公开(公告)号：US5530550A

公开(公告)日：1996-06-25

申请号：US361131

申请日：1994-12-21

申请人： Mehrdad Nikoonahad ,  Philip R. Rigg ,  Keith B. Wells ,  David S. Calhoun

发明人： Mehrdad Nikoonahad ,  Philip R. Rigg ,  Keith B. Wells ,  David S. Calhoun

IPC分类号： G01B11/02 ,  G01B11/30 ,  G01N21/88 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66 ,  G01B11/14

CPC分类号： G01N21/9501 ,  G01N21/94 ,  G01N21/956

摘要： The position detector has a sensitivity characteristic graded along a direction transverse to the surface, so that the output of the position detector is used to determine a height of the surface. A surface height detection and positioning device for use in a surface inspection system. An incident beam of light impinges obliquely upon the surface, and a position detector is disposed to receive specularly reflected light, producing a plurality of electrical signals, with a mechanical window, defining an aperture, placed in front of the detector. The aperture's width, along the scan direction, is of sufficient size so as to create a train of signals from each of the plurality of electrical signals, having a frequency equal to the scan frequency. These electrical signals carry information responsive to both the position of reflected beam impinging on the detector and the beam's intensity and are, in turn, related to a height of the surface. To abrogate information responsive to intensity variations at the position sensitive detector, an electronic circuit is employed which determines the sum and the difference of the plurality of signals relating to wafer height and beam intensity, producing a summed signal and a difference signal respectively. The difference signal is then divided by the summed signal, thereby producing a normalized signal which represents the height of the wafer surface without regards to these reflected beam intensity variations. These signals are synchronized to the scan frequency which facilitates removing unwanted signals resulting from thermal drifts and ambient light.

摘要翻译： 位置检测器具有沿横向于表面的方向分级的灵敏度特性，使得位置检测器的输出用于确定表面的高度。 一种用于表面检测系统的表面高度检测和定位装置。 入射光束倾斜地撞击在表面上，并且位置检测器被设置成接收镜面反射光，产生多个电信号，其中机械窗口限定放置在检测器前面的孔。 沿着扫描方向的孔径的宽度具有足够的尺寸，以便产生具有等于扫描频率的频率的来自多个电信号中的每一个的一串信号。 这些电信号响应于入射在检测器上的反射光束的位置和光束的强度而携带信息，并且又与表面的高度有关。 为了消除响应于位置敏感检测器的强度变化的信息，采用电子电路，其确定与晶片高度和光束强度相关的多个信号的总和和差异，分别产生求和信号和差分信号。 然后将差分信号除以相加的信号，从而产生表示晶片表面的高度的归一化信号，而不考虑这些反射的光束强度变化。 这些信号与扫描频率同步，有助于消除由热漂移和环境光引起的不必要的信号。

公开(公告)号：US07477372B2

公开(公告)日：2009-01-13

申请号：US11738989

申请日：2007-04-23

申请人： Brian C. Leslie ,  Mehrdad Nikoonahad ,  Keith B. Wells

发明人： Brian C. Leslie ,  Mehrdad Nikoonahad ,  Keith B. Wells

IPC分类号： G01N21/00

CPC分类号： G01N21/95607 ,  G01N21/94 ,  G01N21/9501

摘要： In an optical scanning system for detecting particles and pattern defects on a sample surface, a light beam is focused to an illuminated spot on the surface and the spot is scanned across the surface along a scan line. A detector is positioned adjacent to the surface to collect scattered light from the spot where the detector includes a one- or two-dimensional array of sensors. Light scattered from the illuminated spot at each of a plurality of positions along the scan line is focused onto a corresponding sensor in the array. A plurality of detectors symmetrically placed with respect to the illuminating beam detect laterally and forward scattered light from the spot. The spot is scanned over arrays of scan line segments shorter than the dimensions of the surface. A bright field channel enables the adjustment of the height of the sample surface to correct for errors caused by height variations of the surface. Different defect maps provided by the output of the detectors can be compared to identify and classify the defects. The imaging function of the array of sensors combines the advantages of a scanning system and an imaging system while improving signal/background ratio of the system.

