公开(公告)号：US20050056920A1

公开(公告)日：2005-03-17

申请号：US10660828

申请日：2003-09-12

Applicant: Gary Li ,  Michael Chapman ,  Dave Mahadevan

Inventor： Gary Li ,  Michael Chapman ,  Dave Mahadevan

IPC: H01L23/495 ,  H01L23/02

CPC classification number: H01L23/49503 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A lead frame (201) for a packaged electronic device having split flag structures (205, 207) coupled by support structures (219). The support structures include bend portions (233) for providing stress relief between the flag structures during the manufacture and/or during the operation of a packaged electronic device (301). In one embodiment, the packaged electronic device includes an inertial sensor (515).

Abstract translation: 一种用于具有由支撑结构（219）耦合的分离标志结构（205,207）的封装电子设备的引线框架（201）。 支撑结构包括用于在制造期间和/或在封装的电子设备（301）的操作期间在标志结构之间提供应力释放的弯曲部分（233）。 在一个实施例中，封装的电子设备包括惯性传感器（515）。

公开(公告)号：US06683370B1

公开(公告)日：2004-01-27

申请号：US10417992

申请日：2003-04-15

Applicant: William G. McDonald ,  Michael Chapman

Inventor： William G. McDonald ,  Michael Chapman

IPC: H01L23495

CPC classification number: H01L23/49575 ,  H01L23/053 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A semiconductor component includes a non-leaded leadframe (100, 200, 300) having at least one interior electrical contact (110) and a plurality of exterior electrical contacts (120), a semiconductor chip (410) mounted onto the leadframe, a mold compound (510) disposed around the semiconductor chip, a cavity (520) in the mold compound exposing a portion of the at least one interior electrical contact, an electronic chip (710) mounted in the cavity, and a cover (810) disposed over the cavity. In one embodiment, the leadframe is part of an array including a plurality of leadframes spaced apart from each other by a plurality of dam bars.

Abstract translation: 半导体部件包括具有至少一个内部电触点（110）和多个外部电触头（120）的非引线引线框架（100,200,300），安装在引线框架上的半导体芯片（410），模具 配置在半导体芯片周围的化合物（510），暴露出至少一个内部电触点的一部分的模具化合物中的空腔（520），安装在该空腔中的电子芯片（710） 空腔。 在一个实施例中，引线框架是包括通过多个坝条彼此间隔开的多个引线框的阵列的一部分。

公开(公告)号：USD448283S1

公开(公告)日：2001-09-25

申请号：US29116908

申请日：2000-01-11

Applicant: Michael Chapman

Designer： Michael Chapman

公开(公告)号：US20050067676A1

公开(公告)日：2005-03-31

申请号：US10670631

申请日：2003-09-25

Applicant: Dave Mahadevan ,  Michael Chapman ,  Arvind Salian

Inventor： Dave Mahadevan ,  Michael Chapman ,  Arvind Salian

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2225/06562 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer (42, 64) over a mold encapsulant (35, 62). The conductive layer (42, 64) may be electrically coupled using a wire to the leadframe (10, 52) of the semiconductor package (2, 50). The electrical coupling can be performed by wire bonding two device portions (2, 4, 6, 8) of a leadframe (10) together and then cutting the wire bond (32) by forming a groove (40) in the overlying mold encapsulant (35) to form two wires (33). The conductive layer (42) is then electrically coupled to each of the two wires (33). In another embodiment, a looped wire bond (61) is formed on top of a semiconductor die (57). After mold encapsulation, portions of the mold encapsulant (62) are removed to expose portions of the looped wire bond (61). The conductive layer (64) is then formed over the mold encapsulant (62) and the exposed portion of the looped wire bond (61) so that the conductive layer (64) is electrically coupled to the looped wire bond (61).

