公开(公告)号：US20060021369A1

公开(公告)日：2006-02-02

申请号：US11154509

申请日：2005-06-17

申请人： Moon Kim ,  Jin Cho ,  Chi Kim

发明人： Moon Kim ,  Jin Cho ,  Chi Kim

IPC分类号： F25D23/12 ,  F25D17/06

CPC分类号： F24F1/027 ,  F24F13/24

摘要： An air conditioner is disclosed, which is suitable for improving its configuration and facilitating its assembly. The present invention includes a cabinet via which air is sucked or blown, a shroud guiding an air flow within the cabinet, a motor provided within the cabinet to forcibly circulate the air within the cabinet, an air guide penetrated by a rotational shaft of the motor, and a motor mounter coupled to the shroud to securely mount the motor thereon. Accordingly, the assembly configuration is simple and the corresponding assembly process is convenient, the vibration of the motor can be minimized, the assembly is facilitated, and the migration of the cold or hot air can be securely cut off.

摘要翻译： 公开了一种适于改进其构造并便于其组装的空调。 本发明包括：空气被吸入或吹出的机壳，引导机壳内的空气流的罩，设置在机柜内的电动机，以强制地将空气循环在机壳内;空气引导件，其由马达的旋转轴 以及连接到护罩的马达安装器，以将马达牢固地安装在其上。 因此，组装构造简单，相应的组装工艺方便，可以最小化电动机的振动，便于组装，并且可以可靠地切断冷或热空气的迁移。

公开(公告)号：US20050142988A1

公开(公告)日：2005-06-30

申请号：US10879030

申请日：2004-06-30

申请人： Chang Kim ,  Chi Kim ,  Tae Lee ,  Hi Kang

发明人： Chang Kim ,  Chi Kim ,  Tae Lee ,  Hi Kang

IPC分类号： H01L21/304 ,  B24B37/04 ,  B24B49/00 ,  B24B1/00

CPC分类号： B24B37/042

摘要： A CMP process using a slurry containing an abrasive of low concentration is disclosed. More specifically, a planarization process is performed using the slurry containing an abrasive of low concentration of less than 0.1 wt % unlike the conventional CMP slurry, thereby improving uniformity of a CMP process in a manufacture process of a semiconductor device to secure yield and reliability of the device. Particularly, since the disclosed slurry has the more excellent effect of achieving the planarization degree than that of the conventional slurry, the thickness of deposited films before the CMP process can be reduced, and the CMP amount can also be minimized.

摘要翻译： 公开了使用含有低浓度磨料的浆料的CMP方法。 更具体地，使用含有少于0.1重量％的低浓度的研磨剂的浆料进行平坦化处理，这与传统的CMP浆料不同，从而提高半导体器件的制造过程中的CMP工艺的均匀性，以确保半导体器件的成品率和可靠性 装置。 特别地，由于所公开的浆料具有比常规浆料获得更好的平坦化度的优异效果，所以可以减少在CMP工艺之前的沉积膜的厚度，并且还可以使CMP量最小化。

公开(公告)号：US20060278084A1

公开(公告)日：2006-12-14

申请号：US11450314

申请日：2006-06-12

申请人： Chi Kim

发明人： Chi Kim

IPC分类号： B01D53/02 ,  F25D17/06 ,  F25D21/00

CPC分类号： F24F3/1423 ,  B01D53/261 ,  B01D53/265 ,  F24F13/222 ,  F24F2203/1012 ,  F24F2203/1032 ,  F24F2203/1056 ,  F24F2203/1068 ,  F24F2203/1084

摘要： The present invention relates to a dehumidifier for improving dehumidifying efficiency, and discharging dehumidified water to an outside of the dehumidifier easily. The dehumidifier includes a case, an inlet passed through the case for introduction of air from an outside of the case to an inside of the case, an outlet formed to pass through a top of the case for discharging air dehumidified in the case to the outside of the case, a desiccant assembly for absorbing moisture from air drawn into the case, a blower assembly for drawing air through the inlets and blowing the air to the outlet, a regenerator assembly for blowing hot air to the desiccant assembly for drying the desiccant assembly, a heat exchanger for condensing high temperature, humid air blown by the regenerator assembly through the desiccant assembly, to separate the moisture from the air, a water tank mounted so as to be able to placed in, or taking out of the case, for receiving, and holding water condensed at the heat exchanger, and a water amount display unit for visible indication of a water level of the water tank to an outside of the case.

