摘要:
According to one embodiment, a resistance-change memory includes bit lines, word lines, a memory cell array including memory cells arranged at intersections between the bit lines and the word lines, each of the memory cells including a variable-resistance element and a diode, a control circuit configured to apply a reverse bias to the diode, and to write data to a selected memory cell, and a current limiting circuit configured to limit a current flowing to the selected memory cell in a write. The current limiting circuit controls the current flowing to the selected memory cell not to exceed a second compliance current obtained by adding a leakage current from an unselected memory cell to a predetermined first compliance current.
摘要:
According to one embodiment, a resistance-change memory includes bit lines, word lines, a memory cell array including memory cells arranged at intersections between the bit lines and the word lines, each of the memory cells including a variable-resistance element and a diode, a control circuit configured to apply a reverse bias to the diode, and to write data to a selected memory cell, and a current limiting circuit configured to limit a current flowing to the selected memory cell in a write. The current limiting circuit controls the current flowing to the selected memory cell not to exceed a second compliance current obtained by adding a leakage current from an unselected memory cell to a predetermined first compliance current.
摘要:
A semiconductor storage device comprises information memory cells into which data can be written or from which data can be read; a memory cell array including the information memory cells arranged in a matrix; information word lines connected to the information memory cells in rows of the memory cell array; information bit lines connected to the information memory cells in columns of the memory cell array; a reference memory cell storing a single kind of digital data to generate a reference potential used to discriminate data stored in the information memory cells; a reference bit line connected to the reference memory cell; and sense amplifiers connected to the information bit lines and the reference bit line.
摘要:
A semiconductor storage device includes memory cells having a floating body region and storing data by accumulating or releasing electric charges in or from the floating body region; a memory cell array including a matrix arrangement of the memory cells; a plurality of word lines each connected to the memory cells of each row in the memory cell array; and a counter cell array including counter cells each provided in correspondence to each word line to store occurrences of activation of the word line to read out data from the memory cells.
摘要:
A read block is constituted of a plurality of TMR elements arranged in a lateral direction. One end of each of the TMR elements in the read block is connected in common, and connected to a source line via a read select switch. The other ends of TMR elements are independently connected to read bit lines/write word lines. The read bit lines/write word lines are connected to common data lines via a row select switch. The common data lines are connected to a read circuit.
摘要:
A nonvolatile semiconductor memory device according to an embodiment of the present invention includes: a memory cell array having a plurality of memory cells arranged therein, each of the memory cells having a charge storage layer and a control electrode; and a control unit configured to execute a write cycle multiple times, the write cycle including a write operation and a write verify operation, the write operation being an operation for applying a write pulse voltage multiple times to the control electrode selected for data write, and the write verify operation being an operation for determining whether data write is completed or not. During one time of the write operation, the control unit makes a voltage value of a finally applied write pulse voltage larger than a voltage value of an initially applied write pulse voltage.
摘要:
A semiconductor memory device has memory cells each of which has a MIS type of transistor capable of setting one of two kinds of threshold potentials, reference cells used for determining data stored in the memory cells, which have the same size, shape and electrical properties as those of the memory cells, word lines connected to gates of the memory cells, reference word lines connected to gates of the reference cells, source line contacts connected to sources of the memory cells and the reference cells, and bit line contacts connected to drains of the memory cells and the reference cells, arrangement order of the source line contact, the word line and bit line contact connected to each of the memory cells is equal to arrangement order of the source line contact, the reference word line and the bit line contact connected to the reference cell corresponding to the memory cell.
摘要:
A semiconductor memory device includes memory cell arrays, word lines, sub-sense lines, main sense line, row decoders, column decoders, first switch elements, read circuit, and write circuit. Each memory cell array has a matrix of memory cells including magnetoresistive elements. Each magnetoresistive element has first and second magnetic layers and a first insulating layer formed between the first and second magnetic layers. The word line is connected to the first magnetic layers on each row. The sub-sense line is connected to the second magnetic layers on each column. The main sense line is connected to each sub-sense line. The row decoder and column decoder select a word line and sub-sense line. The first switch element connects the sub-sense line selected by the column decoder to the main sense line. The read circuit reads out data from a memory cell. The write circuit writes data in a memory cell.
摘要:
A semiconductor storage device comprises memory cells that store data by accumulating or releasing an electric charge; a memory cell array having a matrix arrangement of the memory cells; a plurality of word lines connected to memory cells aligned on rows of the memory cell array; a plurality of sub-bit lines connected to memory cells aligned on columns of the memory cell array; a bit line select circuit selecting the sub-bit line of a column; a main bit line connected to the sub-bit line selected by the bit line select circuit; a sense line detecting the potential of the sub-bit line selected by the bit line select circuit via the main bit line and reading data out of the memory cell; a write driver applying a voltage to the sub-bit line selected by the bit line select circuit via the main bit line and writing data into the memory cell; and a first switching element connected to the main bit line and turning on when the current flowing in the memory cell is detected externally via the sub-bit line without the use of the sense line or when a voltage is applied to the memory cell externally via the sub-bit line without the use of the write driver.
摘要:
A memory cell comprises a magneto-resistive element of which electrical resistance value varies with magnetism. A sub-bit line is connected to one end of the memory cell. A main-bit line is connected to the sub-bit line via a first selection circuit. A sense-amplifier is connected to the main-bit line via a second selection circuit. A wiring line is connected to the other end of the memory cell and arranged in a first direction. A first operation circuit is connected to one end of the wiring line via a third selection circuit. A second operation circuit is connected to the other end of the wiring line. A word line passes over an intersection between the memory cell and the wiring line and is arranged in a second direction perpendicular to the first direction.