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24 条记录 (耗时 0.037 秒)

    Polymer composite material and process for preparing the same
    5.
    发明授权
    Polymer composite material and process for preparing the same 有权
    聚合物复合材料及其制备方法

    公开(公告)号：US06472460B1

    公开(公告)日：2002-10-29

    申请号：US09424240

    申请日：1999-11-29

    申请人： Hirotaka Okamoto ,  Makoto Kato ,  Naoki Hasegawa ,  Arimitsu Usuki ,  Norio Sato

    发明人： Hirotaka Okamoto ,  Makoto Kato ,  Naoki Hasegawa ,  Arimitsu Usuki ,  Norio Sato

    IPC分类号： C08L334

    CPC分类号： B29C47/402 ,  B29B7/48 ,  B29C47/0004 ,  B29C47/0009 ,  B29C47/38 ,  C08K9/04

    摘要： Polymeric composites may be produced by a process comprising melt-kneading an organophilic clay and a polymer at an average reduced pressure of at 5×104 Pa, a maximum reduced pressure of at least 1×105 Pa, and a total shear strain between 105 and 107, and/or a total shear energy per unit volume falling between 1010 and 1014 Pa. Polymeric composites produced under these conditions may have 50% or more of the entire layers of the layered organophilic clay dispersed as monolayers.

    摘要翻译： 聚合物复合材料可以通过包括以5×10 4 Pa的平均减压，至少1×10 5 Pa的最大减压和105和107之间的总剪切应变熔融捏合有机粘土和聚合物的方法和/ 或每单位体积的总剪切能量落在1010和1014Pa之间。在这些条件下生产的聚合物复合材料可以具有分层的亲有机粘土的整个层的50％或更多分散为单层。

    Polylactic acid composition
    8.
    发明授权
    Polylactic acid composition 失效
    聚乳酸组成

    公开(公告)号：US07585910B2

    公开(公告)日：2009-09-08

    申请号：US11387964

    申请日：2006-03-24

    申请人： Hirotaka Okamoto ,  Yoshihide Katagiri ,  Mitsuru Nakano ,  Arimitsu Usuki

    发明人： Hirotaka Okamoto ,  Yoshihide Katagiri ,  Mitsuru Nakano ,  Arimitsu Usuki

    IPC分类号： B60C1/00

    CPC分类号： C08K5/10 ,  C08L67/04

    摘要： A polylactic acid composition containing polylactic acid and ester-based plasticizer, wherein a content of the ester-based plasticizer is 16 to 33 wt %, and when the composition is highly deformed by stress loading as the relation between the stress and the deformation deviates from linear viscoelastic behavior and thereafter the stress is released, residual deformation measured after the stress is released is not less than 66.0% after 0.2 minute of the stress release, and is not more than 34.0% after 240 hours of the stress release.

    摘要翻译： 含有聚乳酸和酯系增塑剂的聚乳酸组合物，其中酯类增塑剂的含量为16〜33重量％，当应力负荷与组合物的应力与变形之间的关系偏离时，组合物高度变形 线性粘弹性行为，然后释放应力，应力释放后测得的残余变形在应力释放0.2分钟后不低于66.0％，应力释放240小时后不大于34.0％。

    Electronic component, method of sealing electronic component with resin, and apparatus therefor
    10.
    发明授权
    Electronic component, method of sealing electronic component with resin, and apparatus therefor 失效
    电子部件，用树脂密封电子部件的方法及其装置

    公开(公告)号：US06438826B2

    公开(公告)日：2002-08-27

    申请号：US09777787

    申请日：2001-02-05

    申请人： Shinji Takase ,  Hirotaka Okamoto ,  Michio Osada ,  Kouichi Araki

    发明人： Shinji Takase ,  Hirotaka Okamoto ,  Michio Osada ,  Kouichi Araki

    IPC分类号： H05K1300

    CPC分类号： H01L21/565 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/18161 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49171 ,  H01L2924/00

    摘要： A resin seal apparatus includes a movable bottom die vertically moved by an elevator mechanism, a transport mechanism horizontally moving the movable bottom die having placed thereon a printed circuit board with a semiconductor chip mounted thereon, an intermediate die abutting against a periphery of the printed circuit board when the movable bottom die is moved upward, a film of resin stretched by a film stretch mechanism over the intermediate die and the printed circuit board, a die for a chip, pressing a back surface of the semiconductor chip via the film of resin, and a top die pressing a top surface of the intermediate die via the film of resin. This apparatus allows a PCB with a semiconductor chip mounted thereon in the form of a flip chip to be sealed with resin in a reduced period of time to fabricate an electronic component.

    摘要翻译： 树脂密封装置包括通过电梯机构垂直移动的可移动底部模具，水平移动其上安装有半导体芯片的印刷电路板上的可移动底模的运送机构，邻接印刷电路的周边的中间模具 当可移动底模向上移动时，通过膜拉伸机构在中间模和印刷电路板上延伸的树脂膜，用于芯片的模具，通过树脂膜挤压半导体芯片的背表面， 以及通过树脂膜压制中间模具的顶表面的顶模。 该装置允许其中安装有半导体芯片的PCB以倒装芯片的形式在减少的时间周期内用树脂密封以制造电子部件。