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1.发明申请Wiring forming system and wiring forming method for forming wiring on wiring board 审中-公开用于在布线板上形成布线的布线形成系统和布线形成方法公开(公告)号：US20110106287A1
公开(公告)日：2011-05-05
申请号：US12929169
申请日：2011-01-05
IPC分类号： G06F19/00
CPC分类号： H05K1/0269 , H01L2924/0002 , H05K3/0005 , H05K3/0082 , H05K3/064 , H05K3/125 , H05K2203/013 , H05K2203/107 , H05K2203/162 , H01L2924/00
摘要： A wiring forming system comprises: maskless exposure unit which directly exposes an unexposed board by using exposure data generated based on design data relating to an wiring board; post-development inspect unit which tests the board after development, by using the exposure data and the image data of the board exposed and developed by the maskless exposure unit; etching unit which etches the developed board; and post-etching inspect unit which tests an etching pattern formed on the etched board, by using etching inspect data generated based on the design data and the image data of the board etched by the etching unit.
摘要翻译： 布线形成系统包括：无掩模曝光单元，其通过使用基于与布线板相关的设计数据生成的曝光数据来直接曝光未曝光的印刷电路板; 开发后检查单元，通过使用曝光数据和由无掩模曝光单元曝光和显影的板的图像数据进行开发后测试板; 蚀刻单元，蚀刻开发板; 以及蚀刻后检查单元，其通过使用基于设计数据生成的蚀刻检查数据和由蚀刻单元蚀刻的板的图像数据来测试形成在蚀刻板上的蚀刻图案。
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公开(公告)号：US07307691B2
公开(公告)日：2007-12-11
申请号：US10974327
申请日：2004-10-27
CPC分类号： G03F7/70283 , G03F7/70291 , H05K3/0002 , H05K3/0005 , H05K3/0082
摘要： A direct exposure system comprises: a data mask that is a data object including drawing data; and a control mask that is a data object including at least one logical layer in which information about exposure conditions applied according to regions on a substrate is specified, and performs a direct exposure process using integrated data generated by combining the data mask with the control mask.
摘要翻译： 直接曝光系统包括：作为包括绘图数据的数据对象的数据掩模; 以及作为包括至少一个逻辑层的控制掩模，所述至少一个逻辑层指定了根据基板上的区域应用的关于曝光条件的信息，并且使用通过将数据掩模与控制掩模组合而生成的积分数据进行直接曝光处理 。
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公开(公告)号：US07793412B2
公开(公告)日：2010-09-14
申请号：US10612222
申请日：2003-07-03
IPC分类号： H05K3/30
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/24011 , H01L2224/2402 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/8203 , H01L2224/82102 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01056 , H01L2924/01073 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H05K1/185 , Y10T29/49004 , Y10T29/49117 , Y10T29/49126 , Y10T29/49131 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/532 , H01L2224/82 , H01L2924/00
摘要： A component-embedded board fabrication method includes detecting, before the board is covered with a first insulating layer, the actual position of a first electronic component formed on a surface of the board, calculating a displacement between the design position of the first electronic component on the surface of the board and holding the displacement as first displacement data, and correcting, based on the first displacement data, design data to be used for processing the board after the board is covered with the first insulating layer.
摘要翻译： 组件嵌入式板的制造方法包括在板被第一绝缘层覆盖之前，检测形成在板的表面上的第一电子部件的实际位置，计算第一电子部件的设计位置之间的位移， 将所述板的表面保持位移作为第一位移数据，并且基于所述第一位移数据，校正在所述板被所述第一绝缘层覆盖之后用于处理所述板的设计数据。
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公开(公告)号：US07890203B2
公开(公告)日：2011-02-15
申请号：US10444974
申请日：2003-05-27
CPC分类号： H05K1/0269 , H01L2924/0002 , H05K3/0005 , H05K3/0082 , H05K3/064 , H05K3/125 , H05K2203/013 , H05K2203/107 , H05K2203/162 , H01L2924/00
摘要： A wiring forming system comprises: maskless exposure unit which directly exposes an unexposed board by using exposure data generated based on design data relating to an wiring board; post-development inspect unit which tests the board after development, by using the exposure data and the image data of the board exposed and developed by the maskless exposure unit; etching unit which etches the developed board; and post-etching inspect unit which tests an etching pattern formed on the etched board, by using etching inspect data generated based on the design data and the image data of the board etched by the etching unit.
