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    Producing self-aligned and self-exposed photoresist patterns on light emitting devices
    9.
    发明授权
    Producing self-aligned and self-exposed photoresist patterns on light emitting devices 有权
    在发光器件上产生自对准和自曝光致抗蚀剂图案

    公开(公告)号：US06756186B2

    公开(公告)日：2004-06-29

    申请号：US10104883

    申请日：2002-03-22

    申请人： William D. Collins, III ,  Wayne L. Snyder ,  Daniel A. Steigerwald

    发明人： William D. Collins, III ,  Wayne L. Snyder ,  Daniel A. Steigerwald

    IPC分类号： H01J9227

    CPC分类号： H01L33/44 ,  H01L33/0095 ,  H01L33/505 ,  H01L2933/0041 ,  Y10S430/146

    摘要： A method of forming a photoresist mask on a light emitting device is disclosed. A portion of the light emitting device is coated with photoresist. A portion of the photoresist is exposed by light impinging on the interface of the light emitting device and the photoresist from inside the light emitting device. The photoresist is developed, removing either the exposed photoresist or the unexposed photoresist. In one embodiment, the photoresist mask may be used to form a phosphor coating. After the photoresist is developed to remove the exposed photoresist, a phosphor layer is deposited overlying the light emitting device. The unexposed portion of photoresist is stripped. In some embodiments, the light exposing the photoresist is produced by electrically biasing the light emitting device, or by shining light into the light emitting device through an aperture or by a focussed laser.

    摘要翻译： 公开了一种在发光器件上形成光刻胶掩模的方法。 发光器件的一部分涂覆有光致抗蚀剂。 光致抗蚀剂的一部分通过光照射在发光器件内部的发光器件和光致抗蚀剂的界面上而被曝光。 显影光致抗蚀剂，去除曝光的光致抗蚀剂或未曝光的光致抗蚀剂。 在一个实施例中，光致抗蚀剂掩模可用于形成荧光体涂层。 在光致抗蚀剂显影以除去曝光的光致抗蚀剂之后，将磷光体层沉积在发光器件上。 去除光刻胶的未曝光部分。 在一些实施例中，曝光光致抗蚀剂的光通过电偏置发光器件，或通过光圈或聚焦激光将光照射到发光器件中而产生。

    Concentrically leaded power semiconductor device package
    10.
    发明授权
    Concentrically leaded power semiconductor device package 有权
    集中引线功率半导体器件封装

    公开(公告)号：US06492725B1

    公开(公告)日：2002-12-10

    申请号：US09498311

    申请日：2000-02-04

    申请人： Ban Poh Loh ,  Douglas P. Woolverton ,  Wayne L. Snyder

    发明人： Ban Poh Loh ,  Douglas P. Woolverton ,  Wayne L. Snyder

    IPC分类号： H01L2348

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/00014

    摘要： A concentrically leaded power semiconductor package includes two or more generally concentric conductors. An inner conductor may provide an attachment point for one or more semiconductor devices at an end of the inner conductor and an electrical connection at an opposite end. An outer conductor may be pressed onto the inner conductor and may be separated by an electrical insulator. A semiconductor device, such as a light emitting diode (LED), may be attached to the inner conductor by epoxy gluing or by soldering, and may be attached to the outer conductor by a bonding wire. The package may be cylindrical or a rectangular solid. The package may incorporate additional semiconductor mounting surfaces and more than two conductors.

    摘要翻译： 同心引线的功率半导体封装包括两个或更多个大致同心的导体。 内部导体可以在内部导体的端部处提供用于一个或多个半导体器件的连接点和在相对端的电连接。 外部导体可以被压到内部导体上并且可以被电绝缘体分开。 诸如发光二极管（LED）的半导体器件可以通过环氧树脂胶合或通过焊接附接到内部导体，并且可以通过接合线附接到外部导体。 包装可以是圆柱形或矩形固体。 封装可以包含另外的半导体安装表面和多于两个的导体。