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    Device and method for measuring a force component or torque component
    3.
    发明授权
    Device and method for measuring a force component or torque component 有权
    用于测量力分量或扭矩分量的装置和方法

    公开(公告)号：US06837117B2

    公开(公告)日：2005-01-04

    申请号：US10470835

    申请日：2002-11-27

    申请人： Michael Munz ,  Kurt Weiblen ,  Andreas Stratmann ,  Gerhard Wiest ,  Conrad Haeussermann

    发明人： Michael Munz ,  Kurt Weiblen ,  Andreas Stratmann ,  Gerhard Wiest ,  Conrad Haeussermann

    IPC分类号： G01G3/12 ,  G01G19/414 ,  G01G23/02 ,  G01L1/12 ,  G01L1/14 ,  G01L1/16 ,  G01L1/26 ,  G01L1/04

    CPC分类号： G01G19/4142 ,  G01G3/12

    摘要： A device and method for measuring at least one of a force component and a torque component. The device includes a deformation member, for measuring at least one of a force component and torque component, a separate measuring element, configured to measure at least one force component, and an electronics unit, connected to the measuring element configured to evaluate a measuring signal of the measuring element. The deformation member includes a base part and at least one tongue movable with respect to the base part. The base part is arranged so that a gap between the measuring element and the tongue has a gap width variable in response to the force component introduced onto the deformation member. The measuring element is configured to convert a change in the gap width into a measuring signal. The method includes the step of changing the gap width between the tongue and the measuring element by introducing the force component into the deformation member. The method further includes the step of detecting the change in the gap width by the measuring element. The method further includes the step of directing the measuring signal by the measuring element to the electronics unit for further processing as a function of the change in the gap width.

    摘要翻译： 一种用于测量力分量和扭矩分量中的至少一个的装置和方法。 该装置包括用于测量力分量和扭矩分量中的至少一个的变形构件，被配置为测量至少一个力分量的单独的测量元件和连接到测量元件的电子单元，该电子单元被配置为评估测量信号 的测量元件。 变形构件包括基部和相对于基部可移动的至少一个舌。 基部被布置成使得测量元件和舌头之间的间隙具有响应于引入到变形构件上的力分量而变化的间隙宽度。 测量元件被配置为将间隙宽度的变化转换为测量信号。 该方法包括通过将力分量引入变形构件来改变舌部与测量元件之间的间隙宽度的步骤。 该方法还包括通过测量元件检测间隙宽度的变化的步骤。 该方法还包括将测量元件引导到电子单元以进一步处理作为间隙宽度变化的函数的步骤。

    Sensor module
    5.
    发明授权
    Sensor module 有权
    传感器模块

    公开(公告)号：US07323766B2

    公开(公告)日：2008-01-29

    申请号：US10982982

    申请日：2004-11-04

    申请人： Kurt Weiblen ,  Franz Schmich ,  Harald Emmerich ,  Klaus Offterdinger ,  Hansjoerg Beutel ,  Johann Wehrmann ,  Florian Grabmaier

    发明人： Kurt Weiblen ,  Franz Schmich ,  Harald Emmerich ,  Klaus Offterdinger ,  Hansjoerg Beutel ,  Johann Wehrmann ,  Florian Grabmaier

    IPC分类号： H01L23/495

    CPC分类号： B81B7/0064 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01P1/023 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01068 ,  H01L2924/3025 ,  H01R13/6594 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.

    摘要翻译： 传感器模块，特别是用于测量加速度或转速，具有由塑料材料制成的壳体基体;延伸穿过壳体基体的引线框架，以及具有用于连接到电路板的连接器引脚的引线;传感器 系统具有至少一个传感器芯片，所述传感器系统通过导体接合与所述引线框架接触;盖，其连接到所述基体和至少一个连接器引脚并且由导电材料制成。 由于导电盖连接到连接器针的事实，实现了具有高屏蔽效果的简单结构。 当组件安装在电路板上时，盖子（例如盖子）可以通过连接器销与其它连接器引脚直接接触。 传感器模块可以被模制或者可以具有预成型的壳体。 盖的边缘或接触件可以被焊接，焊接，胶合或压到引线框架的接地引线。

    Method for producing a pressure sensor
    6.
    发明授权
    Method for producing a pressure sensor 有权
    压力传感器的制造方法

    公开(公告)号：US06804883B1

    公开(公告)日：2004-10-19

    申请号：US09603060

    申请日：2000-06-26

    申请人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

    发明人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

    IPC分类号： H01R4300

    CPC分类号： B81C1/00333 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L19/0084 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49174 ,  Y10T29/49176 ,  H01L2924/00014

    摘要： A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.