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5.发明授权公开(公告)号：US07179584B2
公开(公告)日：2007-02-20
申请号：US10328449
申请日：2002-12-23
IPC分类号： G03F7/30
CPC分类号： G03F7/70283 , G03F7/70291 , G03F7/70466 , H05K3/0082
摘要： An optical exposure method and a device are used for forming patterns on a printed board wiring or semiconductor board. A single exposing region of a surface to be exposed is irradiated with a plurality of optical beams having different irradiating areas and different scanning pitches, such as, a peripheral area is irradiated with an optical beam having a smaller irradiating area and an inner area is irradiated with an optical beam having a larger irradiating area.
摘要翻译： 光学曝光方法和装置用于在印刷电路板布线或半导体板上形成图案。 用具有不同照射范围和不同扫描间距的多个光束照射要曝光的表面的单个曝光区域，例如照射具有较小照射面积的光束并且内部区域被照射的周边区域 具有较大照射面积的光束。
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公开(公告)号：US20060253295A1
公开(公告)日：2006-11-09
申请号：US11408556
申请日：2006-04-20
IPC分类号： G06Q99/00
摘要： A billing apparatus, for a direct drawing apparatus in which drawing data generated based on layout design data and necessary for drawing is supplied to a drawing engine in real time during the drawing and, based on the drawing data, the drawing engine forms a drawing pattern on a drawing target moving relative to the drawing engine, comprises: counting means for counting the number of frames in the drawing data supplied to the drawing engine, one drawing data frame being constructed by packetizing data of an amount necessary for a drawing head in the drawing engine to perform one drawing operation; and billing charge determining means for determining a billing charge based on the number of frames counted by the counting means.
摘要翻译： 一种用于直接绘图装置的计费装置，其中在绘图期间实时地将基于布局设计数据生成的绘制数据和绘制所需的绘图引擎实时地提供给绘图装置，并且基于绘图数据，绘图引擎形成绘图模式 在相对于绘图引擎移动的绘制目标上，包括：计数装置，用于对提供给绘图引擎的绘制数据中的帧数进行计数，一个绘图数据帧是通过将绘制头所需的数据的数据打包在 绘图引擎执行一个绘图操作; 以及记帐费用确定装置，用于基于由计数装置计数的帧数来确定记帐费。
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公开(公告)号：US07707713B2
公开(公告)日：2010-05-04
申请号：US12004431
申请日：2007-12-21
IPC分类号： H05K3/30
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/24011 , H01L2224/2402 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/8203 , H01L2224/82102 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01056 , H01L2924/01073 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H05K1/185 , Y10T29/49004 , Y10T29/49117 , Y10T29/49126 , Y10T29/49131 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/532 , H01L2224/82 , H01L2924/00
摘要： A method of fabricating a component-embedded board including detecting, before the board is covered with an insulating layer, the actual position of an electronic component formed on the surface of the board, calculating a displacement between the design position of the electronic component and the actual position of the electronic component on the surface of the board, and for holding the displacement as displacement data, and correcting, based on the displacement data, design data to be used for processing the board after the board is covered with the insulating layer.
