公开(公告)号：US20130233828A1

公开(公告)日：2013-09-12

申请号：US13884143

申请日：2011-11-08

申请人： Masashi Matsumori ,  Shigeki Nakatsuka ,  Teppei Kojio

发明人： Masashi Matsumori ,  Shigeki Nakatsuka ,  Teppei Kojio

IPC分类号： H05H1/46

CPC分类号： H05H1/46 ,  C23G5/00 ,  H01L2924/0002 ,  H05H1/30 ,  H05H2001/2462 ,  H05H2001/4667 ,  H05H2240/10 ,  H05H2245/123 ,  H05K3/26 ,  H05K2203/095 ,  H01L2924/00

摘要： An atmospheric plasma irradiation unit has a discharge tube for ejecting a primary plasma formed of an inductively coupled plasma of an inert gas and a mixer for generating a secondary plasma formed of a mixed gas plasmanized by collisions of the primary plasma with a mixed gas region of a second inert gas and a reactive gas. The discharge tube and the mixer are included in a plasma head. A moving unit moves the plasma head so that an irradiation area of the secondary plasma to an object is moved on a circular or other-shaped locus.

摘要翻译： 大气等离子体照射单元具有用于喷射由惰性气体的感应耦合等离子体形成的一次等离子体的放电管和用于产生由等离子体等离子化的混合气体形成的二次等离子体的混合气体， 第二惰性气体和反应性气体。 放电管和混合器包括在等离子体头中。 移动单元移动等离子体头，使得二次等离子体对物体的照射面积在圆形或其他形状的轨迹上移动。

公开(公告)号：US20120329182A1

公开(公告)日：2012-12-27

申请号：US13512955

申请日：2011-10-26

申请人： Teppei Kojio ,  Masashi Matsumori ,  Tadahiko Sakai ,  Takatoshi Ishikawa

发明人： Teppei Kojio ,  Masashi Matsumori ,  Tadahiko Sakai ,  Takatoshi Ishikawa

IPC分类号： H01L21/607 ,  H01L33/52 ,  H01L33/62 ,  H01L21/56

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/75 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/758 ,  H01L2224/75842 ,  H01L2224/81002 ,  H01L2224/81022 ,  H01L2224/81024 ,  H01L2224/81026 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81447 ,  H01L2224/83205 ,  H01L2224/83207 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： When metal junction between a first electrode and a second electrode is executed as ultrasonic bonding between metals including at least copper, the ultrasonic bonding is performed in a state that a contact interface between the first electrode and the second electrode is covered with a bonding auxiliary agent. As a result, formation of oxide at a bonding interface between the first electrode and the second electrode due to execution of the ultrasonic bonding can be suppressed. Therefore, while a desired bonding strength is ensured, ultrasonic bonding with copper used for the first electrode or the second electrode can be fulfilled and cost cuts in mounting of semiconductor devices can be achieved.

摘要翻译： 当第一电极和第二电极之间的金属接合作为至少包括铜的金属之间的超声波接合被执行时，在第一电极和第二电极之间的接触界面被接合助剂覆盖的状态下进行超声波接合 。 结果，可以抑制由于执行超声波接合而在第一电极和第二电极之间的接合界面处的氧化物的形成。 因此，在确保期望的接合强度的情况下，可以实现与第一电极或第二电极所使用的铜的超声波接合，并且可以实现半导体器件的安装成本降低。