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    Heat sink and semiconductor module
    1.
    发明授权
    Heat sink and semiconductor module 有权

    公开(公告)号：US12205867B2

    公开(公告)日：2025-01-21

    申请号：US17626500

    申请日：2019-09-04

    Applicant: Mitsubishi Electric Corporation

    Inventor： Koji Kise ,  Yumi Genda ,  Hiroaki Tatsumi ,  Daisuke Morita

    IPC: H01L23/46 ,  H01L23/473

    Abstract: A heat sink having a coolant flow path formed inside through which a coolant flows includes: a heat transfer plate having a first surface on which a semiconductor device is disposed and a second surface; a junction flow path-forming plate having a third surface and a fourth surface; a first partition wall provided in contact with the second surface and the third surface; and first fins provided in contact with the second surface. The coolant flow path includes a first flow path. A plurality of first divided regions separated by the at least one first partition wall are formed in the first flow path. The plurality of first fins are arranged by being spaced side by side in the first divided regions.

    Laser light source device
    2.
    发明授权
    Laser light source device 有权

    公开(公告)号：US10277011B2

    公开(公告)日：2019-04-30

    申请号：US15506381

    申请日：2015-10-16

    Applicant: MITSUBISHI ELECTRIC CORPORATION

    Inventor： Kazutaka Ikeda ,  Daisuke Morita ,  Motoaki Tamaya

    IPC: H01S5/024 ,  H01S5/40 ,  H01S5/022

    Abstract: Provided is a laser light source device which has a plurality of semiconductor laser elements arranged in an array and is provided with: a heat sink; a sub-mount substrate which is placed on one end edge of the heat sink, which has a power feed path, and on which the semiconductor laser array is mounted; an insulation plate placed in an area other than the sub-mount substrate on the heat sink; a first electrode plate mounted on the insulation plate; a second electrode plate mounted on the insulation plate separately from the first electrode plate; metal wires electrically connecting respectively between the first electrode plate and the sub-mount substrate and between the second electrode plate and the semiconductor laser array; and a cooling block on which the heat sink is mounted and which has a cooling water flow channel inside of the cooling block.

    Laser light source module
    4.
    发明授权
    Laser light source module 有权

    公开(公告)号：US10707643B2

    公开(公告)日：2020-07-07

    申请号：US16375149

    申请日：2019-04-04

    Applicant: MITSUBISHI ELECTRIC CORPORATION

    Inventor： Daisuke Morita ,  Kazutaka Ikeda ,  Motoaki Tamaya

    IPC: H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/40

    Abstract: The purpose of the present invention is to provide a laser light source module that is capable of heat dissipation from a laser device and of suppressing the diffusion of a light beam due to the close arrangement of the laser device. The laser light source module comprises a stem that is a base plate and first and second laser assemblies disposed on the stem. Each of the laser assemblies comprises a multi-emitter LD bar that is a laser device emitting a laser light along an optical axis, and a holding member having a mounting surface parallel to the axis, the multi-emitter LD bar being mounted on the mounting surface. The first and second laser assemblies are positioned such that the optical axes of the assemblies are parallel to each other and that the mounting surfaces of the assemblies are arranged opposite to each other in parallel.

    Laser light source module
    5.
    发明授权
    Laser light source module 有权

    公开(公告)号：US10297975B2

    公开(公告)日：2019-05-21

    申请号：US15758605

    申请日：2015-10-27

    Applicant: MITSUBISHI ELECTRIC CORPORATION

    Inventor： Daisuke Morita ,  Kazutaka Ikeda ,  Motoaki Tamaya

    IPC: H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/40 ,  H01S5/042

    Abstract: The purpose of the present invention is to provide a laser light source module that is capable of heat dissipation from a laser device and of suppressing the diffusion of a light beam due to the close arrangement of the laser device. The laser light source module comprises a stem that is a base plate and first and second laser assemblies disposed on the stem. Each of the laser assemblies comprises a multi-emitter LD bar that is a laser device emitting a laser light along an optical axis, and a holding member having a mounting surface parallel to the axis, the multi-emitter LD bar being mounted on the mounting surface. The first and second laser assemblies are positioned such that the optical axes of the assemblies are parallel to each other and that the mounting surfaces of the assemblies are arranged opposite to each other in parallel.

    SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE
    7.
    发明申请
    SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件的系统

    公开(公告)号：US20160300691A1

    公开(公告)日：2016-10-13

    申请号：US15185166

    申请日：2016-06-17

    Applicant: Mitsubishi Electric Corporation

    Inventor： Daisuke Morita ,  Hiroyuki Kawahara ,  Shinji Kimura

    IPC: H01J37/304 ,  H01S5/343 ,  H01S5/12 ,  H01J37/302 ,  H01S5/00

    CPC classification number: H01J37/304 ,  H01J37/3026 ,  H01J37/3053 ,  H01J37/3056 ,  H01J2237/24585 ,  H01J2237/30472 ,  H01J2237/3174 ,  H01S5/0014 ,  H01S5/0265 ,  H01S5/06256 ,  H01S5/12 ,  H01S5/3054 ,  H01S5/34306 ,  H01S5/34313 ,  H01S5/34326 ,  H01S5/3434 ,  H01S5/4087 ,  H01S2301/173

    Abstract: A semiconductor device manufacturing system includes: a PL evaluation apparatus that evaluates wavelengths of photoluminescent light produced by individual optical modulators on a single semiconductor wafer; an electron beam drawing apparatus that draws patterns of diffraction gratings of laser sections that adjoin respective optical modulators on the wafer; and a calculation section that receives the wavelengths of the photoluminescent light from the PL evaluation apparatus, calculates densities of respective diffraction gratings so that differences between the wavelengths of the photoluminescent light and oscillating wavelengths of the laser sections become a constant, and sends the densities calculated to the electron beam drawing apparatus for drawing respective diffraction grating patterns on the respective laser sections.

    Abstract translation: 半导体器件制造系统包括：PL评估装置，其评估由单个半导体晶片上的各个光学调制器产生的光致发光的波长; 电子束描绘装置，其绘制与晶片上相应的光学调制器相邻的激光部分的衍射光栅的图案; 以及接收来自PL评价装置的光致发光光的波长的计算部，计算各衍射光栅的密度，使得激光部的光致发光光的波长与振荡波长之间的差异成为常数，并发送计算出的密度 涉及用于在相应的激光部分上绘制各个衍射光栅图案的电子束描绘装置。

    Laser diode and method of manufacturing laser diode
    9.
    发明授权
    Laser diode and method of manufacturing laser diode 有权

    公开(公告)号：US10069281B2

    公开(公告)日：2018-09-04

    申请号：US15844686

    申请日：2017-12-18

    Applicant: Mitsubishi Electric Corporation

    Inventor： Kazuhiro Maeda ,  Masafumi Minami ,  Naoki Nakamura ,  Daisuke Morita

    IPC: H01S5/00 ,  H01S5/223 ,  H01S5/227 ,  H01S5/22 ,  H01S5/20

    Abstract: A laser diode includes a ridge portion, channel portions located adjacent to the ridge portion such that the ridge portion is sandwiched, the channel portions being shorter in height than the ridge portion, terrace portions adjacent to opposite sides of the respective channel portions from the ridge portion and longer in height than the channel portions, supporting portions provided over the respective channel portions, separated from side surfaces of the ridge portion or side surfaces of terrace portions or both, and made of resin, a ceiling portion including first portions provided over the supporting portions and second portions continuous with the first portions and located over the respective channel portions with hollow portions interposed therebetween, the ceiling portion being made of resin, and a metal layer provided over the ceiling portion and connected to an upper surface of the ridge portion.

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