High-density magnetic bubble memory device
    1.
    发明授权
    High-density magnetic bubble memory device 失效
    高密度磁性气泡记忆装置

    公开(公告)号:US4617644A

    公开(公告)日:1986-10-14

    申请号:US590869

    申请日:1984-03-19

    IPC分类号: G11C11/14 G11C19/08

    CPC分类号: G11C19/08 G11C19/0808

    摘要: A high-density magnetic bubble memory device using magnetic bubbles having a diameter not larger than 2 .mu.m comprises a magnetic layer capable of sustaining the bubbles therein, and a propagation pattern formed in or on a surface of the magnetic layer. In the device, a relation H/d.ltoreq.0.8 is satisfied wherein H is the thickness of the magnetic layer and d the diameter of the bubble. When the propagation pattern is made of a permalloy, h/d (h: bubble height in that case) is not larger than 0.8. When the propagation pattern is formed through ion implantation, h'/d (h': bubble height in that case) is not larger than 0.6.

    摘要翻译: 使用直径不大于2μm的磁性气泡的高密度磁气泡存储装置包括能够保持气泡的磁性层和形成在磁性层的表面上的传播图案。 在该装置中,满足H / d

    4-HYDROXYPHENYLALKYLAMINE DERIVATIVE
    2.
    发明申请
    4-HYDROXYPHENYLALKYLAMINE DERIVATIVE 有权
    4-羟基苯甲酰胺衍生物

    公开(公告)号:US20100280188A1

    公开(公告)日:2010-11-04

    申请号:US12808855

    申请日:2008-12-16

    摘要: The present invention relates to a compound represented by the following general formula (I): wherein R1 and R2 independently represent a monovalent hydrocarbon group; R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; X represents a divalent hydrocarbon group; and R4, R5 and R6 independently represent a monovalent organic group or a group represented by the following general formula (II): in which R7 and R8 independently represent a monovalent hydrocarbon group; and R9 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, with the proviso that R5 and R6 may combine together to form a divalent hydrocarbon group. The aforementioned compounds are useful as a polymerization inhibitor and the like.

    摘要翻译: 本发明涉及由以下通式(I)表示的化合物:其中R1和R2独立地表示一价烃基; R3表示氢原子或碳原子数1〜4的烷基。 X表示二价烃基; 并且R 4,R 5和R 6独立地表示一价有机基团或由以下通式(II)表示的基团:其中R 7和R 8独立地表示一价烃基; 并且R 9表示氢原子或具有1至4个碳原子的烷基,条件是R 5和R 6可以结合在一起形成二价烃基。 上述化合物可用作阻聚剂等。

    Silicon-containing polymer, method of manufacturing thereof, and curable polymer composition
    4.
    发明授权
    Silicon-containing polymer, method of manufacturing thereof, and curable polymer composition 失效
    含硅聚合物,其制造方法和可固化聚合物组合物

    公开(公告)号:US08674037B2

    公开(公告)日:2014-03-18

    申请号:US12988785

    申请日:2009-04-06

    IPC分类号: C08G77/04 C08G77/06 C08L83/05

    CPC分类号: C08L83/14 C08G77/52 C08L83/00

    摘要: A silicon-containing polymer represented by the following average unit formula: (O2/2SiR1-R2-C6H4-R2-SiR1O2/2)x [R3 SiO(4-a)/2]y(R4O1/2)z (wherein R1 designates identical or different, substituted or unsubstituted monovalent hydrocarbon groups; R2 designates identical or different, substituted or unsubstituted alkylene groups; R3 designates substituted or unsubstituted monovalent hydrocarbon groups; R4 designates alkyl groups or hydrogen atoms; ‘a’ is a positive number that satisfies the following condition: 0=a=3; and ‘x’, ‘y’, and ‘z’ are positive numbers that satisfy the following conditions: 0

    摘要翻译: 由以下平均单元式表示的含硅聚合物:(O 2 / 2SiR1-R2-C6H4-R2-SiR1O2 / 2)x [R3SiO(4-a)/ 2] y(R4O1 / 2)z(其中R1 表示相同或不同的取代或未取代的一价烃基; R 2表示相同或不同的取代或未取代的亚烷基; R 3表示取代或未取代的一价烃基; R 4表示烷基或氢原子;'a' 以下条件:0 = a = 3;'x','y'和'z'是满足以下条件的正数:0

