Semiconductor interconnect structures with narrowed portions, and associated systems and methods

    公开(公告)号:US11676932B2

    公开(公告)日:2023-06-13

    申请号:US16806764

    申请日:2020-03-02

    CPC classification number: H01L24/67 H01L24/06 H01L2924/3512

    Abstract: Semiconductor devices having interconnect structures with narrowed portions configured to mitigate thermomechanical stresses, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor package includes a semiconductor die and a pillar structure coupled to the semiconductor die. The pillar structure can include an end portion away from the semiconductor die, the end portion having a first cross-sectional area. The pillar structure can further include a narrowed portion between the end portion and the semiconductor die, the narrowed portion having a second cross-sectional area less than the first-cross-sectional area of the end portion. A bond material can be coupled to the end portion of the pillar structure.

    THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES

    公开(公告)号:US20240055397A1

    公开(公告)日:2024-02-15

    申请号:US17884484

    申请日:2022-08-09

    Abstract: This document discloses techniques, apparatuses, and systems for providing a semiconductor device assembly with through-substrate connections for recessed semiconductor dies. A semiconductor device assembly is described that includes a substrate having a first cavity and a second cavity. A first connective element is located at a side surface of the first cavity and a second connective element is located at a side surface of the second cavity. The semiconductor device assembly include a first semiconductor die and a second semiconductor die implemented at the first cavity and the second cavity, respectively. The first semiconductor die includes a third connective element at an edge surface of the die. The second semiconductor die includes a fourth connective element at an edge surface of the die. The dies are implemented at the cavities and connected through the connective elements to electrically couple the first die to the second die.

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