumina layer so that the part of the porous alumina layer filled with the glass is bonded to the sintered ceramic substrate. The part of the porous alumina layer not filled with the glass is removed, wherein the porous alumina layer remaining on the sintered ceramic substrate after the removing has a thickness of 10 .mu.m or less. A paste for forming the circuit pattern is printed on a surface of the part of the porous alumina layer that has been bonded to the sintered ceramic substrate for heating.

摘要翻译： 提供具有细线的电路图案以及用于定位电路图案的高精度的陶瓷电路基板和制造陶瓷电路基板的方法。 在含有玻璃的陶瓷生片的表面上涂布绿色的含有不在800〜1000℃温度下烧结的氧化铝的氧化铝层，然后在800〜1000℃的温度下烧成。 将陶瓷生片烧结成烧结陶瓷基片。 在烧结陶瓷基板的表面上形成多孔氧化铝层。 使包含在烧结陶瓷基板中的玻璃流到多孔氧化铝层的内部，使得填充有玻璃的多孔氧化铝层的一部分结合到烧结陶瓷基板。 未填充玻璃的多孔氧化铝层的一部分被除去，除去后残留在烧结陶瓷基板上的多孔氧化铝层的厚度为10μm以下。 用于形成电路图案的糊料印刷在已经结合到烧结陶瓷基板上以加热的多孔氧化铝层的一部分的表面上。

公开(公告)号：US5597644A

公开(公告)日：1997-01-28

申请号：US555402

申请日：1995-11-09

申请人： Hideaki Araki ,  Junzo Fukuta ,  Masashi Fukaya

发明人： Hideaki Araki ,  Junzo Fukuta ,  Masashi Fukaya

IPC分类号： C03C17/02 ,  G01R33/09 ,  G11B5/31 ,  G11B5/39 ,  H01F10/26 ,  H01F41/16 ,  H01L21/48 ,  H01L23/12 ,  H01L23/13 ,  H01L43/06 ,  H05K1/03 ,  H05K3/12 ,  B32B9/00

CPC分类号： B82Y25/00 ,  C03C17/02 ,  G01R33/093 ,  G11B5/3903 ,  H01F10/26 ,  H01F41/16 ,  H01L21/4807 ,  H01L23/13 ,  H01L24/24 ,  H05K1/0306 ,  G11B5/3103 ,  G11B5/3113 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/3511 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A ceramic circuit board comprises a ceramic substrate having a glaze film formed thereon, the glaze film being overlaid with a functional thin film such as a ferromagnetic film serving as a magnetic sensor, for example. The ceramic substrate is made of a low-firing ceramic material such as a glass ceramic material which can be sintered at a temperature below 1000.degree. C. by co-firing with the glaze film. Preferably, the ceramic substrate has a recess on its top surface, and the glaze film is embedded in the recess such that the difference in level between the ceramic substrate and the glaze film is 20 .mu.m or less. The ceramic circuit board can be produced by preparing a plurality of ceramic green sheets from a low-firing ceramic material, laminating the ceramic green sheets after a through-hole or indentation is formed in the uppermost sheet, thereby forming a multilayer ceramic green substrate having a recess on its top surface, filling the recess with a glaze-forming glass material to such a height that the difference in level between the ceramic substrate and the glaze film formed after firing is 20 .mu.m or less, and co-firing the ceramic green substrate and the glaze-forming glass material at a temperature below 1000.degree. C.

摘要翻译： 陶瓷电路板包括具有形成在其上的釉膜的陶瓷基板，该釉膜覆盖有功能薄膜，例如用作磁性传感器的铁磁膜。 陶瓷基板由低烧陶瓷材料制成，例如玻璃陶瓷材料，可通过与釉膜共烧而在低于1000℃的温度下烧结。 优选地，陶瓷基板在其顶表面上具有凹部，并且将釉膜嵌入凹部中，使得陶瓷基板和釉膜之间的水平差为20μm以下。 陶瓷电路板可以通过从低烧陶瓷材料制备多个陶瓷生片，在最上面的片材中形成通孔或压痕之后层叠陶瓷生片，从而形成多层陶瓷生坯基板，该多层陶瓷生坯基板具有 在其顶表面上的凹部，用釉料形成的玻璃材料填充凹部到陶瓷基板和烧制后形成的釉膜之间的水平差为20μm以下的高度，并共烧烧陶瓷 绿色基材和釉料形成玻璃材料，温度低于1000℃

公开(公告)号：US4726921A

公开(公告)日：1988-02-23

申请号：US738160

申请日：1985-05-24

申请人： Susumu Nishigaki ,  Masashi Fukaya ,  Junzo Fukuda ,  Shinsuke Yano ,  Osamu Nakagawa

发明人： Susumu Nishigaki ,  Masashi Fukaya ,  Junzo Fukuda ,  Shinsuke Yano ,  Osamu Nakagawa

IPC分类号： C04B35/638 ,  C03C10/00 ,  C04B33/26 ,  C04B33/32 ,  C04B35/111 ,  C04B35/64

CPC分类号： C03C10/0054 ,  C03C10/0036 ,  C04B33/26 ,  C04B33/32 ,  C04B35/111 ,  C04B35/64

摘要： Low temperature fired ceramics are produced by a highly improved method, using a specially designed apparatus and the obtained ceramic products are very useful in various applications, such as electronic components, heat resistant articles, tablewares, kitchen utensils or decorative articles because of a combination of superior properties, particularly high heat resistance, high mechanical strength, low thermal expansion and low dielectric constant. In practicing the method, a low firable ceramic material is shaped into a green sheet and then converted to a dense fired ceramic product by rapid firing in an adequate air. In the firing step, the air feed ratio (the ratio of the quantity of feed of air to the theoretical quantity of air required for combustion) is controlled so as to be at least 1.5 thereby the aimed fired products can be obtained in a greatly reduced firing time, without causing deformation or warpage of the ceramics or ignition of the decomposition gases of a binder.

摘要翻译： 低温烧制陶瓷通过高度改进的方法制造，使用专门设计的装置，并且所得到的陶瓷产品在诸如电子部件，耐热制品，餐具，厨房用具或装饰品的各种应用中非常有用，因为它们的组合 优异的性能，特别高的耐热性，高机械强度，低热膨胀和低介电常数。 在实施该方法时，将低可熔陶瓷材料成形为生片，然后通过在足够的空气中快速烧制而转化为致密烧制的陶瓷产品。 在烧成工序中，空气供给比（空气供给量与燃烧所需的理论气体的比例）被控制在至少1.5，从而可以大大降低目标烧制品 烧成时间，不会引起陶瓷的变形或翘曲或粘合剂的分解气体的点燃。