公开(公告)号：US07064355B2

公开(公告)日：2006-06-20

申请号：US09880204

申请日：2001-06-12

申请人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach ,  Gloria E. Hofler

发明人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach ,  Gloria E. Hofler

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/405 ,  H01L33/505 ,  H01L33/60

摘要： Light emitting devices with improved light extraction efficiency are provided. The light emitting devices have a stack of layers including semiconductor layers comprising an active region. The stack is bonded to a transparent optical element having a refractive index for light emitted by the active region preferably greater than about 1.5, more preferably greater than about 1.8. A method of bonding a transparent optical element (e.g., a lens or an optical concentrator) to a light emitting device comprising an active region includes elevating a temperature of the optical element and the stack and applying a pressure to press the optical element and the light emitting device together. A block of optical element material may be bonded to the light emitting device and then shaped into an optical element. Bonding a high refractive index optical element to a light emitting device improves the light extraction efficiency of the light emitting device by reducing loss due to total internal reflection. Advantageously, this improvement can be achieved without the use of an encapsulant.

公开(公告)号：US08628985B2

公开(公告)日：2014-01-14

申请号：US13252398

申请日：2011-10-04

申请人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach

发明人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach

IPC分类号： H01L21/00

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/32 ,  H01L33/405 ,  H01L33/502 ,  H01L33/62

摘要： Light emitting devices with improved light extraction efficiency are provided. The light emitting devices have a stack of layers including semiconductor layers comprising an active region. The stack is bonded to a transparent lens having a refractive index for light emitted by the active region preferably greater than about 1.5, more preferably greater than about 1.8. A method of bonding a transparent lens to a light emitting device having a stack of layers including semiconductor layers comprising an active region includes elevating a temperature of the lens and the stack and applying a pressure to press the lens and the stack together. Bonding a high refractive index lens to a light emitting device improves the light extraction efficiency of the light emitting device by reducing loss due to total internal reflection. Advantageously, this improvement can be achieved without the use of an encapsulant.

摘要翻译： 提供了具有提高光提取效率的发光器件。 发光器件具有包括有源区的半导体层的一叠层。 叠层结合到具有由有源区发射的光的折射率的透明透镜，优选大于约1.5，更优选大于约1.8。 将透明透镜粘合到具有包括有源区的半导体层的层叠的发光器件的方法包括提高透镜和叠层的温度并施加压力以将透镜和叠层压在一起。 将高折射率透镜粘合到发光器件通过减少由于全内反射引起的损耗来提高发光器件的光提取效率。 有利地，可以在不使用密封剂的情况下实现这种改进。

公开(公告)号：US07279345B2

公开(公告)日：2007-10-09

申请号：US10938237

申请日：2004-09-10

申请人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach ,  Gloria E. Hofler

发明人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach ,  Gloria E. Hofler

IPC分类号： H01L21/00

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/32 ,  H01L33/405 ,  H01L33/502 ,  H01L33/62

摘要： A method of bonding a transparent optical element to a light emitting device having a stack of layers including semiconductor layers comprising an active region is provided. The method includes elevating a temperature of the optical element and the stack and applying a pressure to press the optical element and the stack together. In one embodiment, the method also includes disposing a layer of a transparent bonding material between the stack and the optical element. The bonding method can be applied to a premade optical element or to a block of optical element material which is later formed or shaped into an optical element such as a lens or an optical concentrator.

摘要翻译： 提供了一种将透明光学元件结合到具有包括包括有源区域的半导体层的层叠层的发光器件的方法。 该方法包括升高光学元件和叠层的温度并施加压力以将光学元件和叠层压在一起。 在一个实施例中，该方法还包括在叠层和光学元件之间设置透明粘结材料层。 接合方法可以应用于预制光学元件或稍后形成或成形为诸如透镜或聚光器的光学元件的光学元件材料块。

公开(公告)号：US08415694B2

公开(公告)日：2013-04-09

申请号：US12710554

申请日：2010-02-23

申请人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach ,  Gloria E. Hofler

发明人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach ,  Gloria E. Hofler

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/32 ,  H01L33/405 ,  H01L33/502 ,  H01L33/62

摘要： A device includes a light emitting structure and a wavelength conversion member comprising a semiconductor. The light emitting structure is bonded to the wavelength conversion member. In some embodiments, the light emitting structure is bonded to the wavelength conversion member with an inorganic bonding material. In some embodiments, the light emitting structure is bonded to the wavelength conversion member with a bonding material having an index of refraction greater than 1.5.

摘要翻译： 一种器件包括发光结构和包括半导体的波长转换构件。 发光结构被结合到波长转换构件。 在一些实施例中，发光结构用无机粘合材料结合到波长转换构件。 在一些实施例中，发光结构用折射率大于1.5的接合材料结合到波长转换部件。

公开(公告)号：US08049234B2

公开(公告)日：2011-11-01

申请号：US11868903

申请日：2007-10-08

申请人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach ,  Gloria E. Hofler

发明人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach ,  Gloria E. Hofler

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/32 ,  H01L33/405 ,  H01L33/502 ,  H01L33/62

摘要： Light emitting devices with improved light extraction efficiency are provided. The light emitting devices have a stack of layers including semiconductor layers comprising an active region. The stack is bonded to a transparent optical element.

