公开(公告)号：US11728232B2

公开(公告)日：2023-08-15

申请号：US17685303

申请日：2022-03-02

申请人： Media Tek Inc.

发明人： Chi-Wen Pan ,  I-Hsuan Peng ,  Sheng-Liang Kuo ,  Yi-Jou Lin ,  Tai-Yu Chen

IPC分类号： H01L23/16 ,  H01L23/367 ,  H01L25/065 ,  H01L23/00 ,  H01L25/10 ,  H01L25/03 ,  H01L23/04 ,  H01L25/00 ,  H01L25/18 ,  H01L23/538 ,  H01L23/498

CPC分类号： H01L23/16 ,  H01L23/04 ,  H01L23/3672 ,  H01L23/562 ,  H01L25/03 ,  H01L25/0655 ,  H01L25/10 ,  H01L25/18 ,  H01L25/50 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/5384 ,  H01L24/16 ,  H01L24/20 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/157 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/3511

摘要： A semiconductor package includes a package substrate having a top surface and a bottom surface, and a stiffener ring mounted on the top surface of the package substrate. The stiffener ring includes a reinforcement rib that is coplanar with the stiffener ring on the top surface of the package substrate. At least two compartments are defined by the stiffener ring and the reinforcement rib. At least two individual chip packages are mounted on chip mounting regions within the at least two compartments, respectively, thereby constituting a package array on the package substrate.

公开(公告)号：US20220262691A1

公开(公告)日：2022-08-18

申请号：US17685303

申请日：2022-03-02

申请人： Media Tek Inc.

发明人： Chi-Wen Pan ,  I-Hsuan Peng ,  Sheng-Liang Kuo ,  Yi-Jou Lin ,  Tai-Yu Chen

IPC分类号： H01L23/16 ,  H01L23/367 ,  H01L25/065 ,  H01L23/00 ,  H01L25/10 ,  H01L25/03 ,  H01L23/04 ,  H01L25/00 ,  H01L25/18

摘要： A semiconductor package includes a package substrate having a top surface and a bottom surface, and a stiffener ring mounted on the top surface of the package substrate. The stiffener ring includes a reinforcement rib that is coplanar with the stiffener ring on the top surface of the package substrate. At least two compartments are defined by the stiffener ring and the reinforcement rib. At least two individual chip packages are mounted on chip mounting regions within the at least two compartments, respectively, thereby constituting a package array on the package substrate.