摘要翻译： 本发明涉及一种用于提高除湿效率的除湿器，并且将除湿水容易地排出到除湿器的外部。 除湿器包括壳体，通过壳体的入口，用于将空气从壳体的外部引入到壳体的内部，出口形成为穿过壳体的顶部，用于将外壳中除湿的空气排出到外部 一种用于从吸入壳体的空气吸收水分的干燥剂组件，用于通过入口抽吸空气并将空气吹送到出口的鼓风机组件，用于将热空气吹送到干燥剂组件以将干燥剂组件干燥的再生器组件 ，用于冷凝由再生器组件通过干燥剂组件吹送的高温，潮湿空气的热交换器，以将空气中的水分分离;水箱，其安装成能够放置在壳体中或从壳体中取出， 接收和保持在热交换器处冷凝的水;以及水量显示单元，用于将水箱的水位可见地指示到壳体的外部。

公开(公告)号：US20060023779A1

公开(公告)日：2006-02-02

申请号：US11189879

申请日：2005-07-27

申请人： Myoung Kwak ,  Duck Chang ,  Ji Kim ,  Chi Kim ,  Hyun Kim ,  Jae Park ,  Jong Shin

发明人： Myoung Kwak ,  Duck Chang ,  Ji Kim ,  Chi Kim ,  Hyun Kim ,  Jae Park ,  Jong Shin

IPC分类号： H03H7/30

CPC分类号： H04L25/03885

摘要： An equalizer may include an equalizer circuit and a controller. The equalizer circuit may generate an equalized signal based on a control code and input data. The controller may generate the control code based on a transition information signal having information on a number of data transitions in each clock period between multi-phase clocks.

摘要翻译： 均衡器可以包括均衡器电路和控制器。 均衡器电路可以基于控制代码和输入数据生成均衡信号。 控制器可以基于具有关于在多个时钟之间的每个时钟周期内的数据转换的数量的信息的转换信息信号来产生控制代码。

公开(公告)号：US20080024178A1

公开(公告)日：2008-01-31

申请号：US11880492

申请日：2007-07-23

申请人： Chi Kim ,  Ji Young Kim ,  Myoung Kwak ,  Jong Shin ,  Seung Yang ,  Hyun-Goo Kim ,  Jae Park

发明人： Chi Kim ,  Ji Young Kim ,  Myoung Kwak ,  Jong Shin ,  Seung Yang ,  Hyun-Goo Kim ,  Jae Park

IPC分类号： H03K3/00

CPC分类号： H03K19/0016 ,  H03K19/018528 ,  H04L25/0276 ,  H04L25/028

摘要： A transmission line driver and a serial interface data transmission device including the same are provided. The transmission line driver includes a pre-driver configured to generate and output differential input data signals based on a serial transmission data signal, a differential amplifier configured to receive the differential input data signals and to output differential output data signals, and a common mode controller configured to drive the differential output data signals to a predetermined common mode voltage in an idle mode. Accordingly, power consumption can be reduced and a common mode specification can be supported.

