CATHODE COMPOSITION AND ELECTROCHEMICAL CELL COMPRISING SAME
    7.
    发明申请
    CATHODE COMPOSITION AND ELECTROCHEMICAL CELL COMPRISING SAME 有权
    阴离子组合物和包含其的电化学电池

    公开(公告)号:US20100279165A1

    公开(公告)日:2010-11-04

    申请号:US12433107

    申请日:2009-04-30

    IPC分类号: H01M4/58 H01M4/36 H01M6/42

    摘要: A cathode composition and a rechargeable electrochemical cell comprising same are disclosed. The cathode composition is described as comprising particles of one or more transition metal, alkali halometallate having a melting point of less than about 300 degrees Celsius, and at least one phosphorus composition additive selected from P-O compositions, P-halogen compositions, P-O-halogen compositions, and their reaction products and combinations. Also described is a rechargeable electrochemical cell comprising the composition. The phosphorus composition additive in the cathode composition of a cell is effective to lower the capacity degradation rate of the cell during operation relative to absence of the additive, and effective to lower the internal resistance of the cell when under operating conditions relative to absence of the additive.

    摘要翻译: 公开了一种阴极组合物和包含其的可再充电电化学电池。 阴极组合物被描述为包含一种或多种过渡金属的颗粒,熔点低于约300摄氏度的卤代金属卤化物,以及至少一种选自PO组合物,P-卤素组合物,PO-卤素组合物的磷组合物添加剂 ,及其反应产物和组合。 还描述了包含该组合物的可再充电电化学电池。 细胞阴极组合物中的磷组合物添加剂有效降低操作期间细胞相对于不存在添加剂的容量降解速率,并且在相对于不存在添加剂的操作条件下有效降低细胞的内部电阻 添加剂。

    Solid state device with encapsulant of cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride and boron catalyst
    10.
    发明授权
    Solid state device with encapsulant of cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride and boron catalyst 失效
    具有脂环族环氧树脂密封剂,4-甲基六氢邻苯二甲酸酐和硼催化剂的固态装置

    公开(公告)号:US06809162B2

    公开(公告)日:2004-10-26

    申请号:US10425904

    申请日:2003-04-29

    IPC分类号: C08K310

    摘要: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant (11) may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

    摘要翻译: 公开了环氧树脂组合物,其包含(A)至少一种环脂族环氧树脂,(B)包含六氢-4-甲基邻苯二甲酸酐的固化剂,(C)至少一种基本上不含卤素的含硼催化剂和( D)至少一种固化改性剂。 包封剂(11)还可任选地包含辅助固化催化剂,热稳定剂,UV稳定剂,偶联剂或折射率改性剂中的至少一种。 还公开了包括封装,芯片(4)和包含本发明的环氧树脂组合物的密封剂(11)的封装固态器件。 还提供了一种封装固态器件的方法。