公开(公告)号：US20060175431A1

公开(公告)日：2006-08-10

申请号：US11302091

申请日：2005-12-12

Applicant: Michael Renn ,  Bruce King ,  Jason Paulsen

Inventor： Michael Renn ,  Bruce King ,  Jason Paulsen

IPC: B05B1/28 ,  B05C5/00

CPC classification number: A62C31/00 ,  B05B7/0416 ,  B05B7/0884 ,  C23C18/06 ,  F23D11/16

Abstract: A miniaturized aerosol jet, or an array of miniaturized aerosol jets for direct printing of various aerosolized materials. In the most commonly used embodiment, an aerosol stream is focused and deposited onto a planar or non-planar target, forming a pattern that is thermally or photochemically processed to achieve physical, optical, and/or electrical properties near that of the corresponding bulk material. The apparatus uses an aerosol jet deposition head to form an annularly propagating jet composed of an outer sheath flow and an inner aerosol-laden carrier flow. Miniaturization of the deposition head facilitates the fabrication and operation of arrayed deposition heads, enabling construction and operation of arrays of aerosol jets capable of independent motion and deposition. Arrayed aerosol jets provide an increased deposition rate, arrayed deposition, and multi-material deposition.

Abstract translation: 小型化气溶胶喷射器或用于直接印刷各种气雾化材料的小型化气溶胶喷射器阵列。 在最常用的实施例中，气溶胶流被聚焦并沉积到平面或非平面靶上，形成热或光化学处理的图案，以达到靠近相应散装材料的物理，光学和/或电特性 。 该装置使用气溶胶喷射沉积头来形成由外鞘流和内部气溶胶载体流组成的环形传播射流。 沉积头的小型化有助于阵列沉积头的制造和操作，使得能够独立运动和沉积的气溶胶喷嘴阵列的构造和操作成为可能。 阵列气溶胶喷射器提供增加的沉积速率，排列沉积和多材料沉积。

公开(公告)号：US20080013299A1

公开(公告)日：2008-01-17

申请号：US11779868

申请日：2007-07-18

Applicant: Michael Renn

Inventor： Michael Renn

IPC: H05K9/00

CPC classification number: B41J2/04

Abstract: A miniaturized aerosol jet, or an array of miniaturized aerosol jets for direct printing of various aerosolized materials. In the most commonly used embodiment, an aerosol stream is focused and deposited onto a planar or non-planar target, forming a pattern that is thermally or photochemically processed to achieve physical, optical, and/or electrical properties near that of the corresponding bulk material. The apparatus uses an aerosol jet deposition head to form an annularly propagating jet composed of an outer sheath flow and an inner aerosol-laden carrier flow. Miniaturization of the deposition head facilitates the fabrication and operation of arrayed deposition heads, enabling construction and operation of arrays of aerosol jets capable of independent motion and deposition. Arrayed aerosol jets provide an increased deposition rate, arrayed deposition, and multi-material deposition. Applications for the miniaturized aerosol jet or jet array include direct patterning for EMI shielding and interconnects.

Abstract translation: 小型化气溶胶喷射器或用于直接印刷各种气雾化材料的小型化气溶胶喷射器阵列。 在最常用的实施例中，气溶胶流被聚焦并沉积到平面或非平面靶上，形成热或光化学处理的图案，以达到靠近相应散装材料的物理，光学和/或电特性 。 该装置使用气溶胶喷射沉积头来形成由外鞘流和内部气溶胶载体流组成的环形传播射流。 沉积头的小型化有助于阵列沉积头的制造和操作，使得能够独立运动和沉积的气溶胶喷嘴阵列的构造和操作成为可能。 阵列气溶胶喷射器提供增加的沉积速率，排列沉积和多材料沉积。 用于小型化气溶胶射流或喷射阵列的应用包括用于EMI屏蔽和互连的直接图案化。