摘要翻译： 提供一种传输线驱动器和包括其的串行接口数据传输装置。 传输线驱动器包括：预驱动器，被配置为基于串行传输数据信号产生和输出差分输入数据信号;差分放大器，被配置为接收差分输入数据信号并输出​​差分输出数据信号;以及共模控制器 被配置为在空闲模式下将差分输出数据信号驱动到预定的共模电压。 因此，可以降低功耗并且可以支持共模规范。

公开(公告)号：US20060023483A1

公开(公告)日：2006-02-02

申请号：US11186691

申请日：2005-07-21

申请人： Jae-Young Lee ,  Chi Kim ,  Sung-Min Seo

发明人： Jae-Young Lee ,  Chi Kim ,  Sung-Min Seo

IPC分类号： G11C5/02

CPC分类号： G11C7/10 ,  G11C7/18

摘要： Semiconductor memory devices include a memory cell array region having a plurality of memory cells, a local data I/O line pair that is electrically connected to the plurality of memory cells, a local sense amplifier that is electrically connected to the local data I/O line pair, a read global data I/O line pair that is electrically connected to the local sense amplifier and that is configured to transmit data during a read operation and a write global data I/O line pair that is electrically connected to the local sense amplifier that is configured to transmit data during a write operation.

摘要翻译： 半导体存储器件包括具有多个存储器单元的存储单元阵列区域，电连接到多个存储单元的本地数据I / O线对，与本地数据I / O电连接的本地读出放大器 线对，读取的全局数据I / O线对，其被电连接到本地读出放大器，并且被配置为在读取操作期间传输数据，并且写入全局数据I / O线对被电连接到本地感测 配置为在写入操作期间传输数据的放大器。

公开(公告)号：US20050196965A1

公开(公告)日：2005-09-08

申请号：US11006187

申请日：2004-12-07

申请人： Chang Kim ,  Chi Kim ,  Hi Kang ,  Tae Lee ,  Kwang Park

发明人： Chang Kim ,  Chi Kim ,  Hi Kang ,  Tae Lee ,  Kwang Park

IPC分类号： H01L21/306 ,  H01L21/302 ,  H01L21/336 ,  H01L21/461 ,  H01L21/4763

CPC分类号： H01L21/3212 ,  H01L21/31053 ,  H01L21/7684 ,  H01L21/76895

摘要： The disclosure relates to a method for manufacturing a semiconductor device by performing a planarization process including a first CMP process using a slurry including 0.05˜0.5 wt % CeO2 o r MnO2 as an abrasive and a second CMP process using a slurry including SiO2 as the other abrasive regardless of order of the processes. The CMP process is performed using the first slurry having a high polishing speed in the middle of the wafer and the second slurry having a high polishing speed at the edge of the wafer, thereby decreasing the processing cost and securing the process margin to secure yield and reliability of devices

摘要翻译： 本公开涉及一种通过执行包括使用包含0.05〜0.5重量％的CeO 2或MnO 2作为研磨剂的浆料的第一CMP工艺的平坦化工艺和使用包含SiO 2作为其它研磨剂的浆料的第二CMP工艺来制造半导体器件的方法 不管进程的顺序。 使用在晶片中间具有高抛光速度的第一浆料和在晶片边缘具有高抛光速度的第二浆料进行CMP处理，从而降低加工成本并确保加工余量以确保产量和 设备的可靠性

公开(公告)号：US20050188772A1

公开(公告)日：2005-09-01

申请号：US11024869

申请日：2004-12-28

申请人： Kyung Lee ,  Chi Kim

发明人： Kyung Lee ,  Chi Kim

IPC分类号： G01L1/22 ,  G01N3/00 ,  G01N3/06 ,  G01N19/08

CPC分类号： G01N19/08 ,  G01N2203/0053 ,  G01N2203/0062 ,  G01N2203/0623

摘要： Using a strain gauge attached at an interior side of a cylinder bore at a siamese region, a plurality of output values of the strain gauge can be detected during partially cutting the cylinder bore and residual stress of the siamese region can be calculated based on the plurality of the output values.

摘要翻译： 使用连接在暹罗区域的气缸孔的内侧的应变计，可以在部分切割气缸孔期间检测应变计的多个输出值，并且可以基于多个轴线计算暹罗区域的残余应力 的输出值。