摘要:
High rubber graft thermoplastic compositions are prepared by melt blending an EPDM or an EP rubber and a copolymer derived from a vinyl cyanide compound and a vinyl aromatic compound. Both the copolymer and the rubber are independently either epoxy or carboxy functionalized.
摘要:
Polyphenylene ether-olefin polymer compositions having improved properties are obtained by first blending an acyl group- or electrophilic group-functionalized polyphenylene ether of relatively high molecular weight with a lower molecular weight unfunctionalized polyphenylene ether to form a blend of which the lower molecular weight polymer comprises about 45-60% by weight, subsequently blending with an electrophilic group- or acyl group-functionalized olefin polymer (respectively), preferably a glycidyl methacrylate-grafted EPDM copolymer, and finally blending with a curing agent such as hexamethylenediaminemonocarbamic acid.
摘要:
Resinous compositions are prepared by blending an ABS copolymer or similar addition polymer, a polyphenylene ether-polystyrene blend, and a copolymer of an olefin such as ethylene and an epoxy compound such as glycidyl methacrylate. The first two constituents may be scrap materials. The resulting compositions have high impact strength and other advantageous properties.
摘要:
A composition prepared by blending liquid crystalline polyesters and linear polyesters under reactive conditions in the presence of at least one poly(O- or N- epoxy alkyl substituted) cyclic amide, imide, or imidate; wherein the blend exhibits an anisotropic melt phase. Articles made from the composition have increased strength stiffness and improved drip characteristics. A preferred embodiment includes a polyalkylene terephthalate, a liquid crystalline polyester with structural units including p-benzoic acid and naphthoic acid, and triglycidyl isocyanurate.
摘要:
A composition prepared by blending both consumer-used household plastic resins with an ortho ester grafted copolymer derived from components comprising ethylene and a C.sub.3-10 mono-olefin is disclosed. The plastic resins comprise at least 50 percent polyethylene.
摘要:
High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
摘要:
Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions.