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公开(公告)号：US20140291825A1
公开(公告)日：2014-10-02
申请号：US14152796
申请日：2014-01-10
发明人： Rei YONEYAMA , Hiroyuki OKABE , Nobuya NISHIDA , Taichi OBARA
IPC分类号： H01L23/495
CPC分类号： H01L23/4952 , H01L23/49503 , H01L23/49513 , H01L23/49548 , H01L23/49575 , H01L24/32 , H01L24/73 , H01L2224/27013 , H01L2224/32245 , H01L2224/45144 , H01L2224/48137 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2224/83385 , H01L2924/10158 , H01L2924/12042 , H01L2924/181 , H01L2924/351 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device in the preferred embodiment includes: a lead frame comprising a die pad and an electrode terminal; and at least one semiconductor chip bonded to a surface of the die pad, wherein the lead frame excluding a bottom surface thereof and the semiconductor chip are sealed by a sealing resin, and an unevenness is introduced on a bonding interface between the surface of the die pad and the semiconductor chip.
摘要翻译： 优选实施例中的半导体器件包括：引线框架，其包括管芯焊盘和电极端子; 以及至少一个半导体芯片，其结合到所述管芯焊盘的表面，其中除了其底表面之外的所述引线框架和所述半导体芯片被密封树脂密封，并且在所述管芯的表面之间的接合界面处引入不均匀性 垫和半导体芯片。
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公开(公告)号：US20170229952A1
公开(公告)日：2017-08-10
申请号：US15493840
申请日：2017-04-21
发明人： Hiroshi YOSHIDA , Kyoko OYAMA , Yoshikazu TANAKA , Shiori UOTA , Nobuya NISHIDA
IPC分类号： H02M1/08 , H03K17/567 , H02M3/06
CPC分类号： H02M1/08 , H02M3/06 , H02M3/158 , H02M7/537 , H02M7/5387 , H03K17/567 , H03K2217/0036 , Y10T307/609
摘要： A semiconductor device includes: a voltage-dividing resistor circuit including first and second resistors connected in series between a power supply potential and a reference potential and outputting a potential at a point of connection between the first and second resistors; a transient response detection circuit including a third resistor having a first end connected to the power supply potential and a capacitor connected between a second end of the third resistor and the reference potential, and outputting a potential at a point of connection between the third resistor and the capacitor; an AND circuit ANDing an output signal of the voltage-dividing resistor circuit and an output signal of the transient response detection circuit; and an output circuit, wherein switching of the output circuit is controlled by an output signal of the AND circuit.
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公开(公告)号：US20140138706A1
公开(公告)日：2014-05-22
申请号：US13951324
申请日：2013-07-25
发明人： Rei YONEYAMA , Nobuya NISHIDA , Hiroyuki OKABE
IPC分类号： H01L23/495 , H01L23/00
CPC分类号： H01L23/49541 , H01L21/563 , H01L23/053 , H01L23/13 , H01L23/24 , H01L23/3114 , H01L23/3735 , H01L23/49503 , H01L23/4952 , H01L23/49833 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/0603 , H01L2224/06152 , H01L2224/06154 , H01L2224/13013 , H01L2224/131 , H01L2224/1403 , H01L2224/14152 , H01L2224/16238 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/3224 , H01L2224/73203 , H01L2224/73265 , H01L2224/83104 , H01L2224/92125 , H01L2924/15151 , H01L2924/19107 , H01L2924/00012 , H01L2924/00014 , H01L2924/014
摘要： An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.