公开(公告)号：US20050129383A1

公开(公告)日：2005-06-16

申请号：US10952108

申请日：2004-09-27

Applicant: Michael Renn ,  Bruce King ,  Marcelino Essien

Inventor： Michael Renn ,  Bruce King ,  Marcelino Essien

IPC: B05D1/02 ,  B05D1/12 ,  B05D1/40 ,  B05D3/00 ,  B05D3/06 ,  B05D5/12 ,  B05D7/02 ,  B23K20060101 ,  C08F2/46 ,  C08J7/04 ,  C08J7/18 ,  C23C18/02 ,  C23C18/14 ,  G02B6/00 ,  H01L51/00

CPC classification number: H05K3/125 ,  B05D1/02 ,  B05D3/06 ,  C08F2/46 ,  C23C18/02 ,  C23C18/14 ,  H01L51/0009

Abstract: A method of depositing various materials onto heat-sensitive targets. Heat-sensitive targets are generally defined as targets that have thermal damage thresholds that are lower than the temperature required to process a deposited material. The invention uses precursor solutions and/or particle or colloidal suspensions, along with optional pre-deposition treatment and/or post-deposition treatment to lower the laser power required to drive the deposit to its final state. The present invention uses Maskless Mesoscale Material Deposition (M3D™) to perform direct deposition of material onto the target in a precise, highly localized fashion. Features with linewidths as small as 4 microns may be deposited, with little or no material waste. A laser is preferably used to heat the material to process it to obtain the desired state, for example by chemical decomposition, sintering, polymerization, and the like. This laser processing may be performed in an ambient environment with laser powers of less than 100 milliwatts.

Abstract translation: 将各种材料沉积在热敏靶上的方法。 热敏靶标通常定义为具有低于处理沉积材料所需温度的热损伤阈值的靶。 本发明使用前体溶液和/或颗粒或胶态悬浮液以及任选的预沉积处理和/或沉积后处理以降低将沉积物驱动到其最终状态所需的激光功率。 本发明使用无掩模中尺度材料沉积（M 3 S D D TM）以精确，高度局部化的方式将材料直接沉积到靶上。 具有小至4微米的线宽的特征可能被沉积，很少或没有材料浪费。 优选使用激光加热材料以加工以获得期望的状态，例如通过化学分解，烧结，聚合等。 该激光处理可以在具有小于100毫瓦的激光功率的周围环境中进行。

公开(公告)号：US20070154634A1

公开(公告)日：2007-07-05

申请号：US11611010

申请日：2006-12-14

Applicant: Michael Renn

Inventor： Michael Renn

IPC: B05D1/12 ,  B05D7/00 ,  B05D3/00

CPC classification number: B22F1/0062 ,  A61F2002/30968 ,  B22F1/0022 ,  B22F3/105 ,  B41M7/009 ,  B82Y30/00 ,  C03C17/006 ,  C03C2217/42 ,  C03C2218/32 ,  C23C4/134 ,  C23C4/18 ,  C23C8/02 ,  C23C8/10 ,  C23C8/80 ,  C23C24/04 ,  C23C26/00 ,  H01C17/06506 ,  H05K3/102 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/095 ,  H05K2203/1131

Abstract: Method and apparatus for low temperature sintering of sintering of printable conductive inks, preferably using a plasma. The inks can be deposited on a substrate using any number of deposition techniques, and can be applied to processing on materials including, but not limited to, electronic, biologic, and low-temperature substrates. The inks preferably comprise metallic nanoparticles coated with an organic non-conductive material. The plasma removes the organic material and facilitates the sintering of the metallic particles into a continuous deposit, without exposing the substrate to high temperatures.

