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    [CHIP PACKAGE STRUCTURE]
    3.
    发明申请
    [CHIP PACKAGE STRUCTURE] 有权
    [芯片包装结构]

    公开(公告)号：US20050001311A1

    公开(公告)日：2005-01-06

    申请号：US10710344

    申请日：2004-07-02

    申请人： Ming-Lun Ho ,  Yu-Wen Chen

    发明人： Ming-Lun Ho ,  Yu-Wen Chen

    IPC分类号： H01L23/31 ,  H01L23/36 ,  H01L23/34 ,  H01L29/40

    CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16195

    摘要： A chip package structure includes a substrate having an upper surface and a lower surface, a chip having an active surface and a back surface, a stiffener, a first heat sink and a second heat sink. The active surface of the chip is attached on the upper surface of the substrate via bumps, so that the chip electrically connects to the substrate. The stiffener is disposed on the upper surface of the substrate and around the chip. The first heat sink is disposed on the back surface of the chip and on the stiffener ring. The second heat sink is disposed on the lower surface of the substrate.

    摘要翻译： 芯片封装结构包括具有上表面和下表面的基板，具有活动表面和后表面的芯片，加强件，第一散热器和第二散热器。 芯片的有源表面经由凸块附着在基板的上表面上，使得芯片电连接至基板。 加强件设置在基板的上表面和芯片周围。 第一散热器设置在芯片的背面和加强环上。 第二散热器设置在基板的下表面上。

    Chip package structure with dual heat sinks
    4.
    发明授权
    Chip package structure with dual heat sinks 有权
    具有双重散热片的芯片封装结构

    公开(公告)号：US07002246B2

    公开(公告)日：2006-02-21

    申请号：US10710344

    申请日：2004-07-02

    申请人： Ming-Lun Ho ,  Yu-Wen Chen

    发明人： Ming-Lun Ho ,  Yu-Wen Chen

    IPC分类号： H01L23/02

    CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16195

    摘要： A chip package structure includes a substrate having an upper surface and a lower surface, a chip having an active surface and a back surface, a stiffener, a first heat sink and a second heat sink. The active surface of the chip is attached on the upper surface of the substrate via bumps, so that the chip electrically connects to the substrate. The stiffener is disposed on the upper surface of the substrate and around the chip. The first heat sink is disposed on the back surface of the chip and on the stiffener ring. The second heat sink is disposed on the lower surface of the substrate.

    摘要翻译： 芯片封装结构包括具有上表面和下表面的基板，具有活动表面和后表面的芯片，加强件，第一散热器和第二散热器。 芯片的有源表面经由凸块附着在基板的上表面上，使得芯片电连接至基板。 加强件设置在基板的上表面和芯片周围。 第一散热器设置在芯片的背面和加强环上。 第二散热器设置在基板的下表面上。

    PROCESS OF CUTTING ELECTRONIC PACKAGE
    5.
    发明申请
    PROCESS OF CUTTING ELECTRONIC PACKAGE 有权
    切割电子包装的过程

    公开(公告)号：US20050148159A1

    公开(公告)日：2005-07-07

    申请号：US10904405

    申请日：2004-11-09

    申请人： Ming-Lun Ho ,  Ming-Chieh Kao

    发明人： Ming-Lun Ho ,  Ming-Chieh Kao

    IPC分类号： H01L21/301 ,  H01L23/32

    CPC分类号： H01L21/481

    摘要： The present invention provides a cutting process for cutting connected electronic package structures. The connected electronic package structures are connected through a mother carrier. Each electronic package structures includes at least an electronic component and a carrier unit, while the mother carrier includes at least a plurality of carrier units and a plurality of cutting regions, each cutting region being disposed between two adjacent carrier units. After forming at least a supporting portion on the first surface of the mother carrier and on a portion of the cutting region of the mother carrier, the mother carrier is positioned to a supportive plane, so that the supporting portion is in contact with the supportive plane. From a second surface of the mother carrier, cutting the mother carrier at the cutting regions, so that the electronic package structures alongside the cutting regions are separated.

    摘要翻译： 本发明提供了切割连接的电子封装结构的切割工艺。 连接的电子封装结构通过母线连接。 每个电子封装结构至少包括电子部件和载体单元，而母体载体包括至少多个载体单元和多个切割区域，每个切割区域设置在两个相邻载体单元之间。 在母体载体的第一表面和母体载体的切割区域的一部分上形成至少一个支撑部分之后，母体载体被定位在支撑平面上，使得支撑部分与支撑平面接触 。 从母体载体的第二表面切割母体载体在切割区域，使得沿着切割区域的电子封装结构被分离。

    Process of cutting electronic package
    9.
    发明授权
    Process of cutting electronic package 有权
    切割电子包装的过程

    公开(公告)号：US07220619B2

    公开(公告)日：2007-05-22

    申请号：US10904405

    申请日：2004-11-09

    申请人： Ming-Lun Ho ,  Ming-Chieh Kao

    发明人： Ming-Lun Ho ,  Ming-Chieh Kao

    IPC分类号： H01L21/44

    CPC分类号： H01L21/481

    摘要： The present invention provides a cutting process for cutting connected electronic package structures. The connected electronic package structures are connected through a mother carrier. Each electronic package structures includes at least an electronic component and a carrier unit, while the mother carrier includes at least a plurality of carrier units and a plurality of cutting regions, each cutting region being disposed between two adjacent carrier units. After forming at least a supporting portion on the first surface of the mother carrier and on a portion of the cutting region of the mother carrier, the mother carrier is positioned to a supportive plane, so that the supporting portion is in contact with the supportive plane. From a second surface of the mother carrier, cutting the mother carrier at the cutting regions, so that the electronic package structures alongside the cutting regions are separated.

    摘要翻译： 本发明提供了切割连接的电子封装结构的切割工艺。 连接的电子封装结构通过母线连接。 每个电子封装结构至少包括电子部件和载体单元，而母体载体包括至少多个载体单元和多个切割区域，每个切割区域设置在两个相邻载体单元之间。 在母体载体的第一表面和母体载体的切割区域的一部分上形成至少一个支撑部分之后，母体载体被定位在支撑平面上，使得支撑部分与支撑平面接触 。 从母体载体的第二表面切割母体载体在切割区域，使得沿着切割区域的电子封装结构被分离。