公开(公告)号：US11988689B2

公开(公告)日：2024-05-21

申请号：US17974869

申请日：2022-10-27

Applicant: Melexis Technologies SA

Inventor： Bruno Boury ,  Robert Racz ,  Antonio Cacciato ,  Jian Chen

IPC: G01R15/14 ,  H10N52/00 ,  H10N52/01 ,  H10N52/80

CPC classification number: G01R15/148 ,  H10N52/01 ,  H10N52/101 ,  H10N52/80

Abstract: A circuit for sensing a current comprises a substrate having a first and a second major surface, the second major surface being opposite to the first major surface. At least one magnetic field sensing element is arranged on the first major surface of the substrate and is suitable for sensing a magnetic field caused by a current flow in a current conductor coupled to the second major surface. The substrate also comprises at least one insulation layer, substantially buried between the first major surface and the second major surface of the substrate.

公开(公告)号：US11474165B2

公开(公告)日：2022-10-18

申请号：US17084947

申请日：2020-10-30

Applicant: Melexis Technologies SA

Inventor： Jian Chen ,  Orlin Gueorguiev Saradjov

IPC: G01R33/00 ,  H01L23/495 ,  H05K3/34 ,  H05K3/30

Abstract: A sensor comprises a housing; and a lead frame comprising at least three elongated leads having an exterior portion extending from the housing; and a magnetic sensor circuit disposed in the housing, and connected to the lead frame. The housing comprises two recesses arranged on two opposite sides of the housing for allowing the sensor to be mounted to a support. The lead frame may further comprise a plurality of tabs disposed between the elongated leads, for use as test pins. A component assembly comprising said sensor mounted on a support between deformable protrusions. A method of making said component assembly, comprising the step of positioning said component on the support between said protrusions, and deforming said protrusions such that they are at least partially disposed within the recesses.

公开(公告)号：US11067645B2

公开(公告)日：2021-07-20

申请号：US16361973

申请日：2019-03-22

Applicant: Melexis Technologies SA

Inventor： Jian Chen ,  Orlin Gueorguiev Saradjov

IPC: G01R33/00 ,  H01L23/495 ,  H05K3/34 ,  H05K3/30

Abstract: A sensor comprises a housing; and a lead frame comprising at least three elongated leads having an exterior portion extending from the housing; and a magnetic sensor circuit disposed in the housing, and connected to the lead frame. The housing comprises two recesses arranged on two opposite sides of the housing for allowing the sensor to be mounted to a support. The lead frame may further comprise a plurality of tabs disposed between the elongated leads, for use as test pins. A component assembly comprising said sensor mounted on a support between deformable protrusions. A method of making said component assembly, comprising the step of positioning said component on the support between said protrusions, and deforming said protrusions such that they are at least partially disposed within the recesses.

公开(公告)号：US20180166350A1

公开(公告)日：2018-06-14

申请号：US15376584

申请日：2016-12-12

Applicant: Melexis Technologies SA

Inventor： Robert Racz ,  Bruno Boury ,  Antonino Cacciato ,  Jian Chen ,  Guido Dupont

IPC: H01L21/66 ,  H01L23/48 ,  H01L23/495 ,  H01L23/31 ,  H01L21/768 ,  H01L21/48 ,  H01L21/56 ,  H01L23/552 ,  G01R15/20

CPC classification number: H01L22/32 ,  G01R15/207 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/552 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A current sensor comprises a current conductor having a first portion, a measuring portion and a second portion, the first portion including one or more first electrical terminals and the second portion including one or more second electrical terminals. The current sensor further comprises third electrical terminals and a semiconductor chip. The semiconductor chip has one or more magnetic field sensors disposed in the active surface, is mounted on the current conductor with an active surface facing the current conductor. The active surface comprises first contacts. The semiconductor chip comprises electrical through silicon connections disposed over and electrically connected to the first contacts. A backside of the semiconductor chip comprises second contacts, each of the second contacts electrically connected to one of the electrical through silicon connections. Wire bonds electrically connect the second contacts with the third electrical terminals.

公开(公告)号：US20180158765A1

公开(公告)日：2018-06-07

申请号：US15831637

申请日：2017-12-05

Applicant: Melexis Technologies SA

Inventor： Pete Montero ,  Jian Chen ,  Dany Yazbeck ,  Javier Bilbao De Mendizabal ,  Weixun Yan

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49582 ,  G01R33/00 ,  H01L21/4828 ,  H01L23/49548 ,  H01L23/49861 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/17517 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/014 ,  H01L2224/45099

Abstract: An integrated circuit package comprises a lead frame including a plurality of leads and a current conductor forming an electrically conductive path that connects at least two leads of the plurality of leads. The package also comprises a semiconductor die comprising an integrated circuit and having first and second opposing surfaces, the first surface being proximate to the current conductor. Each of the at least two leads comprises a groove to locally space the lead away from the semiconductor die in a direction perpendicular to the first surface, in which the groove comprises at least that part of the lead that overlaps the edge of the semiconductor die.

