公开(公告)号：US09806014B2

公开(公告)日：2017-10-31

申请号：US15007791

申请日：2016-01-27

申请人： Michael S. Alfano ,  Bryan Black ,  Michael Z. Su ,  Joseph R. Siegel ,  Julius E. Din ,  Anwar Kashem

发明人： Michael S. Alfano ,  Bryan Black ,  Michael Z. Su ,  Joseph R. Siegel ,  Julius E. Din ,  Anwar Kashem

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC分类号： H01L24/81 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5384 ,  H01L24/16 ,  H01L2224/16227

摘要： Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, an apparatus is provided that includes an interposer that has a first side and a second side opposite the first side. The first side has a first reticle field and a second reticle field larger than the first reticle field. Plural conductor pads are positioned on the first side in the first reticle field. Plural dummy conductor pads are positioned on the first side in the second reticle field and outside the first reticle field.

公开(公告)号：US09793239B2

公开(公告)日：2017-10-17

申请号：US14865816

申请日：2015-09-25

申请人： Michael Z. Su ,  Michael S. Alfano ,  Bryan Black

发明人： Michael Z. Su ,  Michael S. Alfano ,  Bryan Black

IPC分类号： H01L21/66 ,  H01L25/065 ,  H01L21/768 ,  H01L23/367 ,  H01L25/00 ,  H01L23/498 ,  H01L23/528 ,  H01L21/78

CPC分类号： H01L25/0652 ,  H01L21/768 ,  H01L21/78 ,  H01L22/20 ,  H01L23/3675 ,  H01L23/49838 ,  H01L23/528 ,  H01L25/50 ,  H01L2225/06589

摘要： Various semiconductor workpieces with selective backside metallizations and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor workpiece that has multiple dies. A backside metallization is fabricated on a first die of the dies but not on a second die of the dies.

公开(公告)号：US20170092616A1

公开(公告)日：2017-03-30

申请号：US14865816

申请日：2015-09-25

申请人： Michael Z. Su ,  Michael S. Alfano ,  Bryan Black

发明人： Michael Z. Su ,  Michael S. Alfano ,  Bryan Black

IPC分类号： H01L25/065 ,  H01L21/66 ,  H01L21/78 ,  H01L25/00 ,  H01L23/498 ,  H01L23/528 ,  H01L21/768 ,  H01L23/367

CPC分类号： H01L25/0652 ,  H01L21/768 ,  H01L21/78 ,  H01L22/20 ,  H01L23/3675 ,  H01L23/49838 ,  H01L23/528 ,  H01L25/50 ,  H01L2225/06589

摘要： Various semiconductor workpieces with selective backside metallizations and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor workpiece that has multiple dies. A backside metallization is fabricated on a first die of the dies but not on a second die of the dies.

公开(公告)号：US20170213787A1

公开(公告)日：2017-07-27

申请号：US15007791

申请日：2016-01-27

申请人： Michael S. Alfano ,  Bryan Black ,  Michael Z. Su ,  Joseph R. Siegel ,  Julius E. Din ,  Anwar Kashem

发明人： Michael S. Alfano ,  Bryan Black ,  Michael Z. Su ,  Joseph R. Siegel ,  Julius E. Din ,  Anwar Kashem

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L21/48

CPC分类号： H01L24/81 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5384 ,  H01L24/16 ,  H01L2224/16227

摘要： Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, an apparatus is provided that includes an interposer that has a first side and a second side opposite the first side. The first side has a first reticle field and a second reticle field larger than the first reticle field. Plural conductor pads are positioned on the first side in the first reticle field. Plural dummy conductor pads are positioned on the first side in the second reticle field and outside the first reticle field.

公开(公告)号：US20160329312A1

公开(公告)日：2016-11-10

申请号：US14704044

申请日：2015-05-05

申请人： Sean M. O'Mullan ,  Michael S. Alfano ,  Bryan Black

发明人： Sean M. O'Mullan ,  Michael S. Alfano ,  Bryan Black

IPC分类号： H01L25/18 ,  G01R31/28 ,  H01L23/498 ,  H01L21/66 ,  H01L25/00

CPC分类号： H01L25/18 ,  G01R31/2834 ,  G01R31/2856 ,  G01R31/2884 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/98 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H05K1/181 ,  H01L2924/014 ,  H01L2924/00014

摘要： Various semiconductor chip and interposer devices are disclosed. In one aspect, an apparatus is provided that includes an interposer, a first semiconductor chip mounted on the interposer and a second semiconductor chip mounted on and electrically connected to the first semiconductor chip by the interposer. The second semiconductor chip includes offloaded logic of the first semiconductor chip.

摘要翻译： 公开了各种半导体芯片和插入器件。 一方面，提供了一种装置，其包括插入器，安装在插入件上的第一半导体芯片和通过插入器安装在第一半导体芯片上并与第一半导体芯片电连接的第二半导体芯片。 第二半导体芯片包括第一半导体芯片的卸载逻辑。