    Organosilicon Compound, Method For Producing Thereof, And Curable Silicone Composition Containing The Same
    5.
    发明申请
    Organosilicon Compound, Method For Producing Thereof, And Curable Silicone Composition Containing The Same 有权
    有机硅化合物,其制造方法和含有其的可固化的硅氧烷组合物

    公开(公告)号:US20120309921A1

    公开(公告)日:2012-12-06

    申请号:US13519066

    申请日:2010-12-20

    IPC分类号: C07F7/08 C08G77/20

    摘要: An objective of the present invention is to provide a curable silicone composition of the present invention exhibiting superior adhesive properties with respect to a poor-adhesive resin such as PPS, even if the composition is cured at a relatively low temperature for a short period. The aforementioned objective of the present invention is achieved by a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a hydrosilylation-reaction catalyst, and (D) an acid anhydride having an alkoxy group bonding to a silicon atom or an alkoxyalkoxy group bonding to a silicon atom.

    摘要翻译: 本发明的目的是提供一种本发明的可固化有机硅组合物,即使组合物在相对低的温度下短时间固化,其表现出相对于诸如PPS的不良粘合剂树脂具有优异的粘合性能。 本发明的上述目的通过一种可固化的有机硅组合物实现,该组合物包括:(A)分子中具有至少两个烯基的有机聚硅氧烷,(B)分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷( C)氢化硅烷化反应催化剂,和(D)具有与硅原子键合的烷氧基或与硅原子键合的烷氧基烷氧基的酸酐。

    Hot-Melt Silicone Adhesive
    6.
    发明申请
    Hot-Melt Silicone Adhesive 有权
    热熔硅胶

    公开(公告)号:US20090075009A1

    公开(公告)日:2009-03-19

    申请号:US11909770

    申请日:2006-03-27

    IPC分类号: C08F8/00 B32B33/00

    摘要: A hot-melt silicone adhesive comprising: (A) an organopolysiloxane resin with a softening point in the range of 40 to 250° C.; (B) an organopolysiloxane that at 25° C. is liquid or in the state of a crude rubber, which contains in one molecule at least two alkenyl groups; (C) a composition selected from a mixture of (i) an organopolysiloxane that contains silicon-bonded hydrogen atoms and (ii) an organic silicon compound that contains a silicon-bonded alkoxy group; or (iii) an organopolysiloxane that contains silicon-bonded hydrogen atoms and a silicon-bonded alkoxy group; (D) a hydrosilylation catalyst; and (E) a hydrosilylation-reaction inhibitor, demonstrates good gap-filling ability during thermo-compressive bonding to adherends with high surface roughness, even at low pressures, and that provides strong adhesion to the adherend after cross-linking.

    摘要翻译: 一种热熔性硅氧烷粘合剂,其包含:(A)软化点在40至250℃范围内的有机聚硅氧烷树脂; (B)在25℃下为液体或处于粗橡胶状态的有机聚硅氧烷,其在一个分子中含有至少两个烯基; (C)选自(i)含硅键合的氢原子的有机聚硅氧烷和(ii)含有硅键合的烷氧基的有机硅化合物的混合物的组合物; 或(iii)含硅键合氢原子和与硅键合的烷氧基的有机聚硅氧烷; (D)氢化硅烷化催化剂; 和(E)氢化硅烷化反应抑制剂,即使在低压下也具有高表面粗糙度的被粘物的热压粘合中的良好的间隙填充能力,并且在交联后对被粘物提供强粘附性。

    4-hydroxyphenylalkylamine derivative
    7.
    发明授权
    4-hydroxyphenylalkylamine derivative 有权
    4-羟基苯基烷基胺衍生物

    公开(公告)号:US08624064B2

    公开(公告)日:2014-01-07

    申请号:US12808855

    申请日:2008-12-16

    摘要: The present invention relates to a compound represented by the following general formula (I): wherein R1 and R2 independently represent a monovalent hydrocarbon group; R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; X represents a divalent hydrocarbon group; and R4, R5 and R6 independently represent a monovalent organic group or a group represented by the following general formula (II): in which R7 and R8 independently represent a monovalent hydrocarbon group; and R9 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, with the proviso that R5 and R6 may combine together to form a divalent hydrocarbon group. The aforementioned compounds are useful as a polymerization inhibitor and the like.