摘要翻译： 在用于检测样品表面上的颗粒和图案缺陷的光学扫描系统中，光束被聚焦到表面上的照明光斑上，并且沿着扫描线扫描光斑。 检测器邻近表面定位以收集来自检测器包括传感器的一维或二维阵列的点的散射光。 沿着扫描线的多个位置中的每一个处从照明点散射的光被聚焦到阵列中的对应的传感器上。 相对于照明光束对称放置的多个检测器检测来自光斑的横向和前向散射光。 在比表面尺寸短的扫描线段的阵列上扫描该点。 亮场通道可以调整样品表面的高度，以校正由表面的高度变化引起的误差。 可以比较由检测器输出提供的不同缺陷图，以识别和分类缺陷。 传感器阵列的成像功能结合了扫描系统和成像系统的优点，同时提高了系统的信号/背景比。

公开(公告)号：US07075637B2

公开(公告)日：2006-07-11

申请号：US10412458

申请日：2003-04-10

申请人： Brian C. Leslie ,  Mehrdad Nikoonahad ,  Keith B. Wells

发明人： Brian C. Leslie ,  Mehrdad Nikoonahad ,  Keith B. Wells

IPC分类号： G01N21/00

CPC分类号： G01N21/95607 ,  G01N21/94 ,  G01N21/9501

摘要： In an optical scanning system for detecting particles and pattern defects on a sample surface, a light beam is focused to an illuminated spot on the surface and the spot is scanned across the surface along a scan line. A detector is positioned adjacent to the surface to collect scattered light from the spot where the detector includes a one- or two-dimensional array of sensors. Light scattered from the illuminated spot at each of a plurality of positions along the scan line is focused onto a corresponding sensor in the array. A plurality of detectors symmetrically placed with respect to the illuminating beam detect laterally and forward scattered light from the spot. The spot is scanned over arrays of scan line segments shorter than the dimensions of the surface. A bright field channel enables the adjustment of the height of the sample surface to correct for errors caused by height variations of the surface. Different defect maps provided by the output of the detectors can be compared to identify and classify the defects. The imaging function of the array of sensors combines the advantages of a scanning system and an imaging system while improving signal/background ratio of the system.

公开(公告)号：US06888627B2

公开(公告)日：2005-05-03

申请号：US10411646

申请日：2003-04-10

申请人： Brian C. Leslie ,  Mehrdad Nikoonahad ,  Keith B. Wells

发明人： Brian C. Leslie ,  Mehrdad Nikoonahad ,  Keith B. Wells

IPC分类号： G01N21/956 ,  G01N21/94 ,  G01N21/88

CPC分类号： G01N21/95607 ,  G01N21/94 ,  G01N21/9501

摘要： In an optical scanning system for detecting particles and pattern defects on a sample surface, a light beam is focused to an illuminated spot on the surface and the spot is scanned across the surface along a scan line. A detector is positioned adjacent to the surface to collect scattered light from the spot where the detector includes a one- or two-dimensional array of sensors. Light scattered from the illuminated spot at each of a plurality of positions along the scan line is focused onto a corresponding sensor in the array. A plurality of detectors symmetrically placed with respect to the illuminating beam detect laterally and forward scattered light from the spot. The spot is scanned over arrays of scan line segments shorter than the dimensions of the surface. A bright field channel enables the adjustment of the height of the sample surface to correct for errors caused by height variations of the surface. Different defect maps provided by the output of the detectors can be compared to identify and classify the defects. The imaging function of the array of sensors combines the advantages of a scanning system and an imaging system while improving signal/background ratio of the system.

