MEMORY SYSTEM WITH DEPLETION GATE
    2.
    发明申请
    MEMORY SYSTEM WITH DEPLETION GATE 审中-公开
    带有隔离门的记忆系统

    公开(公告)号:US20080150005A1

    公开(公告)日:2008-06-26

    申请号:US11694089

    申请日:2007-03-30

    IPC分类号: H01L29/792

    摘要: A memory system includes a substrate, forming a first insulator layer over the substrate, forming a charge-storage layer over the first insulator layer, forming a second insulator layer over the charge-storage layer, and forming a depletion gate having a depletion phenomenon over the second insulator layer.

    摘要翻译: 存储器系统包括:衬底,在衬底上形成第一绝缘体层,在第一绝缘体层之上形成电荷存储层,在电荷存储层上形成第二绝缘体层,并形成具有耗尽现象的耗尽栅极 第二绝缘体层。

    Flash memory cell with a flair gate
    4.
    发明授权
    Flash memory cell with a flair gate 有权
    闪存单元,带有风格门

    公开(公告)号:US08367537B2

    公开(公告)日:2013-02-05

    申请号:US11801823

    申请日:2007-05-10

    IPC分类号: H01L21/283

    摘要: An embodiment of the present invention is directed to a method of forming a memory cell. The method includes etching a trench in a substrate and filling the trench with an oxide to form a shallow trench isolation (STI) region. A portion of an active region of the substrate that comes in contact with the STI region forms a bitline-STI edge. The method further includes forming a gate structure over the active region of the substrate and over the STI region. The gate structure has a first width substantially over the center of the active region of the substrate and a second width substantially over the bitline-STI edge, and the second width is greater than the first width.

    摘要翻译: 本发明的实施例涉及一种形成存储单元的方法。 该方法包括蚀刻衬底中的沟槽并用氧化物填充沟槽以形成浅沟槽隔离(STI)区域。 与STI区域接触的衬底的有源区域的一部分形成位线STI边缘。 该方法还包括在衬底的有源区上方和STI区上形成栅极结构。 栅极结构具有基本上在衬底的有源区域的中心上方的第一宽度和基本上位于STI边缘的第二宽度,并且第二宽度大于第一宽度。

    Flash memory cell with a flair gate
    8.
    发明申请
    Flash memory cell with a flair gate 有权
    闪存单元,带有风格门

    公开(公告)号:US20080277712A1

    公开(公告)日:2008-11-13

    申请号:US11801823

    申请日:2007-05-10

    摘要: An embodiment of the present invention is directed to a method of forming a memory cell. The method includes etching a trench in a substrate and filling the trench with an oxide to form a shallow trench isolation (STI) region. A portion of an active region of the substrate that comes in contact with the STI region forms a bitline-STI edge. The method further includes forming a gate structure over the active region of the substrate and over the STI region. The gate structure has a first width substantially over the center of the active region of the substrate and a second width substantially over the bitline-STI edge, and the second width is greater than the first width.

    摘要翻译: 本发明的实施例涉及一种形成存储单元的方法。 该方法包括蚀刻衬底中的沟槽并用氧化物填充沟槽以形成浅沟槽隔离(STI)区域。 与STI区域接触的衬底的有源区域的一部分形成位线STI边缘。 该方法还包括在衬底的有源区上方和STI区上形成栅极结构。 栅极结构具有基本上在衬底的有源区域的中心上方的第一宽度和基本上位于STI边缘的第二宽度,并且第二宽度大于第一宽度。