Abstract translation: 通过在模具密封剂（35,62）上形成导电层（42,64）来形成电磁干扰（EMI）和/或电磁辐射屏蔽。 可以使用导线将导电层（42,64）电耦合到半导体封装（2,50）的引线框架（10,52）。 电耦合可以通过将引线框架（10）的两个器件部分（2,4,6,8）引线接合在一起来执行，然后通过在上覆模具密封剂中形成凹槽（40）来切割引线接合（32） 35）以形成两根线（33）。 导电层（42）然后电耦合到两条电线（33）中的每一条。 在另一个实施例中，在半导体管芯（57）的顶部上形成环状引线接合（61）。 在模具封装之后，去除模具密封剂（62）的部分以露出环状引线接合部分（61）。 导电层（64）然后形成在模具密封剂（62）和环状引线键合（61）的暴露部分上，使得导电层（64）电耦合到环状引线键合（61）。

公开(公告)号：US06402211B1

公开(公告)日：2002-06-11

申请号：US09802540

申请日：2001-03-09

Applicant: Michael Chapman

Inventor： Michael Chapman

IPC: A41D1308

CPC classification number: A41D13/087

Abstract: A thumb protector for protecting the thumb of a user from calluses and inflamed skin from repetitive use of computer game controllers. The thumb protector includes a sleeve that is adapted to cover a distal end of the digit of the user. The sleeve has an upper portion and a lower portion; the upper portion is adapted to cover a top of the distal end of the digit and the lower portion is adapted to cover a digital pulp of the digit of the user. A plurality of ridges outwardly extend from the lower portion of the sleeve such that the plurality of ridges are adapted for increasing traction between the sleeve and the game controller when the sleeve is covering the distal end of the digit.

Abstract translation: 拇指保护器，用于保护用户的拇指免受愈伤组织和发炎的皮肤重复使用电脑游戏控制器。 拇指保护器包括适于覆盖使用者的数字的远端的套筒。 套筒具有上部和下部; 上部适于覆盖数字的远端的顶部，并且下部适于覆盖使用者的数字的数字纸浆。 多个脊从套筒的下部向外延伸，使得当套筒覆盖数字的远端时，多个凸脊适于增加套筒和游戏控制器之间的牵引力。

公开(公告)号：USD425697S

公开(公告)日：2000-05-30

申请号：US109206

申请日：1999-08-10

Applicant: Michael Chapman

Designer： Michael Chapman

公开(公告)号：US5423669A

公开(公告)日：1995-06-13

申请号：US109311

申请日：1993-08-19

Applicant: Michael Chapman

Inventor： Michael Chapman

IPC: B29C35/04 ,  B29C51/42 ,  B29C51/46 ,  G05D23/27

CPC classification number: B29C51/424 ,  B29C51/46 ,  G05D23/27 ,  B29C35/045

Abstract: A gas fed catalytic heater is employed as a heat source in the thermoforming of shaped articles from a sheet of thermoplastic material. The thermoplastic sheet is fed from a continuous supply roll past an array of gas catalytic heaters in a heating section in order to soften the sheet prior to entering a mold for shaping the articles. A closed loop temperature control system is provided for controlling the pressure and hence the volume of gas entering the catalytic heaters and thus the emitted infrared radiation to automatically maintain the temperature of the thermoplastic sheet at a predetermined set value. The control system includes a temperature sensor for measuring the temperature of the sheet, a temperature controller for comparing the actual temperature of the sheet against a preset temperature and for producing an output signal that is proportional to the difference temperature and a gas modulating valve which is responsive to the output signal for adjusting the flow of gas to the catalytic heaters.