摘要翻译： 提供了具有提高光提取效率的发光器件。 发光器件具有包括有源区的半导体层的一叠层。 叠层结合到透明光学元件上。

公开(公告)号：US20100148151A1

公开(公告)日：2010-06-17

申请号：US12710554

申请日：2010-02-23

申请人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach ,  Gloria E. Hofler

发明人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach ,  Gloria E. Hofler

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/32 ,  H01L33/405 ,  H01L33/502 ,  H01L33/62

摘要： A device includes a light emitting structure and a wavelength conversion member comprising a semiconductor. The light emitting structure is bonded to the wavelength conversion member. In some embodiments, the light emitting structure is bonded to the wavelength conversion member with an inorganic bonding material. In some embodiments, the light emitting structure is bonded to the wavelength conversion member with a bonding material having an index of refraction greater than 1.5.

摘要翻译： 一种器件包括发光结构和包括半导体的波长转换构件。 发光结构被结合到波长转换构件。 在一些实施例中，发光结构用无机粘合材料结合到波长转换构件。 在一些实施例中，发光结构用折射率大于1.5的接合材料结合到波长转换部件。

公开(公告)号：US07053419B1

公开(公告)日：2006-05-30

申请号：US09660317

申请日：2000-09-12

申请人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach

发明人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/505 ,  H01L2933/0058

摘要： Light emitting devices with improved light extraction efficiency are provided. The light emitting devices have a stack of layers including semiconductor layers comprising an active region. The stack is bonded to a transparent lens having a refractive index for light emitted by the active region preferably greater than about 1.5, more preferably greater than about 1.8. A method of bonding a transparent lens to a light emitting device having a stack of layers including semiconductor layers comprising an active region includes elevating a temperature of the lens and the stack and applying a pressure to press the lens and the stack together. Bonding a high refractive index lens to a light emitting device improves the light extraction efficiency of the light emitting device by reducing loss due to total internal reflection. Advantageously, this improvement can be achieved without the use of an encapsulant.

摘要翻译： 提供了具有提高光提取效率的发光器件。 发光器件具有包括有源区的半导体层的一叠层。 叠层结合到具有由有源区发射的光的折射率的透明透镜，优选大于约1.5，更优选大于约1.8。 将透明透镜粘合到具有包括有源区的半导体层的层叠的发光器件的方法包括提高透镜和叠层的温度并施加压力以将透镜和叠层压在一起。 将高折射率透镜粘合到发光器件通过减少由于全内反射引起的损耗来提高发光器件的光提取效率。 有利地，可以在不使用密封剂的情况下实现这种改进。

公开(公告)号：US07009213B2

公开(公告)日：2006-03-07

申请号：US10633054

申请日：2003-07-31

申请人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

发明人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/44 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.

摘要翻译： 一种器件包括结合到光学元件的发光半导体器件。 在一些实施例中，光学元件可以是细长的或成形的，以在与半导体发光器件和光学元件的中心轴线基本垂直的方向上引导由有源区域发射的光的一部分。 在一些实施例中，半导体发光器件和光学元件被定位在反射器中或与光导相邻。 光学元件可以通过在设置在光学元件和半导体发光器件之间的界面处的结合键合到第一半导体发光器件。 在一些实施方案中，该键基本上不含有机基粘合剂。

公开(公告)号：US07276737B2

公开(公告)日：2007-10-02

申请号：US11328964

申请日：2006-01-09

申请人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

发明人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/44 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.

摘要翻译： 一种器件包括结合到光学元件的发光半导体器件。 在一些实施例中，光学元件可以是细长的或成形的，以在与半导体发光器件和光学元件的中心轴线基本垂直的方向上引导由有源区域发射的光的一部分。 在一些实施例中，半导体发光器件和光学元件被定位在反射器中或与光导相邻。 光学元件可以通过在设置在光学元件和半导体发光器件之间的界面处的结合键合到第一半导体发光器件。 在一些实施方案中，该键基本上不含有机基粘合剂。

公开(公告)号：US07419839B2

公开(公告)日：2008-09-02

申请号：US10987241

申请日：2004-11-12

申请人： Michael D. Camras ,  William R. Imler ,  Frank S. Wall, Jr ,  Frank M. Steranka ,  Michael R. Krames ,  Helena Ticha ,  Ladislav Tichy

发明人： Michael D. Camras ,  William R. Imler ,  Frank S. Wall, Jr ,  Frank M. Steranka ,  Michael R. Krames ,  Helena Ticha ,  Ladislav Tichy

IPC分类号： H01L21/00

CPC分类号： H05B33/0857 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.

摘要翻译： 设备具有至少一个发光器件（LED）裸片，该发光器件（LED）裸片安装在具有随后热粘合到LED管芯上的光学元件的基座上。 LED管芯通过接触凸块电连接到副安装座，接触凸块具有比用于将光学元件热粘合到LED管芯的温度高的熔点。 在一个实现中，单个光学元件被结合到安装到基座上的多个LED芯片，并且基座和光学元件具有大致相同的热膨胀系数。 或者，可以使用多个光学元件。 光学元件或LED管芯可以用波长转换材料的涂层覆盖。 在一个实施方案中，测试该器件以确定产生的波长，并且添加波长转换材料的附加层，直到产生所需的波长。