公开(公告)号：US20110186121A1

公开(公告)日：2011-08-04

申请号：US13003252

申请日：2009-07-06

申请人： Matthias Horteis ,  Robert Woehl ,  Stefan Glunz ,  Aleksander Filipovic ,  Daniel Schmidt

发明人： Matthias Horteis ,  Robert Woehl ,  Stefan Glunz ,  Aleksander Filipovic ,  Daniel Schmidt

IPC分类号： H01L31/0224 ,  H01B1/22 ,  H01B1/14 ,  H01L31/18

CPC分类号： H01L31/022425 ,  H01B1/22 ,  H05K1/092 ,  Y02E10/50

摘要： The present invention relates to a metal-containing composition, a method for producing electrical contact structures on electronic components and also an electronic component provided with such a contacting.

摘要翻译： 本发明涉及含金属的组合物，电子部件上的电接触结构的制造方法以及具有接触的电子部件。

公开(公告)号：US20170222073A1

公开(公告)日：2017-08-03

申请号：US15492382

申请日：2017-04-20

申请人： Taeseok Kim ,  Robert Woehl ,  Gabriel Harley ,  Nils-Peter Harder ,  Jens-Dirk Moschner ,  Matthieu Moors ,  Michel Arsene Olivier Ngamo Toko

发明人： Taeseok Kim ,  Robert Woehl ,  Gabriel Harley ,  Nils-Peter Harder ,  Jens-Dirk Moschner ,  Matthieu Moors ,  Michel Arsene Olivier Ngamo Toko

IPC分类号： H01L31/0224 ,  H01L31/028 ,  H01L31/0368 ,  H01L31/077 ,  H01L31/056 ,  H01L31/0236

CPC分类号： H01L31/022458 ,  H01L31/022441 ,  H01L31/02366 ,  H01L31/028 ,  H01L31/035281 ,  H01L31/03682 ,  H01L31/05 ,  H01L31/0516 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/0745 ,  H01L31/077 ,  H01L31/1804 ,  H01L31/182 ,  Y02E10/50

摘要： Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.

公开(公告)号：US09634178B1

公开(公告)日：2017-04-25

申请号：US14971335

申请日：2015-12-16

申请人： Taeseok Kim ,  Robert Woehl ,  Gabriel Harley ,  Nils-Peter Harder ,  Jens-Dirk Moschner ,  Matthieu Moors ,  Michel Arsène Olivier Ngamo Toko

发明人： Taeseok Kim ,  Robert Woehl ,  Gabriel Harley ,  Nils-Peter Harder ,  Jens-Dirk Moschner ,  Matthieu Moors ,  Michel Arsène Olivier Ngamo Toko

IPC分类号： H01L31/18 ,  H01L31/05 ,  H01L31/054 ,  H01L31/0368 ,  H01L31/0224

CPC分类号： H01L31/022458 ,  H01L31/022441 ,  H01L31/02366 ,  H01L31/028 ,  H01L31/035281 ,  H01L31/03682 ,  H01L31/05 ,  H01L31/0516 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/0745 ,  H01L31/077 ,  H01L31/1804 ,  H01L31/182 ,  Y02E10/50

摘要： Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.

公开(公告)号：US20160380122A1

公开(公告)日：2016-12-29

申请号：US14751095

申请日：2015-06-25

申请人： Robert Woehl ,  David Aaron Randolph Barkhouse ,  Paul Loscutoff

发明人： Robert Woehl ,  David Aaron Randolph Barkhouse ,  Paul Loscutoff

IPC分类号： H01L31/02 ,  H01L21/3213 ,  H01L31/18

CPC分类号： H01L31/02013 ,  H01L21/32134 ,  H01L31/022441 ,  H01L31/0682 ,  H01L31/18 ,  H01L31/1804 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/521

摘要： Fabricating a semiconductor device can include forming a metal seed region over a substrate. The method can include forming a mask over a first portion of the metal seed region. The method can also include forming a metal region over the metal seed region and removing the mask. The method can include forming metal contact fingers on the semiconductor device, where the forming includes etching the first portion of the metal seed region with an etchant comprising an acid, an oxidizer and chloride ions.

