公开(公告)号：US07580151B2

公开(公告)日：2009-08-25

申请号：US10953415

申请日：2004-09-30

申请人： Mitsukazu Kurose ,  Ken Ikuma ,  Takeharu Toguchi ,  Koichi Ishii ,  Koji Yanagisawa

发明人： Mitsukazu Kurose ,  Ken Ikuma ,  Takeharu Toguchi ,  Koichi Ishii ,  Koji Yanagisawa

IPC分类号： G06F3/12 ,  G06F9/28 ,  G06F13/00 ,  H04N1/40 ,  G06K9/46 ,  G06K9/36

CPC分类号： G06F3/1212 ,  G06F3/1215 ,  G06F3/122 ,  G06F3/124 ,  G06F3/1247 ,  G06F3/1285

摘要： When image processing is performed, the present invention increases the speed of processing for an individual scanning line constituting an image, and improves the throughput while suppressing the required memory area. The present invention is an image processor for performing image processing in parallel using a plurality of processors, wherein when an individual scanning line is divided into a plurality of partial areas, at least one of the plurality of processors is allocated to each of the partial areas for at lest one scanning line constituting an image, and image processing is performed in parallel. As a memory area for storing the image processing result, the image processor comprises memory areas for the number of scanning lines, which is less than the number of the plurality of processors.

摘要翻译： 当执行图像处理时，本发明增加了构成图像的单个扫描线的处理速度，并且在抑制所需存储区域的同时提高了吞吐量。 本发明是一种用于使用多个处理器并行执行图像处理的图像处理器，其中当单个扫描线被划分为多个部分区域时，多个处理器中的至少一个被分配给每个部分区域 用于构成图像的一个扫描线，并行地进行图像处理。 作为用于存储图像处理结果的存储区域，图像处理器包括用于扫描线数量的存储区域，其小于多个处理器的数量。

公开(公告)号：US20050168770A1

公开(公告)日：2005-08-04

申请号：US10953415

申请日：2004-09-30

申请人： Mitsukazu Kurose ,  Ken Ikuma ,  Takeharu Toguchi ,  Koichi Ishii ,  Koji Yanagisawa

发明人： Mitsukazu Kurose ,  Ken Ikuma ,  Takeharu Toguchi ,  Koichi Ishii ,  Koji Yanagisawa

IPC分类号： G06F3/12 ,  G06F9/28 ,  G06F13/00

CPC分类号： G06F3/1212 ,  G06F3/1215 ,  G06F3/122 ,  G06F3/124 ,  G06F3/1247 ,  G06F3/1285

摘要： When image processing is performed, the present invention increases the speed of processing for an individual scanning line constituting an image, and improves the throughput while suppressing the required memory area. The present invention is an image processor for performing image processing in parallel using a plurality of processors, wherein when an individual scanning line is divided into a plurality of partial areas, at least one of the plurality of processors is allocated to each of the partial areas for at lest one scanning line constituting an image, and image processing is performed in parallel. As a memory area for storing the image processing result, the image processor comprises memory areas for the number of scanning lines, which is less than the number of the plurality of processors.

摘要翻译： 当执行图像处理时，本发明增加了构成图像的单个扫描线的处理速度，并且在抑制所需存储区域的同时提高了吞吐量。 本发明是一种用于使用多个处理器并行执行图像处理的图像处理器，其中当单个扫描线被划分为多个部分区域时，多个处理器中的至少一个被分配给每个部分区域 用于构成图像的一个扫描线，并行地进行图像处理。 作为用于存储图像处理结果的存储区域，图像处理器包括用于扫描线数量的存储区域，其小于多个处理器的数量。

公开(公告)号：US08415622B2

公开(公告)日：2013-04-09

申请号：US13414941

申请日：2012-03-08

申请人： Kazuhiro Suzuki ,  Hiroto Honda ,  Ikuo Fujiwara ,  Hideyuki Funaki ,  Hitoshi Yagi ,  Keita Sasaki ,  Honam Kwon ,  Koichi Ishii ,  Masako Ogata ,  Risako Ueno

发明人： Kazuhiro Suzuki ,  Hiroto Honda ,  Ikuo Fujiwara ,  Hideyuki Funaki ,  Hitoshi Yagi ,  Keita Sasaki ,  Honam Kwon ,  Koichi Ishii ,  Masako Ogata ,  Risako Ueno

