Sensing light emitted from multiple light sources
    1.
    发明授权
    Sensing light emitted from multiple light sources 有权
    感测从多个光源发出的光

    公开(公告)号:US07432668B2

    公开(公告)日:2008-10-07

    申请号:US10539980

    申请日:2003-12-12

    IPC分类号: H05B37/00

    摘要: An apparatus is directed to controlling a light source. The apparatus provides at least one light source that emits a light signal at a discrete frequency and a reference signal at the discrete frequency. The apparatus further includes a photodetector optically coupled to the light source and designed to receive the light signal. The apparatus additionally includes at least one lock-in system coupled to the photodetector and each light source that receives the light signal from the photodetector and receives the reference signal from the light source. Each lock-in system produces an intensity value of the light source based on the light signal and the reference signal. The lock-in system may include a frequency multiplier and a filter coupled to the frequency multiplier wherein the intensity value is the product of the light signal and the reference signal processed through the frequency multiplier, and filtered to remove non-dc portions.

    摘要翻译: 一种装置用于控制光源。 该装置提供至少一个以离散频率发射光信号的光源和离散频率的参考信号。 该装置还包括光学检测器,其光耦合到光源并被设计为接收光信号。 该设备还包括耦合到光电检测器和每个光源的至少一个锁定系统,其接收来自光电检测器的光信号并从光源接收参考信号。 每个锁定系统基于光信号和参考信号产生光源的强度值。 锁定系统可以包括耦合到倍频器的倍频器和滤波器,其中强度值是通过倍频器处理的光信号和参考信号的乘积,并被滤波以去除非直流部分。

    DEVICE FOR IMPROVING COMPATIBILITY OF SOLID STATE LIGHT SOURCES WITH PHASE-CUT DIMMERS
    2.
    发明申请
    DEVICE FOR IMPROVING COMPATIBILITY OF SOLID STATE LIGHT SOURCES WITH PHASE-CUT DIMMERS 审中-公开
    用于提高固体状态光源与相切切割器相容性的装置

    公开(公告)号:US20140191683A1

    公开(公告)日:2014-07-10

    申请号:US14239548

    申请日:2012-09-06

    IPC分类号: H05B33/08

    摘要: A device suppresses flicker and improves compatibility of a lamp including at least one solid state light source, the lamp being operably connected to a control circuit, such as a dimmer circuit. The device includes a connector enabling connection of the solid state light source to a lamp socket configured to receive an incandescent light source, and an adapter circuit connected in parallel with the at least one solid state light source when the solid state light source is connected to the socket via the connector. The adapter circuit provides a resistive path for current to pass through the lamp, during all or part of the AC mains cycle.

    摘要翻译: 装置抑制闪烁并提高包括至少一个固态光源的灯的兼容性,该灯可操作地连接到诸如调光器电路的控制电路。 该装置包括能够将固态光源连接到被配置为接收白炽光源的灯插座的连接器,以及当固态光源连接到该固态光源时与该至少一个固态光源并联连接的适配器电路 插座通过连接器。 在全部或部分交流电源周期期间,适配器电路提供电流通过灯的电阻路径。

    LED lighting fixtures
    3.
    发明授权
    LED lighting fixtures 有权
    LED照明灯具

    公开(公告)号:US07802902B2

    公开(公告)日:2010-09-28

    申请号:US12088360

    申请日:2006-09-25

    IPC分类号: F21V33/00

    摘要: A lighting fixture (20-23) mechanically encloses a LED module (30), which includes at least one LED (40) and can further include a LED driver (50) in electrical communication with the LED(s) (40) to operably provide a LED drive signal to the at least one LED (40), a thermal management system (60) in thermal communication with the LED(s) (40) and the lighting fixture (20-23) to facilitate a heat transfer from the LED(s) (40) to the lighting fixture (20-23), and/or a beam shaper (70) in optical communication with the LED(s) (40) to modify an illumination profile of a radiation beam emitted by the LED(s) (40).

    摘要翻译: 一种照明器具(20-23)机械地封装LED模块(30),其包括至少一个LED(40),并且还可以包括与LED(40)电连通的LED驱动器(50),以可操作地 向所述至少一个LED(40)提供LED驱动信号,与所述LED(40)和所述照明器具(20-23)热连通的热管理系统(60),以便于从所述LED LED(40)到照明器具(20-23)和/或与LED(40)光学通信的光束整形器(70),以修改由LED(...)发射的辐射束的照明轮廓 LED(40)。

    Method for maintaining light characteristics from a multi-chip LED package
    6.
    发明授权
    Method for maintaining light characteristics from a multi-chip LED package 有权
    用于保持来自多芯片LED封装的光特性的方法

    公开(公告)号:US06998594B2

    公开(公告)日:2006-02-14

    申请号:US10179352

    申请日:2002-06-25

    IPC分类号: G01J1/32

    CPC分类号: H05B33/0869

    摘要: The present invention provides a method, system and structure for maintaining light characteristics from a multi-chip LED package. This may be done by selecting a desired light output and restricting light from a plurality of light emitting diodes in the multi-chip LED package. It may also be done by measuring the restricted light, comparing the measured output light to the desired light and by adjusting current to LEDs in the multi-chip LED package based on the measured light.

