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    Composite laminate having an improved cosmetic surface and method of making same
    5.
    发明授权
    Composite laminate having an improved cosmetic surface and method of making same 有权
    具有改善的化妆品表面的复合层压板及其制造方法

    公开(公告)号：US07790637B2

    公开(公告)日：2010-09-07

    申请号：US11932244

    申请日：2007-10-31

    申请人： John DiFonzo ,  Chris Ligtenberg

    发明人： John DiFonzo ,  Chris Ligtenberg

    IPC分类号： B32B27/04 ,  D04H1/00

    CPC分类号： D03D15/02 ,  B29C70/083 ,  B29C70/34 ,  B32B5/022 ,  B32B5/26 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/718 ,  B32B2457/00 ,  D10B2101/12 ,  Y10T428/24124 ,  Y10T428/24132 ,  Y10T428/249921 ,  Y10T442/184 ,  Y10T442/191 ,  Y10T442/198 ,  Y10T442/2984 ,  Y10T442/2992 ,  Y10T442/30

    摘要： A composite laminate includes a plurality of sheets of prepreg stacked one over another, and a scrim layer provided on an exterior surface of the sheets of prepreg. Each prepreg sheet is formed of fibers preimpregnated with resin. The scrim layer and the sheets of prepreg form a composite laminate whereby the scrim layer constitutes an outer, exposed surface of the composite laminate. The scrim layer may be a nonwoven carbon or glass fiber scrim that has absorbed resin from the sheets of prepreg. A method of making a composite laminate includes placing into a mold a scrim and a plurality of sheets of prepreg, with the scrim extending between an exterior surface of the sheets of prepreg and an inner surface of the mold; forming a composite laminate whereby the scrim is adhered to the sheets of prepreg; and removing the composite laminate from the mold. An outer layer of the composite laminate includes the scrim.

    摘要翻译： 复合层叠体包括多个堆叠在一起的预浸料片，以及设置在预浸料片的外表面上的稀松布层。 每个预浸料片材由预先用树脂浸渍的纤维形成。 稀松布层和预浸料片形成复合层压材料，由此稀松布层构成复合层压板的外露面。 稀松布层可以是从预浸料片吸收树脂的非织造碳纤维或玻璃纤维稀松布。 制造复合层压材料的方法包括在模具中放置稀松布和多片预浸料，其中，稀松布在预浸料的片材的外表面和模具的内表面之间延伸; 形成复合层压体，由此将稀松布粘附到预浸料片上; 并从模具中去除复合层压材料。 复合层压材料的外层包括稀松布。

    Thermal control of an electronic device for adapting to ambient conditions
    6.
    发明申请
    Thermal control of an electronic device for adapting to ambient conditions 审中-公开
    用于适应环境条件的电子设备的热控制

    公开(公告)号：US20070027580A1

    公开(公告)日：2007-02-01

    申请号：US11181477

    申请日：2005-07-14

    申请人： Chris Ligtenberg ,  John Difonzo

    发明人： Chris Ligtenberg ,  John Difonzo

    IPC分类号： G05D23/00

    CPC分类号： G05D23/19 ,  G06F1/206 ,  Y02D10/16

    摘要： Systems and techniques for managing operations of an electronic device involve detecting an environmental condition in a vicinity of an electronic device. In response to the detected environmental condition, a thermal management or user interface operation of the electronic device is altered. The thermal management operation can relate, for example, to an operating parameter of a heat-generating or heat-dissipating component. The user interface operation can relate, for example, to a power savings technique.

    摘要翻译： 用于管理电子设备的操作的系统和技术涉及检测电子设备附近的环境状况。 响应于检测到的环境条件，电子设备的热管理或用户界面操作被改变。 热管理操作可以涉及例如发热或散热部件的操作参数。 用户界面操作可以涉及例如功率节省技术。

    SYSTEM FOR COUPLING INTERFACING PARTS
    7.
    发明申请
    SYSTEM FOR COUPLING INTERFACING PARTS 有权
    接头部件联接系统

    公开(公告)号：US20100254111A1

    公开(公告)日：2010-10-07

    申请号：US12817517

    申请日：2010-06-17

    申请人： Chris Ligtenberg ,  John DiFonzo ,  Brett William Degner ,  John Brock

    发明人： Chris Ligtenberg ,  John DiFonzo ,  Brett William Degner ,  John Brock

    IPC分类号： H05K9/00 ,  H05K5/00 ,  H05K13/00

    CPC分类号： H05K5/0017 ,  H01R13/74 ,  Y10T29/49002 ,  Y10T29/49947

    摘要： An electronic device is disclosed. The electronic device includes a first sub assembly having a first housing component. The first housing component has an opening. The electronic device also includes a second sub assembly having a second housing component. The second housing component cooperates with the first housing component to enclose components of an electronic device. The at least one internal component is accessible through the opening. The at least one internal component is also movable relative to the second sub assembly so as to properly align with the opening. The at least one internal component is additionally magnetically attracted towards the first housing component near the opening.