摘要翻译： 制造半导体器件可以包括在衬底上形成金属种子区域。 该方法可以包括在金属种子区域的第一部分上形成掩模。 该方法还可以包括在金属种子区域上形成金属区域并除去掩模。 该方法可以包括在半导体器件上形成金属接触指，其中形成包括用包含酸，氧化剂和氯离子的蚀刻剂蚀刻金属种子区的第一部分。

公开(公告)号：US08748310B2

公开(公告)日：2014-06-10

申请号：US13805023

申请日：2011-06-16

申请人： Daniel Biro ,  Benjamin Thaidigsmann ,  Florian Clement ,  Robert Woehl ,  Edgar-Allan Wotke

发明人： Daniel Biro ,  Benjamin Thaidigsmann ,  Florian Clement ,  Robert Woehl ,  Edgar-Allan Wotke

IPC分类号： H01L21/44

CPC分类号： H01L31/18 ,  H01L31/022425 ,  H01L31/05 ,  Y02E10/50

摘要： A method for producing a metal contact structure of a photovoltaic solar cell, including: applying an electrically non-conductive insulating layer to a semiconductor substrate, applying a metal contact layer to the insulating layer, and generating a plurality of local electrically conductive connections between the semiconductor substrate and the contact layer right through the insulating layer. The metal contact layer is formed using two pastes containing metal particles: the first paste containing metal particles is applied to local regions, and the second paste containing metal particles is applied covering at least the regions covered with the first paste and partial regions located therebetween. By global heating the semiconductor substrate the first paste penetrates the insulating layer and forms an electrically conductive contact directly with the semiconductor substrate, whereas the second paste does not penetrate the insulating layer and is electrically conductively connected to the semiconductor substrate via the first paste.

摘要翻译： 一种用于制造光伏太阳能电池的金属接触结构的方法，包括：向半导体衬底施加非导电绝缘层，向所述绝缘层施加金属接触层，以及在所述绝缘层之间产生多个局部导电连接 半导体衬底和接触层直接通过绝缘层。 使用含有金属颗粒的两个糊料形成金属接触层：将第一糊料含有金属颗粒施加到局部区域，并且将第二糊料含有金属颗粒涂覆至少覆盖第一糊料覆盖的区域和位于其间的部分区域。 通过对半导体衬底进行全局加热，第一浆料穿透绝缘层并与半导体衬底直接形成导电触点，而第二焊膏不穿透绝缘层，并通过第一焊膏与半导体衬底电连接。

公开(公告)号：US20170179308A1

公开(公告)日：2017-06-22

申请号：US15453612

申请日：2017-03-08

申请人： Robert Woehl ,  Richard Hamilton Sewell ,  Mohamed A. Elbandrawy ,  Taeseok Kim ,  Thomas P. Pass ,  Benjamin Ian Hsia ,  David Fredric Joel Kavulak ,  Nils-Peter Harder

发明人： Robert Woehl ,  Richard Hamilton Sewell ,  Mohamed A. Elbandrawy ,  Taeseok Kim ,  Thomas P. Pass ,  Benjamin Ian Hsia ,  David Fredric Joel Kavulak ,  Nils-Peter Harder

IPC分类号： H01L31/02 ,  H01L31/0224

CPC分类号： H01L31/022433 ,  H01L31/022441 ,  H01L31/0516 ,  H01L31/18 ,  Y02E10/50

摘要： Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.

公开(公告)号：US20170125612A1

公开(公告)日：2017-05-04

申请号：US14927265

申请日：2015-10-29

申请人： Robert Woehl ,  Richard Hamilton Sewell ,  Mohamed A. Elbandrawy ,  Taeseok Kim ,  Thomas P. Pass ,  Benjamin Ian Hsia ,  David Fredric Joel Kavulak ,  Nils-Peter Harder

发明人： Robert Woehl ,  Richard Hamilton Sewell ,  Mohamed A. Elbandrawy ,  Taeseok Kim ,  Thomas P. Pass ,  Benjamin Ian Hsia ,  David Fredric Joel Kavulak ,  Nils-Peter Harder

IPC分类号： H01L31/02

CPC分类号： H01L31/022433 ,  H01L31/022441 ,  H01L31/0516 ,  H01L31/18 ,  Y02E10/50

摘要： Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.