摘要翻译： 一种制造部件嵌入式基板的方法，包括在板被绝缘层覆盖之前检测形成在电路板表面上的电子部件的实际位置，计算电子部件的设计位置和 电子部件在板的表面上的实际位置，并将位移保持为位移数据，并且基于位移数据，校正在板被绝缘层覆盖之后用于处理板的设计数据。
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8.发明授权Exposing apparatus and exposing method, for maskless exposure of substrate to be exposed, and plotter and plotting method for directly plotting on object to be plotted 有权曝光装置和曝光方法，用于无曝光曝光的基板，以及用于直接绘制在要绘制的对象上的绘图仪和绘图方法公开(公告)号：US07442477B2
公开(公告)日：2008-10-28
申请号：US10809372
申请日：2004-03-26
CPC分类号： G03F7/70391
摘要： An exposing apparatus for irradiating desired spots on a substrate to be exposed relatively moving with respect to two or more light sources arranged along the direction of the relative movement to form a desired exposure pattern using the light sources comprises a control means for controlling the turning-on of only specific light sources out of the two or more light sources at a specific timing.
摘要翻译： 一种曝光装置，用于照射待曝光的基板上相对于相对移动方向布置的两个或更多个光源相对移动以形成使用该光源的期望曝光图案的基板上的所需点，包括控制装置， 在特定时刻只有两个或更多个光源中的特定光源。
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9.发明申请Component-embedded board fabrication method and apparatus for high-precision and easy fabrication of component-embedded board with electronic components embedded in wiring board 有权组件嵌入式板制造方法和装置，用于高精度和容易地制造嵌入在电路板中的电子部件的部件嵌入式板公开(公告)号：US20080110021A1
公开(公告)日：2008-05-15
申请号：US12004431
申请日：2007-12-21
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/24011 , H01L2224/2402 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/8203 , H01L2224/82102 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01056 , H01L2924/01073 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H05K1/185 , Y10T29/49004 , Y10T29/49117 , Y10T29/49126 , Y10T29/49131 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/532 , H01L2224/82 , H01L2924/00
摘要： An apparatus 1 for fabricating a component-embedded board according to the present invention comprises: a detecting unit 11 for detecting, before the board 21 is covered with an insulating layer 23, the actual position of an electronic component 22 formed on the surface of the board 21; a holding unit 12 for calculating a displacement between the design position of the electronic component 22 and the actual position of the electronic component 22 on the surface of the board 21, and for holding the displacement as displacement data; and a correcting unit 13 for correcting, based on the displacement data, design data to be used for processing the board 21 after the board 21 is covered with the insulating layer 23.
摘要翻译： 根据本发明的用于制造部件嵌入式基板的装置1包括：检测单元11，用于在板21被绝缘层23覆盖之前检测形成在该表面上的电子部件22的实际位置 板21; 用于计算电子部件22的设计位置与电子部件22在电路板21的表面上的实际位置之间的位移并保持位移作为位移数据的保持单元12; 以及校正单元13，用于基于位移数据，校正板21被绝缘层23覆盖之后用于处理板21的设计数据。
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10.发明授权Pattern drawing apparatus and pattern drawing method for forming patterns, that have mirror image relationship to each other with respect to a substrate, on both sides of the substrate, and test apparatus for use in the pattern drawing apparatus 有权用于形成图案的图案绘制装置和图形绘制方法，用于在基板的两侧上形成彼此具有彼此相对于镜像的关系的图案，以及用于图案描绘装置的测试装置公开(公告)号：US07303243B2
公开(公告)日：2007-12-04
申请号：US10790872
申请日：2004-03-03
IPC分类号： B41J3/00
CPC分类号： B41J29/393 , H01L2924/0002 , H01L2924/00
摘要： A pattern drawing apparatus for forming patterns, that have a mirror image relationship to each other with respect to a substrate, on both sides of the substrate forms the patterns on both sides of the substrate by drawing the patterns directly on both sides of the substrate in accordance with prescribed data by using a direct drawing means such as a maskless exposure means or an inkjet patterning means.
摘要翻译： 在基板的两侧形成有相对于基板具有镜像关系的图案的图案绘制装置通过在基板的两侧直接拉伸图案而在基板的两侧上形成图案 根据规定的数据，通过使用诸如无掩模曝光装置或喷墨图案形成装置之类的直接绘图装置。
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