    摘要翻译： 公开了一种电子设备。 电子设备包括具有第一壳体部件的第一子组件。 第一个房屋部件有一个开口。 电子设备还包括具有第二壳体部件的第二子组件。 第二壳体部件与第一壳体部件配合以封闭电子设备的部件。 至少一个内部部件可通过开口接近。 所述至少一个内部部件也可相对于第二子组件移动，以便与开口正确对准。 至少一个内部部件另外在靠近开口处朝向第一壳体部件磁吸引。

    System For Coupling Interfacing Parts
    8.
    发明申请
    System For Coupling Interfacing Parts 有权
    耦合接头部件系统

    公开(公告)号：US20090174990A1

    公开(公告)日：2009-07-09

    申请号：US12239662

    申请日：2008-09-26

    申请人： Chris Ligtenberg ,  John DiFonzo ,  Brett William Degner ,  John Brock

    发明人： Chris Ligtenberg ,  John DiFonzo ,  Brett William Degner ,  John Brock

    IPC分类号： H05K7/00 ,  B23P11/00

    CPC分类号： H05K5/0017 ,  H01R13/74 ,  Y10T29/49002 ,  Y10T29/49947

    摘要： An electronic device is disclosed. The electronic device includes a first subassembly having a first housing component. The first housing component has an opening. The electronic device also includes a second subassembly having a second housing component. The second housing component cooperates with the first housing component to enclose components of an electronic device. The at least one internal component is also movable relative to the second subassembly so as to properly align with the opening. The at least one internal component is additionally magnetically attracted towards the first housing component near the opening.

    摘要翻译： 公开了一种电子设备。 电子设备包括具有第一壳体部件的第一子组件。 第一个房屋部件有一个开口。 电子设备还包括具有第二壳体部件的第二子组件。 第二壳体部件与第一壳体部件配合以封闭电子设备的部件。 所述至少一个内部部件也可相对于第二子组件移动，以便与开口正确对准。 至少一个内部部件另外在靠近开口处朝向第一壳体部件磁吸引。

    ELECTRONIC DEVICE WITH A CERAMIC COMPONENT
    9.
    发明申请
    ELECTRONIC DEVICE WITH A CERAMIC COMPONENT 有权
    具有陶瓷组件的电子设备

    公开(公告)号：US20080291620A1

    公开(公告)日：2008-11-27

    申请号：US11752854

    申请日：2007-05-23

    申请人： John DiFonzo ,  Chris Ligtenberg

    发明人： John DiFonzo ,  Chris Ligtenberg

    IPC分类号： H05K7/00

    CPC分类号： G06F1/1698 ,  G06F1/1613 ,  G06F1/1656 ,  G06F1/1662 ,  G06F1/169

    摘要： An electronic device is disclosed. The electronic device may include a component made of a ceramic material. The electronic device may also include circuitry configured to transmit signals. The signals may pertain to input received through the component.

    摘要翻译： 公开了一种电子设备。 电子设备可以包括由陶瓷材料制成的部件。 电子设备还可以包括被配置为传输信号的电路。 信号可能与通过组件接收的输入有关。

    Method and apparatus for controlling the temperature of electronic device enclosures
    10.
    发明授权
    Method and apparatus for controlling the temperature of electronic device enclosures 有权
    用于控制电子设备外壳温度的方法和装置

    公开(公告)号：US06980418B1

    公开(公告)日：2005-12-27

    申请号：US10899576

    申请日：2004-07-26

    申请人： Mark E. Seeger ,  John DiFonzo ,  Chris Ligtenberg ,  Zachary Zeliff

    发明人： Mark E. Seeger ,  John DiFonzo ,  Chris Ligtenberg ,  Zachary Zeliff

    IPC分类号： G06F1/18 ,  G06F1/20 ,  H05K7/20 ,  H05K5/00

    CPC分类号： G06F1/203 ,  G06F1/182 ,  Y10S174/34 ,  Y10S493/903

    摘要： An electronic device housing comprising a device enclosure with electronic components mounted inside the enclosure is disclosed. Mounted between the electronic device housing and the device enclosure is a thermally reflective electrical insulator configured to reduce external heating of the enclosure by the electronic components contained therein. Such an arrangement reflects heat generated by internal electronic components back inside the device enclosure, thereby reducing the external temperature of the electronic device housing. The electronic device housing, for example, pertains to a portable computer. Additionally, a method for reducing the external temperature of a computer housing for a portable computer is disclosed.

    摘要翻译： 公开了一种电子设备外壳，包括安装在外壳内的电子部件的设备外壳。 安装在电子设备外壳和设备外壳之间的是热反射电绝缘体，其被配置为通过其中包含的电子部件减少外壳的外部加热。 这种布置将内部电子部件产生的热量反射回设备外壳内部，从而降低电子设备外壳的外部温度。 例如，电子设备外壳涉及便携式计算机。 此外，公开了一种用于降低用于便携式计算机的计算机外壳的外部温度的方法。