IPC分类号： H01L25/00

CPC分类号： H01L27/14618 ,  G01J5/024 ,  H01L27/1461 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14649 ,  H01L2924/0002 ,  H01L2924/00

摘要： An infrared imaging element according to an embodiment includes: a semiconductor substrate including a stacked structure of a silicon first substrate, and a first insulation film, first cavities being provided on a surface of the first substrate; an infrared detection unit provided in the semiconductor substrate and including, detection cells provided respectively over the first cavities, each of the detection cells having diodes and a second insulation film, the first insulation film converting incident infrared rays to heat, the diodes converting the heat obtained by the first insulation film to an electric signal, a third insulation film having a top face located at a greater distance from the semiconductor substrate as compared with a top face of the second insulation film; and a second substrate provided over the third insulation film. A second cavity is formed between the second substrate and the infrared detection unit.

摘要翻译： 根据实施例的红外成像元件包括：包括硅第一基板的堆叠结构的半导体基板和第一绝缘膜，在第一基板的表面上设置有第一空腔; 红外线检测单元，设置在所述半导体基板中，并且包括分别设置在所述第一空腔上的检测单元，每个所述检测单元具有二极管和第二绝缘膜，所述第一绝缘膜将入射红外线转换成加热， 由所述第一绝缘膜获得的电信号;第三绝缘膜，其具有与所述第二绝缘膜的顶面相比位于距所述半导体基板更远的距离的顶面; 以及设置在所述第三绝缘膜上的第二基板。 在第二基板和红外线检测单元之间形成第二空腔。

公开(公告)号：US20120228497A1

公开(公告)日：2012-09-13

申请号：US13414941

申请日：2012-03-08

申请人： Kazuhiro SUZUKI ,  Hiroto Honda ,  Ikuo Fujiwara ,  Hideyuki Funaki ,  Hitoshi Yagi ,  Keita Sasaki ,  Honam Kwon ,  Koichi Ishii ,  Masako Ogata ,  Risako Ueno

发明人： Kazuhiro SUZUKI ,  Hiroto Honda ,  Ikuo Fujiwara ,  Hideyuki Funaki ,  Hitoshi Yagi ,  Keita Sasaki ,  Honam Kwon ,  Koichi Ishii ,  Masako Ogata ,  Risako Ueno

IPC分类号： H01L27/146

CPC分类号： H01L27/14618 ,  G01J5/024 ,  H01L27/1461 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14649 ,  H01L2924/0002 ,  H01L2924/00

摘要： An infrared imaging element according to an embodiment includes: a semiconductor substrate including a stacked structure of a silicon first substrate, and a first insulation film, first cavities being provided on a surface of the first substrate; an infrared detection unit provided in the semiconductor substrate and including, detection cells provided respectively over the first cavities, each of the detection cells having diodes and a second insulation film, the first insulation film converting incident infrared rays to heat, the diodes converting the heat obtained by the first insulation film to an electric signal, a third insulation film having a top face located at a greater distance from the semiconductor substrate as compared with a top face of the second insulation film; and a second substrate provided over the third insulation film. A second cavity is formed between the second substrate and the infrared detection unit.

摘要翻译： 根据实施例的红外成像元件包括：包括硅第一基板的堆叠结构的半导体基板和第一绝缘膜，在第一基板的表面上设置有第一空腔; 红外线检测单元，设置在所述半导体基板中，并且包括分别设置在所述第一空腔上的检测单元，每个所述检测单元具有二极管和第二绝缘膜，所述第一绝缘膜将入射红外线转换成加热， 由所述第一绝缘膜获得的电信号;第三绝缘膜，其具有与所述第二绝缘膜的顶面相比位于距所述半导体基板更远的距离的顶面; 以及设置在所述第三绝缘膜上的第二基板。 在第二基板和红外线检测单元之间形成第二空腔。

公开(公告)号：US20120228496A1

公开(公告)日：2012-09-13

申请号：US13235388

申请日：2011-09-18

申请人： Masako OGATA ,  Ikuo Fujiwara ,  Hiroto Honda ,  Kazuhiro Suzuki ,  Honam Kwon ,  Risako Ueno ,  Hitoshi Yagi ,  Masaki Atsuta ,  Koichi Ishii ,  Keita Sasaki ,  Hideyuki Funaki

发明人： Masako OGATA ,  Ikuo Fujiwara ,  Hiroto Honda ,  Kazuhiro Suzuki ,  Honam Kwon ,  Risako Ueno ,  Hitoshi Yagi ,  Masaki Atsuta ,  Koichi Ishii ,  Keita Sasaki ,  Hideyuki Funaki