Abstract translation: 优选使用等离子体的可印刷导电油墨的烧结低温烧结的方法和装置。 油墨可以使用任何数量的沉积技术沉积在基材上，并且可以应用于包括但不限于电子，生物和低温基材的材料的加工。 油墨优选包含用有机非导电材料涂覆的金属纳米颗粒。 等离子体去除有机材料，并且有助于将金属颗粒烧结成连续沉积物，而不将基底暴露于高温。

公开(公告)号：US20050163917A1

公开(公告)日：2005-07-28

申请号：US10914525

申请日：2004-08-09

Applicant: Michael Renn

Inventor： Michael Renn

IPC: B05D5/12 ,  B41J2/015 ,  B41J2/02 ,  B41J29/38 ,  C23C4/12 ,  C23C18/00 ,  C23C24/04 ,  H01L21/60 ,  H05K3/10

CPC classification number: C23C4/12 ,  B41J2/215 ,  B41J2/435 ,  C23C24/04 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/24011 ,  H01L2224/76155 ,  H01L2224/81801 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/102 ,  H01L2924/00

Abstract: Although the present invention has been described in detail with reference to particular preferred and alternative embodiments, persons possessing ordinary skill in the art to which this invention pertains will appreciate that various modifications and enhancements may be made without departing from the spirit and scope of the Claims that follow. The various configurations that have been disclosed above are intended to educate the reader about preferred and alternative embodiments, and are not intended to constrain the limits of the invention or the scope of the Claims. The List of Reference Characters which follows is intended to provide the reader with a convenient means of identifying elements of the invention in the Specification and Drawings. This list is not intended to delineate or narrow the scope of the Claims.

Abstract translation: 虽然已经参考特定优选和替代实施例详细描述了本发明，但是本发明所属领域的普通技术人员将会理解，在不脱离本发明的精神和范围的情况下，可以进行各种修改和增强 跟随。 上面已经公开的各种配置旨在教育读者关于优选和替代实施例，并且不旨在限制本发明的限制或权利要求的范围。 下面的参考符号列表旨在为读者提供在说明书和附图中识别本发明的元件的便利手段。 该清单并非旨在描述或缩小权利要求的范围。

公开(公告)号：US20050156991A1

公开(公告)日：2005-07-21

申请号：US10952107

申请日：2004-09-27

Applicant: Michael Renn

Inventor： Michael Renn

IPC: B05D5/12 ,  B41J2/015 ,  C23C18/00

CPC classification number: H05K3/105 ,  B05B17/0615 ,  C23C18/08 ,  H01L2924/14 ,  H05K3/14

Abstract: Methods and apparatus for the deposition of a source material (10) are disclosed. An atomizer (12) renders a supply of source material (10) into many discrete particles. A force applicator (14) propels the particles in continuous, parallel streams of discrete particles. A collimator (16) controls the direction of flight of the particles in the stream prior to their deposition on a substrate (18). In an alternative embodiment of the invention, the viscosity of the particles may be controlled to enable complex depositions of non-conformal or three-dimensional surfaces. The invention also includes a wide variety of substrate treatments which may occur before, during or after deposition. In yet another embodiment of the invention, a virtual or cascade impactor may be employed to remove selected particles from the deposition stream. Also a method and apparatus for maskless deposition of copper lines on a target, specifically relating to localized solution-based deposition of copper using an annular aerosol jet and subsequent material processing using conventional thermal techniques or laser processing.

Abstract translation: 公开了用于沉积源材料（10）的方法和装置。 雾化器（12）将源材料（10）供应到许多离散的颗粒中。 力施加器（14）推动颗粒处于连续的，平行的离散颗粒流中。 准直器（16）在其沉积在基底（18）上之前控制颗粒在流中的飞行方向。 在本发明的另一个实施方案中，可以控制颗粒的粘度以使复合物沉积非保形或三维表面。 本发明还包括可以在沉积之前，期间或之后发生的各种各样的基底处理。 在本发明的另一个实施例中，可以使用虚拟或级联冲击器来从沉积流中去除所选择的颗粒。 还有一种用于将铜线无掩模沉积在靶上的方法和装置，特别涉及使用环形气溶胶射流和随后使用常规热技术或激光加工的材料处理的局部溶液沉积铜。