    摘要翻译: 本发明提供一种用于保持来自多芯片LED封装的光特性的方法,系统和结构。 这可以通过选择期望的光输出并且限制来自多芯片LED封装中的多个发光二极管的光来实现。 也可以通过测量受限光,将测量的输出光与期望的光进行比较,并且基于测量的光通过调整多芯片LED封装中的LED的电流来完成。

    III-V/II-VI Semiconductor interface fabrication method
    7.
    发明授权
    III-V/II-VI Semiconductor interface fabrication method 失效
    III-V / II-VI半导体接口制造方法

    公开(公告)号:US5879962A

    公开(公告)日:1999-03-09

    申请号:US571607

    申请日:1995-12-13

    摘要: A method for repeatably fabricating GaAs/ZnSe and other III-V/II-VI semiconductor interfaces with relatively low stacking fault densities in II-VI semiconductor devices such as laser diodes. The method includes providing a molecular beam epitaxy (MBE) system including at least a group III element source, a group II element source, a group V element source and a group VI element source. A semiconductor substrate having a III-V semiconductor surface on which the interface is to be fabricated is positioned within the MBE system. The substrate is then heated to a temperature suitable for III-V semiconductor growth, and a crystalline III-V semiconductor buffer layer grown on the III-V surface of the substrate. The temperature of the semiconductor substrate is then adjusted to a temperature suitable for II-VI semiconductor growth, and a crystalline II-VI semiconductor buffer layer grown on the III-V buffer layer by alternating beam epitaxy. The group II and group VI sources are operated to expose the III-V buffer layer to a group II element flux before exposing the III-V buffer layer to a group VI element flux.

    摘要翻译: 一种用于在II-VI半导体器件(例如激光二极管)中重复制造GaAs / ZnSe和其他具有相对较低堆垛层错密度的III-V / II-VI半导体界面的方法。 该方法包括提供包括至少III族元素源,II族元素源,V族元素源和VI族元素源的分子束外延(MBE)系统。 具有要在其上制造界面的III-V半导体表面的半导体衬底位于MBE系统内。 然后将衬底加热到​​适于III-V半导体生长的温度,以及在衬底的III-V表面上生长的晶体III-V半导体缓冲层。 然后将半导体衬底的温度调节到适合于II-VI半导体生长的温度,以及通过交替射束外延在III-V缓冲层上生长的晶体II-VI半导体缓冲层。 在将III-V缓冲层暴露于VI族元素通量之前,组II和VI族源被操作以将III-V缓冲层暴露于II族元素通量。

    Led Lighting Fixtures
    9.
    发明申请
    Led Lighting Fixtures 有权
    LED照明灯具

    公开(公告)号:US20080273331A1

    公开(公告)日:2008-11-06

    申请号:US12088360

    申请日:2006-09-25

    IPC分类号: F21V29/02 H05B41/36

    摘要: A lighting fixture (20-23) mechanically encloses a LED module (30), which includes at least one LED (40) and can further include a LED driver (50) in electrical communication with the LED(s) (40) to operably provide a LED drive signal to the at least one LED (40), a thermal management system (60) in thermal communication with the LED(s) (40) and the lighting fixture (20-23) to facilitate a heat transfer from the LED(s) (40) to the lighting fixture (20-23), and/or a beam shaper (70) in optical communication with the LED(s) (40) to modify an illumination profile of a radiation beam emitted by the LED(s) (40).

    摘要翻译: 一种照明器具(20-23),其机械地包围LED模块(30),其包括至少一个LED(40),并且还可以包括与所述LED(40)电连通的LED驱动器(50) 向所述至少一个LED(40)提供LED驱动信号,与所述LED(40)和所述照明器具(20-23)热连通的热管理系统(60),以便于从所述LED LED(40)到照明器具(20-23)和/或与LED(40)光学通信的光束整形器(70),以修改由所述LED(...)发射的辐射束的照明轮廓 LED(40)。

    White light source for LCD backlight

    公开(公告)号:US06655825B2

    公开(公告)日:2003-12-02

    申请号:US10034207

    申请日:2001-12-28

    IPC分类号: F21V704

    摘要: A white light is provided for backlighting a liquid crystal display by directing red green and blue light into the first end of a color mixing optical fiber, mixing the red green and blue light in the color mixing fiber to produce white light, and conducting the white light out of the second end of the color mixing fiber to the liquid crystal display. The color mixing optical fiber and sources for generating the red green and blue light may be located remotely from the liquid crystal display, and the white light produced in the color mixing optical fiber coupled to the liquid crystal display by coupling optical fibers, thus simplifying and facilitating construction and operation of the backlighting system, and allowing for more convenient removal of heat remotely from the liquid crystal display.