摘要翻译： 在用于检测样品表面上的颗粒和图案缺陷的光学扫描系统中，光束被聚焦到表面上的照明光斑上，并且沿着扫描线扫描光斑。 检测器邻近表面定位以收集来自检测器包括传感器的一维或二维阵列的点的散射光。 沿着扫描线的多个位置中的每一个处从照明点散射的光被聚焦到阵列中的对应的传感器上。 相对于照明光束对称放置的多个检测器检测来自光斑的横向和前向散射光。 在比表面尺寸短的扫描线段的阵列上扫描该点。 亮场通道可以调整样品表面的高度，以校正由表面的高度变化引起的误差。 可以比较由检测器输出提供的不同缺陷图，以识别和分类缺陷。 传感器阵列的成像功能结合了扫描系统和成像系统的优点，同时提高了系统的信号/背景比。

公开(公告)号：US6081325A

公开(公告)日：2000-06-27

申请号：US868292

申请日：1997-06-03

申请人： Brian C. Leslie ,  Mehrdad Nikoonahad ,  Keith B. Wells

发明人： Brian C. Leslie ,  Mehrdad Nikoonahad ,  Keith B. Wells

IPC分类号： G01N21/956 ,  G01N21/94 ,  G01N21/00

CPC分类号： G01N21/95607 ,  G01N21/94 ,  G01N21/9501

摘要： In an optical scanning system for detecting particles and pattern defects on a sample surface, a light beam is focused to an illuminated spot on the surface and the spot is scanned across the surface along a scan line. A detector is positioned adjacent to the surface to collect scattered light from the spot where the detector includes a one- or two-dimensional array of sensors. Light scattered from the illuminated spot at each of a plurality of positions along the scan line is focused onto a corresponding sensor in the array. A plurality of detectors symmetrically placed with respect to the illuminating beam detect laterally and forward scattered light from the spot. The spot is scanned over arrays of scan line segments shorter than the dimensions of the surface. A bright field channel enables the adjustment of the height of the sample surface to correct for errors caused by height variations of the surface. Different defect maps provided by the output of the detectors can be compared to identify and classify the defects. The imaging function of the array of sensors combines the advantages of a scanning system and an imaging system while improving signal/background ratio of the system.

公开(公告)号：US5864394A

公开(公告)日：1999-01-26

申请号：US536862

申请日：1995-09-29

申请人： John R. Jordan, III ,  Mehrdad Nikoonahad ,  Keith B. Wells

发明人： John R. Jordan, III ,  Mehrdad Nikoonahad ,  Keith B. Wells

IPC分类号： G01B11/30 ,  G01B11/02 ,  G01N21/88 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  G01R31/28 ,  G01R31/308 ,  G06T1/00 ,  G06T7/00 ,  H01L21/66 ,  G01N21/00

CPC分类号： G01N21/95623 ,  G01N21/94 ,  G01N21/956 ,  G01N21/95607 ,  G01R31/308 ,  G01N2021/8825 ,  G01R31/2831 ,  H01L22/12 ,  H01L2924/0002

摘要： A high throughput surface inspection system with enhanced detection sensitivity is described. The acquired data is processed in real time at a rate of below 50 MHz thereby reducing the cost for data processing. Anomalies are detected and verified by comparing adjacent repeating patterns and the height of the surface is monitored and corrected dynamically to reduce misregistration errors between adjacent repeating patterns. Local thresholds employing neighborhood information are used for detecting and verifying the presence of anomalies. The sampled point spread function of the combined illumination and collection system is exploited for anomaly detection and verification.

摘要翻译： 描述了具有增强的检测灵敏度的高通量表面检查系统。 所获取的数据以低于50MHz的速率实时处理，从而降低了数据处理的成本。 通过比较相邻的重复图案来检测和验证异常，并且动态监测和校正表面的高度以减少相邻重复图案之间的对准错误。 使用邻域信息的本地阈值用于检测和验证异常的存在。 综合照明采集系统的采样点扩散功能被用于异常检测和验证。

公开(公告)号：US20090135416A1

公开(公告)日：2009-05-28

申请号：US11868740

申请日：2007-10-08

申请人： Andrei V. Shchegrov ,  Anatoly Fabrikant ,  Mehrdad Nikoonahad ,  Ady Levy ,  Daniel C. Wack ,  Noah Bareket ,  Walter Mieher ,  Ted Dziura

