摘要:
An ETOX cell that has improved injection of electrons from a forward biased deep n-well to p-well junction underneath the channel area of a triple-well ETOX cell during substrate hot electron (SHE) programming. The ETOX cell has a control gate, a floating gate, a deep n-well formed in the substrate, a buried n+ layer in the deep n-well, a p-well formed in the n-well and atop the buried n+ layer, a drain implant formed in the p-well, and a source implant formed in the p-well. The buried n+ layer enhances the parasitic bipolar action between the n+ source/drain (as collector), the p-well (as base), and the buried n+ layer (as emitter). The parasitic transistor amplifies the amount of seed electrons injected into the p-well, which in turn results in significantly faster programming of the ETOX cell.
摘要:
The present disclosure provides a green transistor for nano-Si Ferro-electric random access memory (FeRAM) and method of operating the same. The nano-Si FeRAM includes a plurality of memory cells arranged in an array with bit-lines and word-lines, and each memory cell includes a MOSFET including a gate, a source, a drain, a substrate, and a data storage element formed on the drain spacer of the gate and made of nano-Si in porous SiO2; a word-line connected to the gate; a first bit-line connected to the drain; a second bit-line connected to the source; and an substrate bias supply connected to the substrate, and the gate induced drain leakage current of the MOSFET serves as the read current of the memory cell.
摘要:
A random access memory includes a plurality of memory cells arrayed in bit-lines and word-lines. Each memory cell comprises a green transistor (gFET) including a gate, a source, and a drain; a switching resistor including a first terminal and a second terminal; and a reference resistor including a third terminal and a fourth terminal. The first terminal of the switching resistor and the third terminal is connected to a bit-line, the second terminal of the switching resistor is connected to the first source of the gFET, the fourth terminal of the reference resistor is connected to the second source of the gFET, and the gate of the gFET is connected to a word-line. The method of operating the RRAM includes a write operation and a read operation The write operation comprises steps of: applying a first voltage to the bit-line to perform a large voltage difference across the bit-line and the drain of the gFET, applying a second voltage to the gate of the gFET to turn on the gFET transiently, and a large current pulse flowing through the switching resistor for changing the resistance state. The read operation comprises steps of: applying a third voltage to the bit-line to perform a small voltage difference across the bit-line and the drain of the gFET, applying a second voltage to the word-line to turn on the gFET, and comparing the current through the switching resistor with the current through the reference resistor so as to read the data stored in the memory cell.
摘要:
Leakage of a single-poly EPROM cell is prevented by eliminating field oxide isolating the source, channel, and drain from the control gate n-well, and by replacing field oxide surrounding the cell with a heavily doped surface isolation region. The EPROM cell also utilizes a floating gate having an open-rectangular floating gate portion over the control gate region, and a narrow floating gate portion over the channel and intervening silicon substrate. The surface area of the open-rectangular floating gate portion ensures a high coupling ratio with the control gate region. The small width of the narrow floating gate portion prevents formation of a sizeable leakage path between the n-well and the source, channel, and drain. To conserve surface area, the EPROM cell also eliminates the p+ contact region and the PLDD region in the control gate well of the conventional EPROM design. This is permitted because the VTp implant step is masked, permitting the control gate region to operate in accumulation mode during application of 5V programming voltages.
摘要:
An imaging array having overflow protection and electronic shuttering features is realized without an increase in pixel complexity. Overflow protection is provided by pulsing each row of the imager with a small overflow pulse during the sense amplifier reset phase. An electronic shutter is realized using a modified version of the pixel readout timing. The shutter provides sub-frame exposure by restricting the number of line-times a pixel is allowed to integrate. For a full-frame exposure, each pixel is read out once per frame; during readout of the other rows of the array, the pixel integrates. For subframe exposure, the pixel is continually reset, using a shutter pulse applied to the row lines during sense amplifier reset, until a certain number of rows (line-times) before it is to be read out. The pixel then is allowed to integrate until it is read out normally.
摘要:
An active pixel image cell which includes a photosensor, active devices for control of the sensor and readout of a signal representing the intensity of light to which the sensor is exposed, and a neuron MOSFET transistor which "both amplifies the signal from the photosensor and" simulates the behavior of a human neuron. An integrated neural network and imaging array may be formed by interconnecting a group of such pixels. Digital signal processing algorithms used for image processing may be implemented at the pixel level by appropriate interconnections between the output signals from the photosensor of surrounding pixels and the neuron MOSFET.
摘要:
A technique for decreasing the effective gain of a bipolar phototransistor at high light levels makes the image usable over a greatly extended range of illumination conditions. The effective current gain at high light levels is reduced by fabricating a "non-ideal" emitter, such as by inserting a thin 20 521 tunnel oxide between the emitter and base junction. The tunnel oxide between the emitter and base serves as a variable resistor as well as a good junction for carrier injection from the emitter. The total base voltage is the sum of the oxide voltage and the intrinsic base voltage. At high image intensity, the bipolar phototransistor will gradually enter into the saturation mode, i.e., the base to collector junction is forward biased. The beta is thus reduced. The bias of the collector should be about 0.3-0.8 V higher than the emitter at the 20.ANG. tunnel oxide thickness for optimum operation.
摘要:
The present disclosure provides a green transistor for nano-Si Ferro-electric random access memory (FeRAM) and method of operating the same. The nano-Si FeRAM includes a plurality of memory cells arranged in an array with bit-lines and word-lines, and each memory cell includes a MOSFET including a gate, a source, a drain, a substrate, and a data storage element formed on the drain spacer of the gate and made of nano-Si in porous SiO2; a word-line connected to the gate; a first bit-line connected to the drain; a second bit-line connected to the source; and an substrate bias supply connected to the substrate, and the gate induced drain leakage current of the MOSFET serves as the read current of the memory cell.
摘要:
A method of reading a 2-bit p-channel memory cell having a p+ drain, a p+ source, a control gate, and a floating gate formed from non-connecting hemispherical silicon grain (HSG) islands. The p+ drain and the p+ source is formed in an n-well. The method comprises: applying a positive voltage to the control gate to generate a gate induced drain leakage (GIDL) current; and measuring a drain GIDL current at the drain and a source GIDL current at the source simultaneously to determine the 2-bit data stored in the memory cell.
摘要翻译:一种读取具有p +漏极,p +源极,控制栅极和由非连接半球形硅晶粒(HSG)岛形成的浮置栅极的2位p沟道存储单元的方法。 p +漏极和p +源形成在n阱中。 该方法包括:向控制栅极施加正电压以产生栅极感应漏极泄漏(GIDL)电流; 并同时测量漏极处的漏极GIDL电流和源极上的源极GIDL电流,以确定存储在存储器单元中的2位数据。
摘要:
A current source formed in a p-type substrate is disclose. First, a deep n-well is formed within the p-type substrate and a buried n+ layer is formed within the deep n-well. Next, a p-well is formed within the deep n-well and atop the buried n+ layer. The p-well and deep n-well are then surrounded by an isolation structure that extends from the surface of the substrate to below the level of the p-well. A n+ reference structure is formed within the p-well and a gate is formed above the p-well, the gate separated from the substrate by a thin oxide layer, the gate extending over at least a portion of the n+ reference structure. Finally, a n+ output structure is formed within the p-well. An input reference current is provided to the n+ reference structure and an output current is provided by the n+ output structure.