摘要翻译： 根据本发明的电子电路包括印刷电路板和焊接到印刷电路板上的电子部件。 电子部件是包括暴露于外部的电极片和外部电极端子的扁平封装。 在印刷电路板和电子部件之间设置间隙。 印刷电路板在平面图中在芯片焊盘和外部电极端子之间设置有孔。 该间隙至少部分地在芯片焊盘和外部电极端子之间填充有绝缘树脂。 绝缘树脂通过孔注入。
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公开(公告)号：US20190267912A1
公开(公告)日：2019-08-29
申请号：US16184254
申请日：2018-11-08
发明人： Masaaki ISHINO , Nobuya NISHIDA
IPC分类号： H02M7/5387 , H01L27/06 , H01L23/00
摘要： A three-level I-type inverter includes first to fourth switching devices between first and second potentials, first to fourth diodes, and fifth and sixth diodes. The first to fourth diodes are respectively connected to the first to fourth switching devices in anti-parallel. Between a connection node of the first and second switching devices and a connection node of the third and fourth switching devices, the fifth and sixth diodes are connected in series and in anti-parallel with series connection of the second and third switching devices. A connection node of the fifth and sixth diodes is connected to an input node having intermediate potential. A connection node of the second and third switching devices is connected to an output node. The second switching device and diode are formed of a first reverse conducting IGBT. The third switching device and diode are formed of a second reverse conducting IGBT.
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公开(公告)号：US20180233918A1
公开(公告)日：2018-08-16
申请号：US15865374
申请日：2018-01-09
发明人： Nobuya NISHIDA
CPC分类号： H02J3/385 , F03D7/0284 , G05F1/67 , H01L31/02021 , H02J3/386 , H02M7/003 , H02M7/487 , H02M7/493 , Y02E10/76
摘要： An electric-power converting device having an inverter circuit of a 4-parallel configuration is realized by a combination of four first to third power semiconductor module devices. In each of module device groups, a single unit of the first power semiconductor module device and a single unit of the second power semiconductor module device are mixedly disposed so as to be alternately disposed. Furthermore, the first to third power semiconductor module devices have circuit element groups which have a common point that each circuit element group includes at least one of first and second transistors and first and second diodes.
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6.发明申请公开(公告)号：US20160049358A1
公开(公告)日：2016-02-18
申请号：US14927522
申请日：2015-10-30
发明人： Rei YONEYAMA , Nobuya NISHIDA , Hiroyuki OKABE
IPC分类号： H01L23/495 , H01L23/31
摘要： An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.
摘要翻译： 根据本发明的电子电路包括印刷电路板和焊接到印刷电路板上的电子部件。 电子部件是包括暴露于外部的电极片和外部电极端子的扁平封装。 在印刷电路板和电子部件之间设置间隙。 印刷电路板在平面图中在芯片焊盘和外部电极端子之间设置有孔。 该间隙至少部分地在芯片焊盘和外部电极端子之间填充有绝缘树脂。 绝缘树脂通过孔注入。
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公开(公告)号：US20150115718A1
公开(公告)日：2015-04-30
申请号：US14293326
申请日：2014-06-02
发明人： Hiroshi YOSHIDA , Kyoko OYAMA , Yoshikazu TANAKA , Shiori UOTA , Nobuya NISHIDA
CPC分类号： H02M1/08 , H02M3/06 , H02M3/158 , H02M7/537 , H02M7/5387 , H03K17/567 , H03K2217/0036 , Y10T307/609
摘要： A semiconductor device includes: a voltage-dividing resistor circuit including first and second resistors connected in series between a power supply potential and a reference potential and outputting a potential at a point of connection between the first and second resistors; a transient response detection circuit including a third resistor having a first end connected to the power supply potential and a capacitor connected between a second end of the third resistor and the reference potential, and outputting a potential at a point of connection between the third resistor and the capacitor; an AND circuit ANDing an output signal of the voltage-dividing resistor circuit and an output signal of the transient response detection circuit; and an output circuit, wherein switching of the output circuit is controlled by an output signal of the AND circuit.
摘要翻译： 半导体器件包括：分压电阻器电路，包括串联在电源电位和参考电位之间并在第一和第二电阻器之间的连接点处输出电位的第一和第二电阻器; 一个瞬态响应检测电路，包括具有连接到电源电位的第一端的第三电阻器和连接在第三电阻器的第二端和参考电位之间的电容器，并且在第三电阻器和第三电阻器之间的连接点处输出电位 电容器 AND电路将分压电阻电路的输出信号与瞬态响应检测电路的输出信号进行AND运算; 以及输出电路，其中输出电路的切换由AND电路的输出信号控制。
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