    摘要翻译： 一种制造压力传感器的方法，其中半导体压力传感器安装在引线格栅的安装部分，特别是引线框架上。 半导体压力传感器电连接到引线栅格的接触部分。 引线格栅与半导体压力传感器一起插入注塑模具中。 模具部件在半导体压力拾取器的背离安装部分或背离半导体压力传感器的安装部分的一侧被接触。 注射模具中的半导体压力拾取器随后由由模具化合物制成的壳体封闭。 为了防止安装部分的脱落，提出在制造壳体时将引线格栅的安装部分夹紧在注塑模具中。

    Housing and methods of producing a housing
    7.
    发明授权
    Housing and methods of producing a housing 失效
    住房和生产住房的方法

    公开(公告)号：US06661668B2

    公开(公告)日：2003-12-09

    申请号：US10031814

    申请日：2002-05-31

    申请人： Kurt Weiblen

    发明人： Kurt Weiblen

    IPC分类号： H05K506

    CPC分类号： H05K5/063

    摘要： A housing, in particular a housing for electronic components, which includes a housing part which is made of plastic and has at least one opening, and a lid part for closing off the opening. It is proposed that the lid part is produced as a metal punched part, the punched edge of the lid part having a punch ridge on a first side of the lid part and a punch indentation on a second side opposite the first side, and the lid part being pressed into the opening of the housing part via the second side so that the lid part comes to rest against assigned sections of the inner wall of the opening via at least two edge sections that are distributed around the perimeter of the lid part and bites into the assigned sections of the inner wall in a barb-like manner via the punch ridge.

    摘要翻译： 一种壳体，特别是电子部件用壳体，其包括由塑料制成并具有至少一个开口的壳体部分和用于封闭开口的盖部。 提出盖部分是作为金属冲压部分制成的，盖部分的冲压边缘在盖部分的第一侧上具有冲孔脊，在与第一侧相对的第二侧具有冲头压痕，盖子 部分经由第二侧被压入壳体部分的开口中，使得盖部分经由至少两个分布在盖部分的周边上的边缘部分并且咬合而抵靠开口的内壁的指定部分 通过冲孔脊以倒钩状的方式进入内壁的指定部分。

    Method for manufacturing a pressure sensor
    8.
    发明授权
    Method for manufacturing a pressure sensor 有权
    制造压力传感器的方法

    公开(公告)号：US06300169B1

    公开(公告)日：2001-10-09

    申请号：US09603082

    申请日：2000-06-26

    申请人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

    发明人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

    IPC分类号： H01L2144

    CPC分类号： G01L19/143 ,  G01L19/141 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/10253 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a method for manufacturing a pressure sensor, in which a semiconductor pressure sensing element is applied to an assembly segment of a lead grid, the semiconductor pressure sensing element is electrically connected to contact segments of the lead grid. The lead grid having the semiconductor pressure sensing element is inserted into an injection molding die, and then the semiconductor pressure sensing element, in the injection molding die, is surrounded by a housing made of injection molding compound. A structure is present in the injection molding die through which a pressure feed for the semiconductor pressure sensing element is left free from the jacket of injection molding compound. A stamp is arranged in the injection molding die so as to be separated by a gap from the side of the assembly segment that is facing away from the semiconductor pressure sensing element or from the side of the semiconductor pressure sensing element that is facing away from the assembly segment. As a result of a change in the temperature of the stamp relative to the temperature of the liquefied injection molding compound, a reduction in the flow capacity of the injection molding compound in the area of the stamp is brought about and, as a result, at least a complete penetration of the injection molding compound into the gap is avoided.

    摘要翻译： 在用于制造压力传感器的方法中，其中半导体压力感测元件被施加到引线栅的组装段，半导体压力感测元件电连接到引线栅的接触段。 具有半导体压力感测元件的引线格栅被插入到注射成型模具中，然后在注射成型模具中的半导体压力感测元件被由注射成型化合物制成的壳体包围。 在注模模具中存在一种结构，通过该结构，半导体压力传感元件的压力进料不被注射模塑料的夹套留下。 在注射成型模具中布置有印模，以便与组件段的背离半导体压力感测元件的侧面或从半导体压力感测元件的背离背面的间隙分开 装配段 由于印模温度相对于液化注射模塑料的温度变化的结果，注塑模具在印模区域的流动能力降低，结果是在 避免了将注射成型化合物完全渗透到间隙中。

    Electromagnetic compatibility filter utilizing inherently formed capacitance
    10.
    发明授权
    Electromagnetic compatibility filter utilizing inherently formed capacitance 失效
    电磁兼容滤波器利用固有的电容

    公开(公告)号：US5525943A

    公开(公告)日：1996-06-11

    申请号：US223071

    申请日：1994-04-04

    申请人： Walter Roethlingshoefer ,  Kurt Weiblen ,  Peter Tauber ,  Uwe Lipphardt

    发明人： Walter Roethlingshoefer ,  Kurt Weiblen ,  Peter Tauber ,  Uwe Lipphardt

    IPC分类号： H04B15/02 ,  H05K9/00 ,  H03H7/00

    CPC分类号： H04B15/02

    摘要： An electromagnetic compatibility (EMC) filter used in a hybrid technology circuit component, having current-carrying lines and a ground conductor, for protection against electromagnetic interference. The current-carrying lines and ground conductor are arranged on a ceramic plate. The current-carrying lines are covered by a dielectric, which in turn, is covered by an upper metal screen in electrical contact with the ground conductor. A lower metal screen is arranged on the ceramic plate beneath the current-carrying lines and is in electrical contact with the ground conductor.

    摘要翻译： 用于混合技术电路部件的电磁兼容（EMC）滤波器，具有载流线路和接地导体，用于防止电磁干扰。 载流线和接地导体布置在陶瓷板上。 载流线由电介质覆盖，电介质又由与接地导体电接触的上金属屏蔽覆盖。 下部金属屏幕布置在载流线下方的陶瓷板上，并与接地导体电接触。