公开(公告)号：US12137618B2

公开(公告)日：2024-11-05

申请号：US18351797

申请日：2023-07-13

Applicant: Melexis Technologies SA

Inventor： Arnaud Laville ,  Eric Lahaye ,  Jian Chen

IPC: H10N52/80 ,  G01R33/07 ,  H01L23/495 ,  H01L25/065 ,  H10N52/00

Abstract: A sensor device comprising: a lead frame; a first/second semiconductor die having a first/second sensor structure at a first/second sensor location, and a plurality of first/second bond pads electrically connected to the lead frame; the semiconductor dies having a square or rectangular shape with a geometric center; the sensor locations are offset from the geometrical centers; the second die is stacked on top of the first die, and is rotated by a non-zero angle and optionally also offset or shifted with respect to the first die, such that a perpendicular projection of the first and second sensor location coincide.

公开(公告)号：US11733318B2

公开(公告)日：2023-08-22

申请号：US16963352

申请日：2019-01-22

Applicant: MELEXIS TECHNOLOGIES SA

Inventor： Vincent Hiligsmann ,  Wolfram Kluge ,  David Ihle ,  Jian Chen ,  Jorg Rudiger ,  Sascha Beyer

IPC: G01R33/04 ,  G01R33/00 ,  G01D5/20

CPC classification number: G01R33/0047 ,  G01D5/204 ,  G01R33/04

Abstract: A sensor package comprises a non-conductive substrate, at least two electrically conductive coils located at a first side of the non-conductive substrate, an evaluation circuit located at a second side of the non-conductive substrate opposing the first side of the non-conductive substrate and conductive connections between the at least two electrically conductive coils and the evaluation circuit.

公开(公告)号：US11849650B2

公开(公告)日：2023-12-19

申请号：US17065004

申请日：2020-10-07

Applicant: Melexis Technologies SA

Inventor： Arnaud Laville ,  Eric Lahaye ,  Jian Chen

IPC: H10N52/80 ,  G01R33/07 ,  H01L23/495 ,  H01L25/065 ,  H10N52/00

CPC classification number: H10N52/80 ,  G01R33/07 ,  H01L23/49541 ,  H01L23/49575 ,  H01L25/0657 ,  H10N52/101

Abstract: A sensor device comprising: a lead frame; a first/second semiconductor die having a first/second sensor structure at a first/second sensor location, and a plurality of first/second bond pads electrically connected to the lead frame; the semiconductor dies having a square or rectangular shape with a geometric center; the sensor locations are offset from the geometrical centers; the second die is stacked on top of the first die, and is rotated by a non-zero angle and optionally also offset or shifted with respect to the first die, such that a perpendicular projection of the first and second sensor location coincide.

公开(公告)号：US11543466B2

公开(公告)日：2023-01-03

申请号：US17030900

申请日：2020-09-24

Applicant: Melexis Technologies SA

Inventor： Jian Chen ,  Matthijs Pardoen ,  Arnaud Laville ,  Orlin Gueorguiev Saradjov

IPC: G01R33/00 ,  G01R33/02

Abstract: A sensor comprises a housing; and a lead frame comprising at least three elongated leads having an exterior portion extending from the housing; and a magnetic sensor circuit disposed in the housing and connected to the lead frame. The housing comprising at least two recesses or at least two lateral protrusions arranged on two opposite sides of the housing, for allowing the sensor to be mounted to the support. A component assembly comprising said sensor mounted on a support, the support comprising a plurality of first and second posts and a plurality of electrical contacts. A method of producing said component assembly, comprising the step of arranging said sensor with its elongated leads adjacent the first posts, and arranging its lateral protrusions and/or lateral recesses adjacent the second posts, and connecting the elongated leads to the electrical contacts.

公开(公告)号：US11506688B2

公开(公告)日：2022-11-22

申请号：US16662378

申请日：2019-10-24

Applicant: Melexis Technologies SA

Inventor： Bruno Boury ,  Robert Racz ,  Jian Chen ,  Antonio Cacciato

IPC: H01L43/04 ,  G01R15/14 ,  H01L43/06 ,  H01L43/14

Abstract: A circuit for sensing a current comprises a substrate having a first and a second major surface, the second major surface being opposite to the first major surface. At least one magnetic field sensing element is arranged on the first major surface of the substrate and is suitable for sensing a magnetic field caused by a current flow in a current conductor coupled to the second major surface. The substrate also comprises at least one insulation layer, substantially buried between the first major surface and the second major surface of the substrate.