公开(公告)号：US09620655B1

公开(公告)日：2017-04-11

申请号：US14927265

申请日：2015-10-29

申请人： Robert Woehl ,  Richard Hamilton Sewell ,  Mohamed A. Elbandrawy ,  Taeseok Kim ,  Thomas P. Pass ,  Benjamin Ian Hsia ,  David Fredric Joel Kavulak ,  Nils-Peter Harder

发明人： Robert Woehl ,  Richard Hamilton Sewell ,  Mohamed A. Elbandrawy ,  Taeseok Kim ,  Thomas P. Pass ,  Benjamin Ian Hsia ,  David Fredric Joel Kavulak ,  Nils-Peter Harder

IPC分类号： H01L31/00 ,  H01L31/02 ,  H01L31/18 ,  H01L31/0224 ,  H01L31/05

CPC分类号： H01L31/022433 ,  H01L31/022441 ,  H01L31/0516 ,  H01L31/18 ,  Y02E10/50

摘要： Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.

公开(公告)号：US20160380126A1

公开(公告)日：2016-12-29

申请号：US14751096

申请日：2015-06-25

申请人： David Aaron Randolph Barkhouse ,  Todd Richards Johnson ,  Paul Loscutoff ,  Robert Woehl

发明人： David Aaron Randolph Barkhouse ,  Todd Richards Johnson ,  Paul Loscutoff ,  Robert Woehl

IPC分类号： H01L31/0224 ,  H01L31/18

CPC分类号： H01L31/022441 ,  H01L31/0682 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

摘要： A solar cell can include a substrate, a semiconductor region disposed in or above the substrate, and a conductive stack that includes a first conductive region, a multi-layer barrier region, and a second conductive region.

摘要翻译： 太阳能电池可以包括基板，设置在基板中或上方的半导体区域，以及包括第一导电区域，多层势垒区域和第二导电区域的导电堆叠。

公开(公告)号：US20160181450A1

公开(公告)日：2016-06-23

申请号：US14578204

申请日：2014-12-19

申请人： Michael Cudzinovic ,  Amjad Deyine ,  Robert Woehl

发明人： Michael Cudzinovic ,  Amjad Deyine ,  Robert Woehl

IPC分类号： H01L31/0224 ,  H01L31/18 ,  H01L31/036 ,  H01L31/068 ,  H01L31/028 ,  H01L31/0368

CPC分类号： H01L31/022441 ,  H01L31/022425 ,  H01L31/0682 ,  Y02E10/547

摘要： Multi-layer sputtered metal seed for solar cell conductive contacts and methods of forming solar cell conductive contacts are described. In an example, a solar cell includes a substrate. A semiconductor region is disposed in or above the substrate. A conductive contact is disposed on the semiconductor region and includes a seed material stack in contact with the semiconductor region. The seed material stack includes a first aluminum layer having a first crystallinity and disposed on the semiconductor layer, and a second aluminum layer having a second crystallinity and disposed on and having an interface with the first aluminum layer. The first crystallinity is different from the second crystallinity.

摘要翻译： 描述了用于太阳能电池导电触点的多层溅射金属种子和形成太阳能电池导电触点的方法。 在一个示例中，太阳能电池包括基板。 半导体区域设置在基板中或上方。 导电触点设置在半导体区域上，并且包括与半导体区域接触的种子材料堆叠。 种子材料堆叠包括具有第一结晶度并设置在半导体层上的第一铝层和具有第二结晶度的第二铝层，并且设置在第一铝层上并与第一铝层具有界面。 第一结晶度与第二结晶度不同。