公开(公告)号：US20070181060A1

公开(公告)日：2007-08-09

申请号：US11458966

申请日：2006-07-20

Applicant: Michael Renn ,  Bruce King ,  Manampathy Giridharan ,  Jyh-Cherng Sheu

Inventor： Michael Renn ,  Bruce King ,  Manampathy Giridharan ,  Jyh-Cherng Sheu

IPC: B05C5/00

CPC classification number: C23C4/12 ,  B41J2/215 ,  B41J2/435 ,  C23C24/04 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/24011 ,  H01L2224/76155 ,  H01L2224/81801 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/102 ,  H01L2924/00

Abstract: Methods and apparatus for the deposition of a source material (10) are disclosed. An atomizer (12) renders a supply of source material (10) into many discrete particles. A force applicator (14) propels the particles in continuous, parallel streams of discrete particles. A collimator (16) controls the direction of flight of the particles in the stream prior to their deposition on a substrate (18). In an alternative embodiment of the invention, the viscosity of the particles may be controlled to enable complex depositions of non-conformal or three-dimensional surfaces. The invention also includes a wide variety of substrate treatments which may occur before, during or after deposition. In yet another embodiment of the invention, a virtual or cascade impactor may be employed to remove selected particles from the deposition stream.

Abstract translation: 公开了用于沉积源材料（10）的方法和装置。 雾化器（12）将源材料（10）供应到许多离散的颗粒中。 力施加器（14）推动颗粒处于连续的，平行的离散颗粒流中。 准直器（16）在其沉积在基底（18）上之前控制颗粒在流中的飞行方向。 在本发明的另一个实施方案中，可以控制颗粒的粘度以使复合物沉积非保形或三维表面。 本发明还包括可以在沉积之前，期间或之后发生的各种各样的基底处理。 在本发明的另一个实施例中，可以使用虚拟或级联冲击器来从沉积流中去除所选择的颗粒。

公开(公告)号：US20060163570A1

公开(公告)日：2006-07-27

申请号：US11302481

申请日：2005-12-12

Applicant: Michael Renn ,  Marcelino Essien ,  Bruce King ,  Jason Paulsen

Inventor： Michael Renn ,  Marcelino Essien ,  Bruce King ,  Jason Paulsen

IPC: H01L23/58 ,  H01L21/20

CPC classification number: H01L21/76877 ,  B05D1/02 ,  H01B13/0026 ,  H01C17/06 ,  H01C17/08 ,  H01L21/76802 ,  H01L21/76804 ,  H01L21/76805 ,  H01L21/76879 ,  H01L41/314

Abstract: Method and apparatus for direct writing of passive structures having a tolerance of 5% or less in one or more physical, electrical, chemical, or optical properties. The present apparatus is capable of extended deposition times. The apparatus may be configured for unassisted operation and uses sensors and feedback loops to detect physical characteristics of the system to identify and maintain optimum process parameters.

Abstract translation: 用于在一种或多种物理，电学，化学或光学性质中直接写入具有5％或更小的公差的被动结构的方法和装置。 本装置能够延长沉积时间。 该装置可以被配置为无辅助操作，并且使用传感器和反馈回路来检测系统的物理特性以识别和维持最佳过程参数。

公开(公告)号：US20060008590A1

公开(公告)日：2006-01-12

申请号：US11011366

申请日：2004-12-13

Applicant: Bruce King ,  Michael Renn ,  Marcelino Essien ,  Gregory Marquez ,  Manampathy Giridharan ,  Jyh-Cherng Sheu

Inventor： Bruce King ,  Michael Renn ,  Marcelino Essien ,  Gregory Marquez ,  Manampathy Giridharan ,  Jyh-Cherng Sheu

