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    Flexible interconnect structures for electrical devices and light sources incorporating the same
    6.
    发明授权
    Flexible interconnect structures for electrical devices and light sources incorporating the same 失效
    用于电气设备和包含其的光源的柔性互连结构

    公开(公告)号：US07273987B2

    公开(公告)日：2007-09-25

    申请号：US10063104

    申请日：2002-03-21

    申请人： Charles Adrian Becker ,  Stanton Earl Weaver ,  Thomas Elliot Stecher

    发明人： Charles Adrian Becker ,  Stanton Earl Weaver ,  Thomas Elliot Stecher

    IPC分类号： H05K1/16

    CPC分类号： H05K1/0204 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4611 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10416 ,  H01L2924/00

    摘要： A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes (“LEDs”) and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith.

    摘要翻译： 灵活的互连结构允许从包括诸如发光二极管（“LED”）和/或激光二极管的发光元件的电气设备产生的热量的快速散热。 柔性互连结构包括：（1）至少一个柔性电介质膜，电路迹线和任选的电路部件形成在其上，其至少一部分通过其厚度去除; 和（2）至少一个附着在与形成电路迹线的表面相对的柔性电介质膜的一个表面上的散热片。 柔性互连结构可以包括多个这样的柔性介电膜，每个支撑电路迹线和/或电路部件，并且每个通过电绝缘层附接到另一个。 具有复杂形状的电气设备或光源由这种柔性互连结构和附接到散热器的发光元件形成为与其热接触。

    System and method for miniaturization of synthetic jets
    7.
    发明授权
    System and method for miniaturization of synthetic jets 有权

    公开(公告)号：US08418934B2

    公开(公告)日：2013-04-16

    申请号：US12198267

    申请日：2008-08-26

    申请人： Mehmet Arik ,  Stanton Earl Weaver

    发明人： Mehmet Arik ,  Stanton Earl Weaver

    IPC分类号： B05B1/08

    CPC分类号： B81B7/0093 ,  B81B2201/036 ,  B81B2201/058 ,  B81B2203/0127 ,  B81C1/00158 ,  F04B45/047 ,  H01L23/467 ,  H01L41/0973 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A micro-electromechanical (MEM) synthetic jet actuator includes a semiconductor substrate having a cavity extending therethrough, such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate. A first flexible membrane is formed on at least a portion of the front surface of the semiconductor substrate and extends over the first opening. The first flexible membrane also includes an orifice formed therein aligned with the first opening. The MEM synthetic jet actuator also includes a second flexible membrane that is formed on at least a portion of the second surface of the semiconductor substrate and that extends over the second opening, and a pair of actuator elements coupled to the flexible membranes and aligned with the cavity to selectively cause displacement of the first and second flexible membranes.

    Unique cooling scheme for advanced thermal management of high flux electronics
    10.
    发明申请
    Unique cooling scheme for advanced thermal management of high flux electronics 有权
    独特的冷却方案，用于高通量电子器件的先进热管理

    公开(公告)号：US20080156462A1

    公开(公告)日：2008-07-03

    申请号：US11649173

    申请日：2007-01-03

    申请人： Mehmet Arik ,  Chellappa Balan ,  Todd Garrett Wetzel ,  Stephen Adam Solovitz ,  Charles Max Byrd ,  Stanton Earl Weaver

    发明人： Mehmet Arik ,  Chellappa Balan ,  Todd Garrett Wetzel ,  Stephen Adam Solovitz ,  Charles Max Byrd ,  Stanton Earl Weaver

    IPC分类号： F28F7/00

    CPC分类号： F28F3/04 ,  F04B43/04 ,  F04B43/046 ,  F04D29/582 ,  F28D1/05316 ,  F28D15/00 ,  F28D2021/0031 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S165/908 ,  H01L2924/00

    摘要： Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.

    摘要翻译： 公开了一种用于冷却电子封装的系统。 该系统包括流体泵和微冷却器组件。 该系统利用在电子封装中散布有电子层的一个或多个冷却层。 每个冷却层具有形成在衬底中的冷却通道阵列，通过冷却通道阵列提供冷却流体的输入歧管，以及从冷却通道阵列收集流体的输出歧管。 冷却系统的元件通过导管集成，导管包括用于将流体从流体泵通到电子封装的封装导管，用于将流体从电子封装件通至微型冷却器组件的冷却器导管，以及用于通过 从微冷却器组件到流体泵的流体。 还公开了一种用于冷却电子封装的方法。