发明人： Andrei V. Shchegrov ,  Anatoly Fabrikant ,  Mehrdad Nikoonahad ,  Ady Levy ,  Daniel C. Wack ,  Noah Bareket ,  Walter Mieher ,  Ted Dziura

IPC分类号： G01B11/28 ,  G01J3/00 ,  G01B11/00

CPC分类号： G03F7/70616 ,  G01N21/211 ,  G01N21/47 ,  G01N21/4788 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/213 ,  G03F7/70625 ,  G03F7/70641

摘要： A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters. One or more radiation parameters that are more sensitive to such changes may be selected in the above-described optimization process to arrive at a more accurate measurement. The above-described techniques may be supplied to a track/stepper and etcher to control the lithographic and etching processes in order to compensate for any errors in the profile parameters.

摘要翻译： 构建种子轮廓的画廊，并且使用半导体器件的制造工艺知识来选择与轮廓相关联的初始参数值。 也可以使用制造过程知识来选择最佳种子轮廓和最佳初始参数值集合作为优化过程的起始点，由此将与模型预测的轮廓的参数值相关联的数据与测量数据进行比较，以便 达到参数的值。 也可以考虑在周期性结构之上或之下的膜层。 可以使用诸如反射率Rs，Rp和椭偏参数的不同辐射参数来测量衍射结构和相关膜。 一些辐射参数可能对轮廓或膜的参数值的变化对其他辐射参数更敏感。 可以在上述优化过程中选择对这种变化更敏感的一个或多个辐射参数，以获得更准确的测量。 可以将上述技术提供给轨道/步进器和蚀刻器以控制光刻和蚀刻工艺，以便补偿轮廓参数中的任何误差。

公开(公告)号：US07349090B2

公开(公告)日：2008-03-25

申请号：US09956849

申请日：2001-09-20

申请人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

发明人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

IPC分类号： G01J4/00

CPC分类号： G03F7/70616 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a property of a specimen prior to, during, or subsequent to lithography. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，该系统可以被配置为确定样品的多个性质，包括但不限于在光刻之前，期间或之后的样品的性质。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US07130029B2

公开(公告)日：2006-10-31

申请号：US09956850

申请日：2001-09-20

申请人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

发明人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

IPC分类号： G01N21/88

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, an adhesion characteristic and a thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

公开(公告)号：US20060132806A1

公开(公告)日：2006-06-22

申请号：US11343478

申请日：2006-01-30

申请人： Andrei Shchegrov ,  Anatoly Fabrikant ,  Mehrdad Nikoonahad

发明人： Andrei Shchegrov ,  Anatoly Fabrikant ,  Mehrdad Nikoonahad

IPC分类号： G01B11/14

CPC分类号： H01L22/20 ,  G01J3/447 ,  G01J4/04 ,  G01N21/211

摘要： A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters. One or more radiation parameters that are more sensitive to such changes may be selected in the above-described optimization process to arrive at a more accurate measurement. The above-described techniques may be supplied to a track/stepper and etcher to control the lithographic and etching processes in order to compensate for any errors in the profile parameters.

摘要翻译： 构建种子轮廓的画廊，并且使用半导体器件的制造工艺知识来选择与轮廓相关联的初始参数值。 也可以使用制造过程知识来选择最佳种子轮廓和最佳初始参数值集合作为优化过程的起始点，由此将与模型预测的轮廓的参数值相关联的数据与测量数据进行比较，以便 达到参数的值。 也可以考虑在周期性结构之上或之下的膜层。 不同的辐射参数，例如反射率R S，R P和椭偏参数可用于测量衍射结构和相关膜。 一些辐射参数可能对轮廓或膜的参数值的变化对其他辐射参数更敏感。 可以在上述优化过程中选择对这种变化更敏感的一个或多个辐射参数，以获得更准确的测量。 可以将上述技术提供给轨道/步进器和蚀刻器以控制光刻和蚀刻工艺，以便补偿轮廓参数中的任何误差。