IPC: B05C5/00 ,  B05B1/30 ,  B05D1/02

CPC classification number: H05K3/125

Abstract: Method and apparatus for improved maskless deposition of electronic and biological materials using an extended nozzle. The process is capable of direct deposition of features with linewidths varying from a few microns to a fraction of a millimeter, and can be used to deposit features on targets with damage thresholds near 100° C. or less. Deposition and subsequent processing may be performed under ambient conditions and produce linewidths as low as 1 micron, with sub-micron edge definition. The extended nozzle reduces particle overspray and has a large working distance; that is, the orifice to target distance may be several millimeters or more, enabling direct write onto non-planar surfaces. The nozzle allows for deposition of features with linewidths that are approximately as small as one-twentieth the size of the nozzle orifice diameter, and is preferably interchangeable, enabling rapid variance of deposited linewidth.

Abstract translation: 使用扩展喷嘴改善电子和生物材料的无掩模沉积的方法和装置。 该过程能够直线沉积具有从几微米变化到几分之一毫米的线宽的特征，并且可以用于在具有接近100℃或更低的损伤阈值的靶上沉积特征。 沉积和后续处理可以在环境条件下进行，并产生低至1微米的线宽，具有亚微米边缘定义。 扩展喷嘴可以减少颗粒过度喷涂，工作距离大; 也就是说，孔到目标距离可以是几毫米或更多，使得能够直接写在非平面表面上。 喷嘴允许具有大约等于喷嘴孔直径的二十分之二的线宽的特征的沉积，并且优选地是可互换的，使得沉积线宽的快速变化。

公开(公告)号：US20070019028A1

公开(公告)日：2007-01-25

申请号：US11430636

申请日：2006-05-08

Applicant: Michael Renn ,  Bruce King ,  Marcelino Essien ,  Manampathy Giridharan ,  Jyh-Cherng Sheu

Inventor： Michael Renn ,  Bruce King ,  Marcelino Essien ,  Manampathy Giridharan ,  Jyh-Cherng Sheu

IPC: B41J2/015

CPC classification number: H05K3/102 ,  H05K3/105 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/107 ,  H05K2203/1344 ,  Y10S428/901

Abstract: A method of depositing various materials onto heat-sensitive targets, particularly oxygen-sensitive materials. Heat-sensitive targets are generally defined as targets that have thermal damage thresholds that are lower than the temperature required to process a deposited material. The invention uses precursor solutions and/or particle or colloidal suspensions, along with optional pre-deposition treatment and/or post-deposition treatment to lower the laser power required to drive the deposit to its final state. The present invention uses Maskless Mesoscale Material Deposition (M3D™) to perform direct deposition of material onto the target in a precise, highly localized fashion. Features with linewidths as small as 4 microns may be deposited, with little or no material waste. A laser is preferably used to heat the material to process it to obtain the desired state, for example by chemical decomposition, sintering, polymerization, and the like. This laser processing may be performed in an ambient environment with laser powers of less than 100 milliwatts. Cover gases and/or forming gases may be used during thermal processing to change the material properties, for example by preventing oxidation.

Abstract translation: 将各种材料沉积在热敏性靶材上，特别是氧敏感材料的方法。 热敏靶标通常定义为具有低于处理沉积材料所需温度的热损伤阈值的靶。 本发明使用前体溶液和/或颗粒或胶态悬浮液以及任选的预沉积处理和/或沉积后处理以降低将沉积物驱动到其最终状态所需的激光功率。 本发明使用无掩模中尺度材料沉积（M 3 S D D TM）以精确，高度局部化的方式将材料直接沉积到靶上。 具有小至4微米的线宽的特征可能被沉积，很少或没有材料浪费。 优选使用激光加热材料以加工以获得期望的状态，例如通过化学分解，烧结，聚合等。 该激光处理可以在具有小于100毫瓦的激光功率的周围环境中进行。 可以在热处理期间使用覆盖气体和/或成形气体来改变材料性质，例如通过防止氧化。