Abstract translation: 在来自热塑性材料片的成形制品的热成形中，采用气体加料的催化加热器作为热源。 热塑性片材从连续的供应辊通过加热部分中的气体催化加热器阵列供给，以便在进入用于成型物品的模具之前软化片材。 提供了一个闭环温度控制系统，用于控制进入催化加热器的气体的压力和因此的体积，从而控制发射的红外辐射，以将热塑性片材的温度自动保持在预定的设定值。 控制系统包括用于测量片材温度的温度传感器，用于将片材的实际温度与预设温度进行比较并用于产生与差分温度成比例的输出信号的温度控制器，以及气体调节阀 响应于输出信号以调节到催化加热器的气体流。

公开(公告)号：US09805148B2

公开(公告)日：2017-10-31

申请号：US14462080

申请日：2014-08-18

Applicant: Michael Chapman

Inventor： Michael Chapman

IPC: G06F17/50

CPC classification number: G06F17/5009

Abstract: The invention is directed to a method for discrete-event simulation, using dynamic memory in a parallel environment under Cautious Optimistic Control (COC). The method is divided into three sub-processes. The first is the pre-processing phase, which prepares the simulation for event execution. The second is the execution phase, which prepares the simulation for event execution. The third is the post-processing phase, which handles the cleanup of the simulation after the end of event execution. The invention can be integrated into various software architectures for run-time use or in post-processing analysis for data analysis in test and evaluation environments.

公开(公告)号：US20160048613A1

公开(公告)日：2016-02-18

申请号：US14462080

申请日：2014-08-18

Applicant: Michael Chapman

Inventor： Michael Chapman

IPC: G06F17/50

CPC classification number: G06F17/5009

Abstract: The invention is directed to a method for discrete-event simulation, using dynamic memory in a parallel environment under Cautious Optimistic Control (COC). The method is divided into three sub-processes. The first is the pre-processing phase, which prepares the simulation for event execution. The second is the execution phase, which prepares the simulation for event execution. The third is the post-processing phase, which handles the cleanup of the simulation after the end of event execution. The invention can be integrated into various software architectures for run-time use or in post-processing analysis for data analysis in test and evaluation environments.

Abstract translation: 本发明涉及用于在谨慎乐观控制（COC）下的并行环境中使用动态存储器的离散事件仿真的方法。 该方法分为三个子过程。 第一个是预处理阶段，它准备事件执行的模拟。 第二个是执行阶段，它准备事件执行的模拟。 第三个是后处理阶段，它处理事件执行结束后的模拟清理。 本发明可以集成到用于运行时使用的各种软件体系结构中，或者用于在测试和评估环境中进行数据分析的后处理分析。

公开(公告)号：US20070151375A1

公开(公告)日：2007-07-05

申请号：US11689245

申请日：2007-03-21

Applicant: James Kennedy ,  Dennis Sarr ,  Michael Chapman ,  Michael Fogarty ,  Martin Freet ,  Gary Georgeson ,  Ronald VonWahlde

Inventor： James Kennedy ,  Dennis Sarr ,  Michael Chapman ,  Michael Fogarty ,  Martin Freet ,  Gary Georgeson ,  Ronald VonWahlde

IPC: G01M19/00

CPC classification number: G01N29/225 ,  G01N29/265 ,  G01N2291/0231 ,  G01N2291/0258 ,  G01N2291/0422 ,  G01N2291/105 ,  G01N2291/2694

Abstract: A hat stringer inspection device permits continuous inspection of hat stringers as one or more probes are moved along the length of the hat stringer. Probes may be magnetically coupled to opposing surfaces of the structure, including, for example, where one of the probes is positioned inside the hat stringer and the probes are magnetically coupled across the surface of the hat stringer. The device may be autonomous with a feedback-controlled motor to drive the inspection device along the hat stringer. Magnetic coupling is also used to re-orient the position and/or alignment of the probes with respect to changes in the hat stringer or shapes, sizes, and configurations of hat stingers.

Abstract translation: 当一个或多个探头沿着帽子纵梁的长度移动时，帽子纵梁检查装置允许连续检查帽子桁条。 探针可以磁耦合到结构的相对表面，包括例如其中一个探针位于帽子纵梁内部并且探针磁耦合跨过帽子纵梁的表面。 该装置可以是自主的，具有反馈控制的电动机以沿着帽子纵梁驱动检查装置。 磁耦合还用于相对于帽子纵梁的变化或帽子刺针的形状，尺寸和构型重新定位探针的位置和/或对准。