    摘要翻译: 本发明涉及由以下通式(I)表示的化合物:其中R1和R2独立地表示一价烃基; R3表示氢原子或碳原子数1〜4的烷基。 X表示二价烃基; 并且R 4,R 5和R 6独立地表示一价有机基团或由以下通式(II)表示的基团:其中R 7和R 8独立地表示一价烃基; 并且R 9表示氢原子或具有1至4个碳原子的烷基,条件是R 5和R 6可以结合在一起形成二价烃基。 上述化合物可用作阻聚剂等。

    Organosilicon compound, method for producing thereof, and curable silicone composition containing the same
    9.
    发明授权
    Organosilicon compound, method for producing thereof, and curable silicone composition containing the same 有权
    有机硅化合物,其制备方法和含有它们的可固化有机硅组合物

    公开(公告)号:US08729195B2

    公开(公告)日:2014-05-20

    申请号:US13519066

    申请日:2010-12-20

    IPC分类号: C08L83/04

    摘要: An objective of the present invention is to provide a curable silicone composition of the present invention exhibiting superior adhesive properties with respect to a poor-adhesive resin such as PPS, even if the composition is cured at a relatively low temperature for a short period. The aforementioned objective of the present invention is achieved by a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a hydrosilylation-reaction catalyst, and (D) an acid anhydride having an alkoxy group bonding to a silicon atom or an alkoxyalkoxy group bonding to a silicon atom.

    摘要翻译: 本发明的目的是提供一种本发明的可固化有机硅组合物,即使组合物在相对低的温度下短时间固化,其表现出相对于诸如PPS的不良粘合剂树脂具有优异的粘合性能。 本发明的上述目的通过一种可固化的有机硅组合物实现,该组合物包括:(A)分子中具有至少两个烯基的有机聚硅氧烷,(B)分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷( C)氢化硅烷化反应催化剂,和(D)具有与硅原子键合的烷氧基或与硅原子键合的烷氧基烷氧基的酸酐。

    Hot-melt silicone adhesive
    10.
    发明授权
    Hot-melt silicone adhesive 有权
    热熔硅胶

    公开(公告)号:US08093333B2

    公开(公告)日:2012-01-10

    申请号:US11909770

    申请日:2006-03-27

    IPC分类号: C08L83/04 B32B33/00

    摘要: A hot-melt silicone adhesive comprising: (A) an organopolysiloxane resin with a softening point in the range of 40 to 250° C.; (B) an organopolysiloxane that at 25° C. is liquid or in the state of a crude rubber, which contains in one molecule at least two alkenyl groups; (C) a composition selected from a mixture of (i) an organopolysiloxane that contains silicon-bonded hydrogen atoms and (ii) an organic silicon compound that contains a silicon-bonded alkoxy group; or (iii) an organopolysiloxane that contains silicon-bonded hydrogen atoms and a silicon-bonded alkoxy group; (D) a hydrosilylation catalyst; and (E) a hydrosilylation-reaction inhibitor, demonstrates good gap-filling ability during thermo-compressive bonding to adherends with high surface roughness, even at low pressures, and that provides strong adhesion to the adherend after cross-linking.

    摘要翻译: 一种热熔性硅氧烷粘合剂,其包含:(A)软化点在40至250℃范围内的有机聚硅氧烷树脂; (B)在25℃下为液体或处于粗橡胶状态的有机聚硅氧烷,其在一个分子中含有至少两个烯基; (C)选自(i)含硅键合的氢原子的有机聚硅氧烷和(ii)含有硅键合的烷氧基的有机硅化合物的混合物的组合物; 或(iii)含硅键合氢原子和与硅键合的烷氧基的有机聚硅氧烷; (D)氢化硅烷化催化剂; 和(E)氢化硅烷化反应抑制剂,即使在低压下也具有高表面粗糙度的被粘物的热压粘合中的良好间隙填充能力,并且在交联后对被粘物提供强粘合性。