IPC分类号： H01L27/146 ,  H01L31/18

CPC分类号： H01L27/14649 ,  H01L27/14632 ,  H01L27/14687

摘要： An uncooled infrared imaging element includes a pixel region, a device region, and a support substrate. The pixel region includes heat-sensitive pixels. The heat-sensitive pixels are arranged in a matrix and change current-voltage characteristics thereof in accordance with receiving amounts of infrared. The device region includes at least one of a drive circuit and a readout circuit which includes a MOS transistor. The drive circuit drives the heat-sensitive pixels. The readout circuit detects signals of the heat-sensitive pixels. The support substrate is provided with a cavity region to be under pixel region and the MOS transistor.

摘要翻译： 非制冷红外成像元件包括像素区域，器件区域和支撑衬底。 像素区域包括热敏像素。 热敏像素被布置成矩阵并且根据接收到的红外线量来改变其电流 - 电压特性。 器件区域包括驱动电路和包括MOS晶体管的读出电路中的至少一个。 驱动电路驱动热敏像素。 读出电路检测热敏像素的信号。 支撑基板设置有在像素区域下方的空腔区域和MOS晶体管。

公开(公告)号：US20120056291A1

公开(公告)日：2012-03-08

申请号：US13051413

申请日：2011-03-18

申请人： Kazuhiro Suzuki ,  Risako Ueno ,  Honam Kwon ,  Koichi Ishii ,  Hideyuki Funaki

发明人： Kazuhiro Suzuki ,  Risako Ueno ,  Honam Kwon ,  Koichi Ishii ,  Hideyuki Funaki

IPC分类号： H01L27/146 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L27/14649 ,  H01L2224/13

摘要： According to one embodiment, an imaging device includes a substrate, a photodetecting portion, a circuit portion and a through interconnect. The substrate has a first major surface, a second major surface on a side opposite to the first major surface, a recess portion provided on the first major surface and retreated in a first direction going from the first major surface to the second major surface, and a through hole communicating with the first major surface and the second major surface and extending in the first direction. The photodetecting portion is provided above the recess portion and away from the substrate. The circuit portion is electrically connected to the photodetecting portion and provided on the first major surface. The through interconnect is electrically connected to the circuit portion and provided inside the through hole. The recess portion has a first inclined surface. The through hole has a second inclined surface.

摘要翻译： 根据一个实施例，成像装置包括基板，光电检测部分，电路部分和通孔互连。 基板具有第一主表面，与第一主表面相对的一侧的第二主表面，设置在第一主表面上并沿着从第一主表面到第二主表面的第一方向退回的凹部，以及 与所述第一主表面和所述第二主表面连通并且沿所述第一方向延伸的通孔。 光电检测部分设置在凹部的上方并远离基板。 电路部分电连接到光电检测部分并设置在第一主表面上。 通孔互连电连接到电路部分并设置在通孔的内部。 凹部具有第一倾斜面。 通孔具有第二倾斜面。

公开(公告)号：US07648813B2

公开(公告)日：2010-01-19

申请号：US12268699

申请日：2008-11-11

申请人： Mitsunaga Saito ,  Yasushi Shinjiyo ,  Yoshihiro Tajima ,  Koichi Ishii ,  Masahiro Hosoya ,  Ken Takahashi

发明人： Mitsunaga Saito ,  Yasushi Shinjiyo ,  Yoshihiro Tajima ,  Koichi Ishii ,  Masahiro Hosoya ,  Ken Takahashi

IPC分类号： G03G13/045

CPC分类号： G02B5/201 ,  H05K3/207 ,  H05K2203/0113 ,  H05K2203/105 ,  H05K2203/1142

摘要： By using an intaglio plate for holding a pattern formed by a developing agent, a transfer device for transferring patterns developed on the intaglio plate to a transfer object medium, and a baking chamber for eliminating an electrode layer after transfer or heightening resistance thereof, the patterns developed on the intaglio plate are transferred onto the electrode layer disposed at the opposite side of the transfer object medium, and then heated in the baking chamber, whereby the electrode layer is eliminated or heightened in resistance.

