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33 条记录 (耗时 0.027 秒)

    Unique cooling scheme for advanced thermal management of high flux electronics
    1.
    发明申请
    Unique cooling scheme for advanced thermal management of high flux electronics 有权
    独特的冷却方案，用于高通量电子器件的先进热管理

    公开(公告)号：US20080156462A1

    公开(公告)日：2008-07-03

    申请号：US11649173

    申请日：2007-01-03

    申请人： Mehmet Arik ,  Chellappa Balan ,  Todd Garrett Wetzel ,  Stephen Adam Solovitz ,  Charles Max Byrd ,  Stanton Earl Weaver

    发明人： Mehmet Arik ,  Chellappa Balan ,  Todd Garrett Wetzel ,  Stephen Adam Solovitz ,  Charles Max Byrd ,  Stanton Earl Weaver

    IPC分类号： F28F7/00

    CPC分类号： F28F3/04 ,  F04B43/04 ,  F04B43/046 ,  F04D29/582 ,  F28D1/05316 ,  F28D15/00 ,  F28D2021/0031 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S165/908 ,  H01L2924/00

    摘要： Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.

    摘要翻译： 公开了一种用于冷却电子封装的系统。 该系统包括流体泵和微冷却器组件。 该系统利用在电子封装中散布有电子层的一个或多个冷却层。 每个冷却层具有形成在衬底中的冷却通道阵列，通过冷却通道阵列提供冷却流体的输入歧管，以及从冷却通道阵列收集流体的输出歧管。 冷却系统的元件通过导管集成，导管包括用于将流体从流体泵通到电子封装的封装导管，用于将流体从电子封装件通至微型冷却器组件的冷却器导管，以及用于通过 从微冷却器组件到流体泵的流体。 还公开了一种用于冷却电子封装的方法。

    System and method for miniaturization of synthetic jets
    2.
    发明授权
    System and method for miniaturization of synthetic jets 有权

    公开(公告)号：US08418934B2

    公开(公告)日：2013-04-16

    申请号：US12198267

    申请日：2008-08-26

    申请人： Mehmet Arik ,  Stanton Earl Weaver

    发明人： Mehmet Arik ,  Stanton Earl Weaver

    IPC分类号： B05B1/08

    CPC分类号： B81B7/0093 ,  B81B2201/036 ,  B81B2201/058 ,  B81B2203/0127 ,  B81C1/00158 ,  F04B45/047 ,  H01L23/467 ,  H01L41/0973 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A micro-electromechanical (MEM) synthetic jet actuator includes a semiconductor substrate having a cavity extending therethrough, such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate. A first flexible membrane is formed on at least a portion of the front surface of the semiconductor substrate and extends over the first opening. The first flexible membrane also includes an orifice formed therein aligned with the first opening. The MEM synthetic jet actuator also includes a second flexible membrane that is formed on at least a portion of the second surface of the semiconductor substrate and that extends over the second opening, and a pair of actuator elements coupled to the flexible membranes and aligned with the cavity to selectively cause displacement of the first and second flexible membranes.

    Method and apparatus for reducing acoustic noise in a synthetic jet
    7.
    发明授权
    Method and apparatus for reducing acoustic noise in a synthetic jet 有权
    减少合成射流噪声的方法和装置

    公开(公告)号：US08308078B2

    公开(公告)日：2012-11-13

    申请号：US13114234

    申请日：2011-05-24

    申请人： Mehmet Arik ,  Stanton Earl Weaver ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar

    发明人： Mehmet Arik ,  Stanton Earl Weaver ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar

    IPC分类号： B05B1/08

    CPC分类号： F15D1/00 ,  B05B17/0607 ,  F28F13/02 ,  H01L23/467 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T29/494

    摘要： A synthetic jet includes a first backer structure, a first actuator coupled to the first backer structure to form a first composite unit, a second backer structure, a second actuator coupled to the second backer structure to form a second composite unit, and a wall member coupled to and positioned between the first and second backer structures to form a cavity, wherein the first composite unit has an orifice formed through both the first backer structure and the first actuator, the orifice fluidically coupled to the cavity and fluidically coupled to an environment external to the cavity, and wherein the first and second composite units are operable independently from one another.

    摘要翻译： 合成射流包括第一支撑结构，耦合到第一支撑结构以形成第一复合单元的第一致动器，第二支撑结构，耦合到第二支撑结构以形成第二复合单元的第二致动器，以及壁构件 耦合并定位在第一和第二支撑结构之间以形成空腔，其中第一复合单元具有形成为穿过第一支撑结构和第一致动器的孔口，孔口流体地联接到空腔并且流体耦合到外部环境 并且其中所述第一和第二复合单元彼此独立地可操作。

    Heat transfer and power generation device
    9.
    发明申请
    Heat transfer and power generation device 审中-公开
    传热和发电装置

    公开(公告)号：US20080017237A1

    公开(公告)日：2008-01-24

    申请号：US11489018

    申请日：2006-07-19

    申请人： James William Bray ,  Mehmet Arik ,  Stanton Earl Weaver

    发明人： James William Bray ,  Mehmet Arik ,  Stanton Earl Weaver

    IPC分类号： H01L35/28 ,  H01L35/34

    CPC分类号： H01L35/32 ,  H01L35/26

    摘要： A system is provided. The system includes a thermoelectric device that includes first and second thermally conductive substrates and first and second thermoelements disposed between the first and second thermally conductive substrates, wherein the first thermoelement, or the second thermoelement, or both the first and second thermoelements comprises a thermally insulating and electrically conducting tunneling element having a tunneling gap.

    摘要翻译： 提供了一个系统。 该系统包括热电装置，其包括第一和第二导热基板以及设置在第一和第二导热基板之间的第一和第二热电元件，其中第一热电偶或第二热电偶，或第一和第二热电元件都包括隔热 以及具有隧道间隙的导电隧道元件。