摘要翻译： 通过使用用于保持由显影剂形成的图案的凹版，用于将在凹版上显影的图案转印到转印体介质上的转印装置，以及用于在转印或增强电阻之后消除电极层的烘烤室， 在凹版上显影的图案转印到设置在转印体介质相反侧的电极层上，然后在烘烤室中加热，从而电极层被消除或提高。

公开(公告)号：US07646578B2

公开(公告)日：2010-01-12

申请号：US11785211

申请日：2007-04-16

申请人： Yuji Terada ,  Dai Matsuoka ,  Koichi Ishii

发明人： Yuji Terada ,  Dai Matsuoka ,  Koichi Ishii

IPC分类号： H02H1/00 ,  H02H3/22

CPC分类号： H03H7/0107 ,  H03H2001/0085

摘要： A filter circuit has first and second varistors, a resistance, an input terminal, an output terminal, and a ground terminal. The resistance is connected between the first and second varistors. The input terminal is connected to a junction between the first varistor and resistance through a first coil. The output terminal is connected to a junction between the second varistor and resistance through a second coil. The ground terminal is connected to a side of the first varistor opposite from the resistance and a side of the second varistor opposite from the resistance.

摘要翻译： 滤波器电路具有第一和第二变阻器，电阻，输入端子，输出端子和接地端子。 电阻连接在第一和第二变阻器之间。 输入端子通过第一线圈连接到第一变阻器和电阻之间的接点。 输出端子通过第二线圈连接到第二压敏电阻和电阻之间的结。 接地端子与第一变阻器的与电阻相反的一侧连接，第二变阻器的与电阻相反的一侧连接。

公开(公告)号：US07194229B2

公开(公告)日：2007-03-20

申请号：US11234089

申请日：2005-09-26

申请人： Koichi Ishii

发明人： Koichi Ishii

IPC分类号： G03G15/10

CPC分类号： G03G15/11 ,  G03G15/0157 ,  G03G15/0173 ,  G03G2215/018 ,  G03G2215/0187 ,  G03G2221/0036 ,  G03G2221/0063

摘要： When superimposing toner images of a plurality of colors on an image supporting member to form a color image, a free phase ion in a precedent image is removed without distorting the toner image precedently formed on the image supporting member, thereby improving reproducibility of image dots of the toner images having second and subsequent colors to obtain a high-definition color image with high contrast.

摘要翻译： 当将多种颜色的调色剂图像叠加在图像支持构件上以形成彩色图像时，去除先前图像中的自由相离子而不使先前形成在图像支持构件上的调色剂图像变形，从而提高图像点的再现性 调色剂图像具有第二颜色和随后的颜色，以获得具有高对比度的高分辨率彩色图像。

公开(公告)号：US06878811B1

公开(公告)日：2005-04-12

申请号：US09673245

申请日：1999-01-13

申请人： Naoyuki Fukuchi ,  Fumie Futaki ,  Morikazu Kito ,  Koichi Ishii ,  Akiko Tanaka

发明人： Naoyuki Fukuchi ,  Fumie Futaki ,  Morikazu Kito ,  Koichi Ishii ,  Akiko Tanaka

IPC分类号： C07K14/705 ,  C07K14/755 ,  G01N33/86 ,  C12P21/08 ,  G01N33/53

CPC分类号： C07K14/705 ,  C07K14/755 ,  C07K2317/52 ,  C07K2319/00 ,  C07K2319/30 ,  G01N33/86 ,  G01N2333/755

摘要： A method for conveniently detecting binding between the von Willebrand factor and glycoprotein Ib and a means to be used therein. The von Willebrand factor fixed in a reactor immobilized in a reaction vessel in the presence of bottrocetin is bound to a chimeric protein constructed by fusing the carboxyl terminal of a partial protein containing the von Willebrand factor-binding site of glycoprotein Ib with the amino terminal of the Fc region of an immunoglobulin molecule. Then the Fc region of the above immunoglobulin molecule is detected to thereby detect the binding between the von Willebrand factor and the glycoprotein Ib or inhibition of this binding.

摘要翻译： 一种方便检测血管性血友病因子与糖蛋白Ⅰb之间的结合的方法及其中使用的方法。 固定在反应容器中的存在于布可菌素的反应器中的血管性血友病因子结合于通过将含有糖蛋白1b的血管性血友病变因子结合位点的部分蛋白的羧基末端与羧基末端相连的氨基末端 免疫球蛋白分子的Fc区。 然后检测上述免疫球蛋白分子的Fc区，从而检测血管性血友病因子与糖蛋白Ib之间的结合或抑制该结合。